Adhesive film material for use in manufacturing semiconductors

- Nitto Denko Corporation
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Description

FIG. 1 is a perspective view of a first embodiment of the adhesive film material for use in manufacturing semiconductors showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a plan view thereof;

FIG. 4 is a right side view, the left side being a mirror image thereof;

FIG. 5 is an enlarged plan view of the design as identified by A and B in FIG. 2;

FIG. 6 is a sectional view taken along line 66 in FIG. 5;

FIG. 7 is a sectional view taken along line 77 in FIG. 5;

FIG. 8 is a perspective view of a second embodiment of the adhesive film material for use in manufacturing semiconductors;

FIG. 9 is a front view thereof;

FIG. 10 is a plan view thereof;

FIG. 11 is a right side view, the left side being a mirror image thereof;

FIG. 12 is an enlarged plan view of the design as identified by A and B in FIG. 9;

FIG. 13 is a sectional view taken along line 1313 in FIG. 12;

FIG. 14 is a sectional view taken along line 1414 in FIG. 12;

FIG. 15 is a perspective view of a third embodiment of the adhesive film material for use in manufacturing semiconductors;

FIG. 16 is a front view thereof;

FIG. 17 is a plan view thereof;

FIG. 18 is a right side view, the left side being a mirror image thereof;

FIG. 19 is an enlarged plan view of the design as identified by A and B in FIG. 16;

FIG. 20 is a sectional view taken along line 2020 in FIG. 19; and,

FIG. 21 is a sectional view taken along line 2121 in FIG. 19.

Claims

The ornamental design for adhesive film material for use in manufacturing semiconductors, as shown and described.

Referenced Cited
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D549189 August 21, 2007 Misumi et al.
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Patent History
Patent number: D589473
Type: Grant
Filed: Nov 30, 2007
Date of Patent: Mar 31, 2009
Assignee: Nitto Denko Corporation (Osaka)
Inventors: Naohide Takamoto (Ibaraki), Sadahito Misumi (Ibaraki), Takeshi Matsumura (Ibaraki), Yasuhiro Amano (Ibaraki)
Primary Examiner: Selina Sikder
Attorney: Osha • Liang LLP
Application Number: 29/293,537