Emitter package

Description

FIG. 1 is a perspective view of the first embodiment of an emitter package showing our design;

FIG. 2 is a top plan view of the emitter package shown in FIG. 1;

FIG. 3 is a bottom plan view of the emitter package shown in FIG. 1;

FIG. 4 is front elevation view of the emitter package shown in FIG. 1, with the back elevation view being a mirror image thereof;

FIG. 5 is a right side elevation view of the emitter package shown in FIG. 1, with the left side elevation view being a mirror image thereof;

FIG. 6 is a bottom perspective view of the emitter package shown in FIG. 1;

FIG. 7 is a top perspective view of the second embodiment of an emitter package showing our design;

FIG. 8 is a top plan view of the emitter package shown in FIG. 7;

FIG. 9 is a bottom plan view of the emitter package shown in FIG. 7;

FIG. 10 is front elevation view of the emitter package shown in FIG. 7, with the back elevation view being a mirror thereof;

FIG. 11 is a right side elevation view of the emitter package shown in FIG. 7, with the left side elevation view being a mirror image thereof;

FIG. 12 is a bottom perspective view of the emitter package shown in FIG. 7;

FIG. 13 is a perspective view of the third embodiment of an emitter package showing our design;

FIG. 14 is a top plan view of the emitter package shown in FIG. 13;

FIG. 15 is a bottom plan view of the emitter package shown in FIG. 13;

FIG. 16 is front elevation view of the emitter package shown in FIG. 13, with the back elevation view being a mirror image thereof;

FIG. 17 is a right side elevation view of the emitter package shown in FIG. 13, with the left side elevation view being a mirror image thereof;

FIG. 18 is a bottom perspective view of the emitter package shown in FIG. 13;

FIG. 19 is a perspective view of the fourth embodiment of an emitter package showing our design;

FIG. 20 is a top plan view of the emitter package shown in FIG. 19;

FIG. 21 is a bottom plan view of the emitter package shown in FIG. 19;

FIG. 22 is front elevation view of the emitter package shown in FIG. 19, with the back elevation view being a mirror image thereof;

FIG. 23 is a right side elevation view of the emitter package shown in FIG. 19, with the left side elevation view being a mirror image thereof;

FIG. 24 is a bottom perspective view of the emitter package shown in FIG. 19;

FIG. 25 is a perspective view of the fifth embodiment of an emitter package showing our design;

FIG. 26 is a top plan view of the emitter package shown in FIG. 25;

FIG. 27 is a bottom plan view of the emitter package shown in FIG. 25;

FIG. 28 is front elevation view of the emitter package shown in FIG. 25, with the back elevation view being a mirror image thereof;

FIG. 29 is a right side elevation view of the emitter package shown in FIG. 25, with the left side elevation view being a mirror image thereof;

FIG. 30 is a bottom perspective view of the emitter package shown in FIG. 25;

FIG. 31 is a perspective view of the sixth embodiment of an emitter package showing our design;

FIG. 32 is a top plan view of the emitter package shown in FIG. 31;

FIG. 33 is a bottom plan view of the emitter package shown in FIG. 31;

FIG. 34 is front elevation view of the emitter package shown in FIG. 31, with the back elevation view being a mirror image thereof;

FIG. 35 is a right side elevation view of the emitter package shown in FIG. 31, with the left side elevation view being a mirror image thereof; and,

FIG. 36 is a bottom perspective view of the emitter package shown in FIG. 31.

The broken line showing in the embodiments of FIGS. 1–6, 13–18, 19–24 and 25–30 are for illustrative purposes only and forms no part of the claimed design. The external surface having stippling or irregular lines in the embodiments of FIGS. 25–30 and 31–36 indicate a rough visual appearance of the side surfaces of the emitter package. The top layer can have be visually transparent or translucent as shown in the embodiments of FIGS. 1–6, 13–18, 19–24 and 25–30, and in some embodiments can optically distort the layer below.

Claims

The ornamental design for an emitter package, as shown and described.