Groove formed around a semiconductor device on a circuit board
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Description
The broken lines represent unclaimed subject matter.
Claims
The ornamental design for a groove formed around a semiconductor device on a circuit board, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
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1263143 | January 2006 | JP |
- Notification of Reasons for Refusal issued in Japanese Design Application No. 2006-011443 mailed on Nov. 10, 2006 and English translation thereof, 4 pages.
- Notification of Reasons for Refusal issued in Japanese Design Application No. 2006-011445 mailed on Nov. 10, 2006 and English translation thereof, 4 pages.
- Notification of Reasons for Refusal issued in Japanese Design Application No. 2006-011446 mailed on Nov. 10, 2006 and English translation thereof, 4 pages.
Patent History
Patent number: D567774
Type: Grant
Filed: Nov 1, 2006
Date of Patent: Apr 29, 2008
Assignee: Nitto Denko Corporation (Osaka)
Inventors: Emiko Tani (Osaka), Tetsuya Ohsawa (Osaka)
Primary Examiner: Selina Sikder
Attorney: Osha Liang LLP
Application Number: 29/268,261
Type: Grant
Filed: Nov 1, 2006
Date of Patent: Apr 29, 2008
Assignee: Nitto Denko Corporation (Osaka)
Inventors: Emiko Tani (Osaka), Tetsuya Ohsawa (Osaka)
Primary Examiner: Selina Sikder
Attorney: Osha Liang LLP
Application Number: 29/268,261
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)