Optoelectronic IC package

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Description

FIG. 1 is a top perspective view of an optoelectronic IC package of the present invention;

FIG. 2 is a first side view thereof;

FIG. 3 is a second side view thereof;

FIG. 4 is a third side view thereof;

FIG. 5 is a top view thereof; and,

FIG. 6 is a fourth side view thereof.

The ornamental design which is claimed is shown in solid lines in the drawings. Any broken lines in the drawings are for illustrative purposes only and form no part of the claimed design.

Claims

The ornamental design for an optoelectronic IC package, as shown and described.

Referenced Cited
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5218223 June 8, 1993 Spaeth et al.
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D432097 October 17, 2000 Song et al.
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6355946 March 12, 2002 Ishinaga
6571190 May 27, 2003 Hou et al.
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6707069 March 16, 2004 Song et al.
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20040201987 October 14, 2004 Omata
Foreign Patent Documents
D1144892 June 2002 JP
D1144893 June 2002 JP
D1145109 June 2002 JP
Patent History
Patent number: D510915
Type: Grant
Filed: Oct 10, 2003
Date of Patent: Oct 25, 2005
Assignee: Matsushita Electric Industrial Co., Ltd. (Osaka)
Inventors: Shogo Horinouchi (Fukuoka), Hideki Ohyama (Fukuoka)
Primary Examiner: Stella Reid
Assistant Examiner: Selina Sikder
Attorney: Brinks Hofer Gilson & Lione
Application Number: 29/191,603