Heat dissipation deterrence link for semiconductor manufacture
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In practice, a heat dissipation deterrence link is placed on the bottom of a thermostat plug that is included in a process tube for semiconductor manufacture. Then, in use, the link suppresses heat from a bottom sub-heater. Preferably, the heat dissipation deterrence link for semiconductor manufacture in accordance with the present invention is fabricated from quartz.
The broken line showing the environment is for illustrative purposes only and forms no part of the claimed design.
Claims
The ornamental design for a heat dissipation deterrence link for semiconductor manufacture, as shown and described.
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- Mitsuhiro Okada, et al. entitled Heat Dissipation Deterrence Link for Semiconductor Manufacture.
Type: Grant
Filed: Dec 15, 2006
Date of Patent: Mar 10, 2009
Assignee: Tokyo Electron Limited (Tokyo)
Inventors: Mitsuhiro Okada (Tokyo), Yoshikazu Furusawa (Tokyo), Daisuke Suzuki (Tokyo)
Primary Examiner: Selina Sikder
Attorney: Smith, Gambrell & Russell, LLP
Application Number: 29/270,120