Heat dissipation deterrence link for semiconductor manufacture

- Tokyo Electron Limited
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Description

FIG. 1 is a front view of the design for a heat dissipation deterrence link for semiconductor manufacture in accordance with the invention;

FIG. 2 is a rear view thereof;

FIG. 3 is a right side view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a plan view thereof;

FIG. 6 is a bottom view thereof;

FIG. 7 is a sectional view thereof along A—A of FIG. 1;

FIG. 8 is a perspective view thereof; and,

FIG. 9 shows a heat dissipation deterrence link for semiconductor manufacture in accordance with the invention in use.

In practice, a heat dissipation deterrence link is placed on the bottom of a thermostat plug that is included in a process tube for semiconductor manufacture. Then, in use, the link suppresses heat from a bottom sub-heater. Preferably, the heat dissipation deterrence link for semiconductor manufacture in accordance with the present invention is fabricated from quartz.

The broken line showing the environment is for illustrative purposes only and forms no part of the claimed design.

Claims

The ornamental design for a heat dissipation deterrence link for semiconductor manufacture, as shown and described.

Referenced Cited
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Other references
  • Mitsuhiro Okada, et al. entitled Heat Dissipation Deterrence Link for Semiconductor Manufacture.
Patent History
Patent number: D588078
Type: Grant
Filed: Dec 15, 2006
Date of Patent: Mar 10, 2009
Assignee: Tokyo Electron Limited (Tokyo)
Inventors: Mitsuhiro Okada (Tokyo), Yoshikazu Furusawa (Tokyo), Daisuke Suzuki (Tokyo)
Primary Examiner: Selina Sikder
Attorney: Smith, Gambrell & Russell, LLP
Application Number: 29/270,120