Heat sink for memory modules
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Description
Claims
The ornamental design for a heat sink for memory modules, as shown and described.
Referenced Cited
U.S. Patent Documents
6377460 | April 23, 2002 | Pohl |
D531965 | November 14, 2006 | Stathakis |
7215551 | May 8, 2007 | Wang |
7312996 | December 25, 2007 | Chang |
7457122 | November 25, 2008 | Lai |
D597966 | August 11, 2009 | Shih |
7715197 | May 11, 2010 | Tian |
7738252 | June 15, 2010 | Schuette |
D626521 | November 2, 2010 | Chen |
8411443 | April 2, 2013 | Chen |
D689829 | September 17, 2013 | Chen |
D793400 | August 1, 2017 | Lin |
10667431 | May 26, 2020 | Lunsman |
20030011993 | January 16, 2003 | Summers |
20030026076 | February 6, 2003 | Wei |
20060268523 | November 30, 2006 | Lin |
20090034183 | February 5, 2009 | Chen |
20090122481 | May 14, 2009 | Chang |
20090190304 | July 30, 2009 | Meyer, IV |
20090294099 | December 3, 2009 | Chen |
20110088870 | April 21, 2011 | Lee |
20130186595 | July 25, 2013 | Hsieh |
20140202675 | July 24, 2014 | Chen |
Patent History
Patent number: D956706
Type: Grant
Filed: Aug 6, 2020
Date of Patent: Jul 5, 2022
Assignee: ESSENCORE Limited (Hong Kong)
Inventor: Young Suk Chung (Yongin-si)
Primary Examiner: Selina Sikder
Application Number: 29/745,476
Type: Grant
Filed: Aug 6, 2020
Date of Patent: Jul 5, 2022
Assignee: ESSENCORE Limited (Hong Kong)
Inventor: Young Suk Chung (Yongin-si)
Primary Examiner: Selina Sikder
Application Number: 29/745,476
Classifications
Current U.S. Class:
Heat Sink (D13/179)