Electric contact

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Description

FIG. 1 is a top, front and left side perspective view of an electric contact;

FIG. 2 is a bottom, rear and right side perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is an enlarged left side elevational view thereof;

FIG. 6 is an enlarged right side elevational view thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof;

FIG. 9 is an enlarged view taken along 9-9 line in FIG. 1;

FIG. 10 is an enlarged view taken along 10-10 line in FIG. 2;

FIG. 11 is an enlarged view taken along 11-11 line in FIG. 3;

FIG. 12 is an enlarged view taken along 12-12 line in FIG. 4;

FIG. 13 is an enlarged view taken along 13-13 line in FIG. 7;

FIG. 14 is an enlarged view taken along 14-14 line in FIG. 8; and,

FIG. 15 is a cross-sectional view taken along 15-15 line in FIG. 11.

The broken lines shown in the drawings illustrate portions of the electric contact that form no part of the claimed design. The long dash-short dash lines represent the boundary between claimed and unclaimed design and form no part of the claimed design.

Claims

The ornamental design for an electric contact, as shown and described.

Referenced Cited
U.S. Patent Documents
2319610 May 1943 Lake
4936797 June 26, 1990 Wehrle
5003255 March 26, 1991 Kazama
5487684 January 30, 1996 Schalk
D595235 June 30, 2009 Koushiro
D614581 April 27, 2010 Hemmi
D983681 April 18, 2023 Chen
D1051865 November 19, 2024 Ahn
D1086073 July 29, 2025 Shibutani
20040209529 October 21, 2004 Kuroda
20180340957 November 29, 2018 Teranishi
20230299526 September 21, 2023 Kim
Other references
  • Altra probe pin, posted Nov. 28, 2022 [online], [retrieved Aug. 14, 2025]. Retrieved from internet, https://www.altra.net/products/probe (Year: 2022).
  • Smiths Interconnector kelvin probes, posted Dec. 5, 2021 [online], [retrieved Aug. 14, 2025]. Retrieved from internet, https://www.smithsinterconnect.com/products/semiconductor-test/wlcsp-probe-heads/kelvin-probessolution/ (Year: 2021).
  • SW Test workshop, posted Jun. 4, 2017 [online], [retrieved Aug. 14, 2025]. Retrieved from internet, https://www.swtest.org/swtw_library/2017proc/PDF/ (Year: 2017).
  • Xurui Precision semiconductor test probes, posted Apr. 19, 2025 [online], [retrieved Aug. 14, 2025]. Retrieved from internet, https://www.pogopin-probe.com/semiconductor-probes/ (Year: 2025).
Patent History
Patent number: D1132885
Type: Grant
Filed: May 25, 2023
Date of Patent: Jul 7, 2026
Assignee: Kabushiki Kaisha Nihon Micronics (Musashino)
Inventors: Mika Nasu (Tokyo), Misaki Toyoda (Tokyo)
Primary Examiner: George D. Kirschbaum
Assistant Examiner: Denis Houyoux
Application Number: 29/876,666