Integrated circuit package

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Description

FIG. 1 is a front elevational view of an integrated circuit package showing our new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a right elevational view thereof, the left side being the same in appearance as the right side;

FIG. 5 is a top, front, right perspective view thereof; and,

FIG. 6 is a bottom, rear, right perspective view thereof.

Referenced Cited
U.S. Patent Documents
D311520 October 23, 1990 Serio, Jr.
D345731 April 5, 1994 Owens et al.
5295297 March 22, 1994 Kitamura et al.
5841189 November 24, 1998 Shitama
5884772 March 23, 1999 Floyd et al.
Patent History
Patent number: D416236
Type: Grant
Filed: Sep 2, 1998
Date of Patent: Nov 9, 1999
Assignees: Citizen Electronics Co., Ltd. , Seiko Instruments Inc.
Inventors: Kazuhiro Kobayashi (Fujiyoshida), Masayoshi Shiraishi (Chiba), Osamu Tanabe (Chiba)
Primary Examiner: Adir Aronovich
Law Firm: Adams & Wilks
Application Number: 0/93,046
Classifications
Current U.S. Class: Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)
International Classification: 1303;