Heat retaining tube for use in a semiconductor wafer heat processing apparatus

- Tokyo Electron Limited
Skip to: Description  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 a perspective view of a heat retaining tube for use in a semiconductor wafer heat processing apparatus.

FIG. 2 a front elevational view thereof, the rear elevational view being a mirror image of the front view.

FIG. 3 a top plan view thereof.

FIG. 4 a bottom plan view thereof.

FIG. 5 a right side view thereof.

FIG. 6 a left side view thereof.

FIG. 7 a cross sectional view thereof taken along lineVII--VIl in FIG. 3; and,

FIG. 8 a cross sectional view thereof taken along line VIII--VIII in FIG. 2 .

Referenced Cited
U.S. Patent Documents
D361752 August 29, 1995 Yamaga
4857689 August 15, 1989 Lee
5174045 December 29, 1992 Thompson et al.
5314574 May 24, 1994 Takahashi
5407449 April 18, 1995 Zinger
5516732 May 14, 1996 Flegal
5658115 August 19, 1997 Yamazaki et al.
5752796 May 19, 1998 Muka
Patent History
Patent number: D410438
Type: Grant
Filed: Jul 24, 1997
Date of Patent: Jun 1, 1999
Assignee: Tokyo Electron Limited (Tokyo-To)
Inventor: Katsutoshi Ishii (Kanagawa)
Primary Examiner: Brian N. Vinson
Law Firm: Ladas & Parry
Application Number: 0/74,298
Classifications
Current U.S. Class: Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)
International Classification: 1303;