Lower heat insulating cylinder for manufacturing semiconductor wafers

- Tokyo Electron Limited
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Description

FIG. 1 is a perspective view of the design for a lower heat insulating cylinder for manufacturing semiconductor wafers in accordance with the invention;

FIG. 2 is a front view thereof;

FIG. 3 is a left side view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a rear view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof;

FIG. 8 is another top view thereof which shows sectional line 9—9;

FIG. 9 is a sectional view thereof along line 9—9 of FIG. 8; and,

FIG. 10 shows a lower heat insulating cylinder for manufacturing semiconductor wafers in accordance with the invention in use wherein the broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.

Claims

The ornamental design for a lower heat insulating cylinder for manufacturing semiconductor wafers, as shown and described.

Referenced Cited
U.S. Patent Documents
5534074 July 9, 1996 Koons
D404375 January 19, 1999 Shimazu
D405428 February 9, 1999 Ishii
6033215 March 7, 2000 Ohsawa
6171400 January 9, 2001 Wingo
20020092815 July 18, 2002 Kim et al.
20040069732 April 15, 2004 Huang et al.
20050145584 July 7, 2005 Buckley et al.
Other references
  • Copending U.S. Appl. No. 29/272,821, filed Feb. 20, 2007, “Upper Heat Insulating Cylinder for Manufacturing Semiconductor Wafers”.
Patent History
Patent number: D574792
Type: Grant
Filed: Feb 20, 2007
Date of Patent: Aug 12, 2008
Assignee: Tokyo Electron Limited (Tokyo)
Inventor: Izumi Sato (Tokyo)
Primary Examiner: Selina Sikder
Attorney: Smith, Gambrell & Russell, LLP
Application Number: 29/272,820