Heat retaining tube for use in a semiconductor wafer heat processing apparatus
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Description
FIG. 1: a perspective view of a heat retaining tube for use in a semiconductor wafer heat processing apparatus;
FIG. 2: a top plan view thereof;
FIG. 3: a front elevational view thereof, the rear elevational view is identical with the front view;
FIG. 4: a right side view thereof, the left side view being a mirror image of the right view;
FIG. 5: a bottom plan view thereof; and,
FIG. 6: a cross sectional view thereof taken along line VI--VI in FIG. 3.
Referenced Cited
Patent History
Patent number: D405427
Type: Grant
Filed: Jul 24, 1997
Date of Patent: Feb 9, 1999
Assignee: Tokyo Electron Limited (Tokyo-to)
Inventor: Katsutoshi Ishii (Kanagawa)
Primary Examiner: Brian N. Vinson
Law Firm: Ladas & Parry
Application Number: 0/74,278
Type: Grant
Filed: Jul 24, 1997
Date of Patent: Feb 9, 1999
Assignee: Tokyo Electron Limited (Tokyo-to)
Inventor: Katsutoshi Ishii (Kanagawa)
Primary Examiner: Brian N. Vinson
Law Firm: Ladas & Parry
Application Number: 0/74,278
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)
International Classification: 1303;
International Classification: 1303;