Headphone

- SONY GROUP CORPORATION
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Description

FIG. 1 is an upper, right perspective view of a headphone showing our new design;

FIG. 2 is a lower perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof; and

FIG. 8 is a bottom plan view thereof; and,

FIG. 9 is an enlarged perspective view thereof cut along 9-9 and 9′-9′ of FIG. 1.

The even dashed broken lines form no part of the claimed design. The dot-dot-dash broken line defining a boundary of the enlarged perspective view forms no part of the claimed design.

Claims

The ornamental design for a headphone as shown and described.

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Patent History
Patent number: D1142294
Type: Grant
Filed: Sep 3, 2024
Date of Patent: Aug 18, 2026
Assignee: SONY GROUP CORPORATION (Tokyo)
Inventor: Soichi Tanaka (Kanagawa)
Primary Examiner: Paula Allen Greene
Application Number: 29/960,944