Heat retaining tube for use in a semiconductor wafer heat processing apparatus
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Description
FIG. 1 a perspective view of a heat retaining tube for use in a semiconductor wafer heat processing apparatus;
FIG. 2 a top plan view thereof;
FIG. 3 a front elevational view thereof;
FIG. 4 a cross sectional view taken along line IV--IV in FIG. 3;
FIG. 5 a cross sectional view taken along line V--V in FIG. 3;
FIG. 6 a rear elevational view thereof;
FIG. 7 a left side view thereof, the right side view being a mirror image of the left view; and,
FIG. 8 a bottom plan view thereof.
Referenced Cited
Patent History
Patent number: D404016
Type: Grant
Filed: Jul 24, 1997
Date of Patent: Jan 12, 1999
Assignee: Tokyo Electron Limited (Tokyo-To)
Inventor: Katsutoshi Ishii (Kanagawa)
Primary Examiner: Brian N. Vinson
Law Firm: Ladas & Parry
Application Number: 0/74,282
Type: Grant
Filed: Jul 24, 1997
Date of Patent: Jan 12, 1999
Assignee: Tokyo Electron Limited (Tokyo-To)
Inventor: Katsutoshi Ishii (Kanagawa)
Primary Examiner: Brian N. Vinson
Law Firm: Ladas & Parry
Application Number: 0/74,282
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)
International Classification: 1303;
International Classification: 1303;