Detachable integrated circuit module

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Description

FIG. 1 is a perspective view of the detachable integrated circuit module illustrating its cooperative relationship with a packaged integrated circuit. The broken line showing of the packaged integrated circuit is included for the purpose of illustrating an environmental element only, and forms no part of the claimed design;

FIGS. 2 and 3 are opposing side elevation views of the detachable module;

FIG. 4 is an end elevation view of the detachable module from its end nearer the lockout key;

FIG. 5 is an end elevation view of the detachable module from its end opposite that from the lockout key;

FIG. 6 is a top plan view of the detachable module; and,

FIG. 7 is a bottom plan view of the detachable module.

Referenced Cited
U.S. Patent Documents
3501582 March 1970 Heidler et al.
3650232 March 1972 Heinlen
4107555 August 15, 1978 Haas et al.
4149028 April 10, 1979 Gressitt
4920444 April 24, 1990 Friman
4935581 June 19, 1990 Komathu
5038253 August 6, 1991 Repplinger et al.
5130881 July 14, 1992 Hilland
5131535 July 21, 1992 O'Connor et al.
Patent History
Patent number: D358804
Type: Grant
Filed: Sep 2, 1993
Date of Patent: May 30, 1995
Assignee: SGS-Thomson Microelectronics, Inc. (Carrollton, TX)
Inventors: Harry M. Siegel (Hurst, TX), Michael J. Hundt (Double Oak, TX), Krishnan Kelappan (Carrollton, TX)
Primary Examiner: Joel Sincavage
Attorneys: Rodney M. Anderson, Lisa K. Jorgenson, Richard K. Robinson
Application Number: 0/12,514