Heat dissipation deterrence link for semiconductor manufacture

- Tokyo Electron Limited
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Description

FIG. 1 is a front view of the design for a in accordance with the invention;

FIG. 2 is a rear view thereof;

FIG. 3 is a right side view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a plan view thereof;

FIG. 6 is a bottom view thereof;

FIG. 7 is a sectional view thereof along 7—7 of FIG. 1;

FIG. 8 is a perspective view thereof; and,

FIG. 9 shows a heat dissipation deterrence link for semiconductor manufacture in accordance with the invention in use.

The dash lines indicate the boundary of the claimed design and form no part of the claimed design.

Claims

The ornamental design for a heat dissipation deterrence link for semiconductor manufacture, as shown and described.

Referenced Cited
U.S. Patent Documents
1637410 August 1927 Coryell
D93058 August 1934 Wagner
4803948 February 14, 1989 Nakagawa et al.
5370736 December 6, 1994 Roy et al.
5800616 September 1, 1998 Persyn
5846073 December 8, 1998 Weaver
6164963 December 26, 2000 Weaver
6746240 June 8, 2004 De Ridder et al.
D516318 March 7, 2006 Hasenoehrl et al.
7211514 May 1, 2007 Fujita et al.
20010050054 December 13, 2001 Kwag et al.
20030175649 September 18, 2003 Oosterlaken et al.
20030175650 September 18, 2003 Ridder
20040146827 July 29, 2004 Beatty et al.
20080044785 February 21, 2008 Anbai et al.
Other references
  • Mitsuhiro Okada, et al., entitled Heat Dissipation Deterrence Link For Semiconductor Manufacture.
Patent History
Patent number: D588079
Type: Grant
Filed: Dec 15, 2006
Date of Patent: Mar 10, 2009
Assignee: Tokyo Electron Limited (Tokyo)
Inventors: Mitsuhiro Okada (Tokyo), Yoshikazu Furusawa (Tokyo), Daisuke Suzuki (Tokyo)
Primary Examiner: Selina Sikder
Attorney: Smith, Gambrell & Russell LLP
Application Number: 29/270,121