Polishing machine for metal
Description
The reflections shown in reproductions
The broken lines shown in the drawings and the elements contained within the faded regions they define, depict portions of the polishing machine for metal in which the design is embodied that form no part of the claimed design.
Claims
The ornamental design for a polishing machine for metal, as shown and described.
Referenced Cited
U.S. Patent Documents
Other references
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- SOHO.com, “CMP chemical mechanical polishing | Localization enters the stage of heavy volume from 1 to 10”, (published Jul. 11, 2022), SOHU.com website, URL:<https://www.sohu.com/a/566150640_121405769> (Year: 2022).
Patent History
Patent number: D1018613
Type: Grant
Filed: Oct 19, 2022
Date of Patent: Mar 19, 2024
Inventors: Mingkang Huang (Zhejiang), Zhipeng Zhou (Zhejiang)
Primary Examiner: Calvin E Vansant
Assistant Examiner: Mark T. Philipps
Application Number: 35/516,062
Type: Grant
Filed: Oct 19, 2022
Date of Patent: Mar 19, 2024
Inventors: Mingkang Huang (Zhejiang), Zhipeng Zhou (Zhejiang)
Primary Examiner: Calvin E Vansant
Assistant Examiner: Mark T. Philipps
Application Number: 35/516,062
Classifications