Heat retaining tube for use in a semiconductor wafer heat processing apparatus

- Tokyo Electron Limited
Description

FIG. 1 a perspective view of a heat retaining tube for use in a semiconductor wafer heat processing apparatus;

FIG. 2 a top plan view thereof;

FIG. 3 a front elevational view thereof;

FIG. 4 a cross sectional view taken along line IV--IV in FIG. 3;

FIG. 5 a cross sectional view taken along line V--V in FIG. 3;

FIG. 6 a rear elevational view thereof;

FIG. 7 a left side view thereof, the right side view being a mirror image of the left view; and,

FIG. 8 a bottom plan view thereof.

Referenced Cited
U.S. Patent Documents
D361752 August 29, 1995 Yamaga
4857689 August 15, 1989 Lee
5174045 December 29, 1992 Thompson et al.
5314574 May 24, 1994 Takahashi
5407449 April 18, 1995 Zinger
5516732 May 14, 1996 Flegal
5658115 August 19, 1997 Yamazaki et al.
5752796 May 19, 1998 Muka
Patent History
Patent number: D404016
Type: Grant
Filed: Jul 24, 1997
Date of Patent: Jan 12, 1999
Assignee: Tokyo Electron Limited (Tokyo-To)
Inventor: Katsutoshi Ishii (Kanagawa)
Primary Examiner: Brian N. Vinson
Law Firm: Ladas & Parry
Application Number: 0/74,282
Classifications
Current U.S. Class: Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)
International Classification: 1303;