Core connector for an optical communication connector
Latest Matsushita Electric Works, Ltd. Patents:
- Resin composition for printed wiring board, prepreg, and laminate obtained with the same
- Infrared sensor switch
- Epoxy resin composition for prepreg, prepreg and multilayered printed wiring board
- DISCHARGE LAMP LIGHTING DEVICE AND LIGHT FIXTURE
- Insulating structure between conductive members of electric device
Description
The broken line showing of the environment is for illustrative purposes only and forms no part of the claimed design.
Claims
The ornamental design for a core connector for an optical communication connector, as shown and described.
Referenced Cited
U.S. Patent Documents
Other references
3584157 | June 1971 | Prescott |
D428862 | August 1, 2000 | Queffelec et al. |
6296240 | October 2, 2001 | Nakai et al. |
6347893 | February 19, 2002 | Shiono et al. |
D464031 | October 8, 2002 | Gillingham |
6767243 | July 27, 2004 | McCoy |
- Catalogue of Sumitomo Electric Industries, Ltd.'s “QST-02”; 1 page /Award 2004.
Patent History
Patent number: D571301
Type: Grant
Filed: Nov 28, 2005
Date of Patent: Jun 17, 2008
Assignees: Matsushita Electric Works, Ltd. (Kadoma-shi, Osaka), Sumitomo Electric Industries, Ltd. (Osaka-shi, Osaka)
Inventors: Yoshiyuki Nakashima (Yokohama), Yukihiro Yokomachi (Yokosuka), Kenichiro Ohtsuka (Fujisawa), Daizo Nishioka (Fujisawa)
Primary Examiner: Daniel Bui
Attorney: Osha•Liang LLP
Application Number: 29/243,597
Type: Grant
Filed: Nov 28, 2005
Date of Patent: Jun 17, 2008
Assignees: Matsushita Electric Works, Ltd. (Kadoma-shi, Osaka), Sumitomo Electric Industries, Ltd. (Osaka-shi, Osaka)
Inventors: Yoshiyuki Nakashima (Yokohama), Yukihiro Yokomachi (Yokosuka), Kenichiro Ohtsuka (Fujisawa), Daizo Nishioka (Fujisawa)
Primary Examiner: Daniel Bui
Attorney: Osha•Liang LLP
Application Number: 29/243,597
Classifications
Current U.S. Class:
Element Or Attachment (D13/154);
Connector, Conductor Or Housing Therefor (10) (D13/133)