Power module housing
Latest INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE Patents:
Description
The broken lines in the figures illustrate the portions of the design that form no part of the claimed design.
Claims
The ornamental design for a power module housing, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
| D556686 | December 4, 2007 | Matsuo et al. |
| D748595 | February 2, 2016 | Bertalan et al. |
| D775091 | December 27, 2016 | Edenharter |
| D775593 | January 3, 2017 | Edenharter |
| D776071 | January 10, 2017 | Edenharter |
| 10020237 | July 10, 2018 | Hoehn |
| 10396056 | August 27, 2019 | Soyano |
| 10607903 | March 31, 2020 | Lin et al. |
| D903612 | December 1, 2020 | Soyano et al. |
| 11315859 | April 26, 2022 | Yang |
| D976838 | January 31, 2023 | Oosaka et al. |
| D976852 | January 31, 2023 | Wu |
| 20080142948 | June 19, 2008 | Matsumoto |
| 20140376184 | December 25, 2014 | Gohara |
| 20150373836 | December 24, 2015 | Masutani |
| 20190157221 | May 23, 2019 | Soyano |
| 20210339601 | November 4, 2021 | Schemmel et al. |
| 20220077791 | March 10, 2022 | Kudo |
| 20230217590 | July 6, 2023 | Kim et al. |
| 20240130055 | April 18, 2024 | Huang |
| 20240222236 | July 4, 2024 | Tada |
| 20250070104 | February 27, 2025 | Reiter |
| 20250149395 | May 8, 2025 | Mehrotra |
| D206651 | August 2020 | TW |
| 202032312 | September 2020 | TW |
| 202127991 | July 2021 | TW |
| D212914 | July 2021 | TW |
- TW Notice of Allowance dated Aug. 1, 2024 as received in Application No. 113301063.
Patent History
Patent number: D1090465
Type: Grant
Filed: Apr 18, 2024
Date of Patent: Aug 26, 2025
Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (Hsinchu)
Inventors: Yuan-Cheng Huang (New Taipei), Ji-Yuan Syu (Kaohsiung), Chun-Kai Liu (Hsinchu)
Primary Examiner: Selina Sikder
Application Number: 29/938,184
Type: Grant
Filed: Apr 18, 2024
Date of Patent: Aug 26, 2025
Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (Hsinchu)
Inventors: Yuan-Cheng Huang (New Taipei), Ji-Yuan Syu (Kaohsiung), Chun-Kai Liu (Hsinchu)
Primary Examiner: Selina Sikder
Application Number: 29/938,184
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)