Optoelectronic IC package

Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a top perspective view of an optoelectronic IC package of the present invention;

FIG. 2 is a first side view thereof;

FIG. 3 is a second side view thereof;

FIG. 4 is a third side view thereof;

FIG. 5 is a top view thereof; and,

FIG. 6 is a fourth side view thereof.

The ornamental design which is claimed is shown in solid lines in the drawings. Any broken lines in the drawings are for illustrative purposes only and form no part of the claimed design.

Claims

We claim the ornamental design for an optoelectronic IC package, as shown and described.

Referenced Cited
U.S. Patent Documents
5218223 June 8, 1993 Spaeth et al.
5679976 October 21, 1997 Nishikawa et al.
D432097 October 17, 2000 Song et al.
6328483 December 11, 2001 Havasi et al.
6355946 March 12, 2002 Ishinaga
6570190 May 27, 2003 Krames et al.
D476961 July 8, 2003 Horiuchi et al.
6642449 November 4, 2003 Gotoh et al.
6707069 March 16, 2004 Song et al.
20010040300 November 15, 2001 Huang et al.
20040201987 October 14, 2004 Omata
Foreign Patent Documents
D1144892 June 2002 JP
D1144893 June 2002 JP
D1145109 June 2002 JP
Patent History
Patent number: D511331
Type: Grant
Filed: Oct 10, 2003
Date of Patent: Nov 8, 2005
Assignee: Matsushita Electric Industrial Co., Ltd. (Osaka)
Inventors: Shogo Horinouchi (Fukuoka), Hideki Ohyama (Fukuoka)
Primary Examiner: Stella Reid
Assistant Examiner: Selina Sikder
Attorney: Brinks Hofer Gilson & Lione
Application Number: 29/191,635