Groove formed around a semiconductor device on a circuit board

- Nitto Denko Corporation
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Description

FIG. 1 is a plan view of the groove formed around a semiconductor device on a circuit board showing our new design;

FIG. 2 is an enlarged view of the area boxed by the dash-dot-dash line in FIG. 1; and,

FIG. 3 is a sectional view taken along line 3—3 in FIG. 2.

The broken lines represent unclaimed subject matter.

Claims

The ornamental design for a groove formed around a semiconductor device on a circuit board, as shown and described.

Referenced Cited
U.S. Patent Documents
D319629 September 3, 1991 Hasegawa et al.
5420558 May 30, 1995 Ito et al.
5467252 November 14, 1995 Nomi et al.
5777277 July 7, 1998 Inagawa
5969590 October 19, 1999 Gutierrez
6114937 September 5, 2000 Burghartz et al.
6121552 September 19, 2000 Brosnihan et al.
6486412 November 26, 2002 Kato
7126452 October 24, 2006 Teshima et al.
20060266545 November 30, 2006 Takeuchi et al.
20070188287 August 16, 2007 Lien et al.
20070205856 September 6, 2007 Matsunaga et al.
Foreign Patent Documents
11-8275 January 1999 JP
Other references
  • Offica Action dated Nov. 4, 2005 for Japanese Application No. 2005-010995 (2 pages).
  • English translation of Office Action dated Nov. 4, 2005 for Japanese Patent Application No. 2005-010995 (1 page).
  • English Translation of Japanese Publication No. 11-8275 dated Jan. 12, 1999 (16 pages).
Patent History
Patent number: D568836
Type: Grant
Filed: Oct 11, 2005
Date of Patent: May 13, 2008
Assignee: Nitto Denko Corporation (Osaka)
Inventors: Tetsuya Ohsawa (Osaka), Emiko Tani (Osaka)
Primary Examiner: Selina Sikder
Attorney: Osha Liang LLP
Application Number: 29/240,252