Grooves formed around a semiconductor device on a circuit board
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Claims
The ornamental design for grooves formed around a semiconductor device on a circuit board, as shown and described.
D319629 | September 3, 1991 | Hasegawa et al. |
5420558 | May 30, 1995 | Ito et al. |
5467252 | November 14, 1995 | Nomi et al. |
5777277 | July 7, 1998 | Inagawa |
5969590 | October 19, 1999 | Gutierrez |
6114937 | September 5, 2000 | Burghartz et al. |
6121552 | September 19, 2000 | Brosnihan et al. |
6486412 | November 26, 2002 | Kato |
6798326 | September 28, 2004 | Iida |
6922128 | July 26, 2005 | Vilander et al. |
7068138 | June 27, 2006 | Edelstein et al. |
7126452 | October 24, 2006 | Teshima et al. |
20060266545 | November 30, 2006 | Takeuchi et al. |
20070188287 | August 16, 2007 | Lien et al. |
20070205856 | September 6, 2007 | Matsunaga et al. |
Type: Grant
Filed: Nov 1, 2006
Date of Patent: May 13, 2008
Assignee: Nitto Denko Corporation (Osaka)
Inventors: Naohiro Terada (Osaka), Kouji Kataoka (Osaka), Tetsuya Ohsawa (Osaka), Toshiki Naito (Osaka)
Primary Examiner: Selina Sikder
Attorney: Osha Liang LLP
Application Number: 29/268,260