Power semiconductor module

- ROHM CO., LTD.
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Description

FIG. 1 is a front, top and right side perspective view of a power. semiconductor module showing our new design;

FIG. 2 is a font view thereof, the rear view being an identical image of FIG. 2;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a right side view thereof, the left side view being an identical image of FIG. 5;

FIG. 6 is an enlarged view of a front, top and right side perspective view thereof;

FIG. 7 is an enlarged view of a right side view thereof; and,

FIG. 8 is an enlarged view of a left side view thereof.

The broken lines illustrate portions of the power semiconductor module that form no part of the claimed design.

Claims

The ornamental design for a power semiconductor module, as shown and described.

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Other references
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Patent History
Patent number: D1150001
Type: Grant
Filed: Nov 19, 2024
Date of Patent: Sep 29, 2026
Assignee: ROHM CO., LTD. (Kyoto)
Inventors: Yuki Nakano (Kyoto), Kenji Yamamoto (Kyoto), Yasunori Kutsuma (Kyoto)
Primary Examiner: Richard Edgar
Assistant Examiner: Caleb M Baker
Application Number: 29/973,811