Adhesive film material for use in manufacturing semiconductors
Latest Nitto Denko Corporation Patents:
Claims
The ornamental design for adhesive film material for use in manufacturing semiconductors, as shown and described.
4209481 | June 24, 1980 | Kashiro et al. |
4961804 | October 9, 1990 | Aurichio |
5476565 | December 19, 1995 | Akada et al. |
5918113 | June 29, 1999 | Higashi et al. |
6245593 | June 12, 2001 | Yoshihara et al. |
6457220 | October 1, 2002 | Hamano |
6518097 | February 11, 2003 | Yim et al. |
D549189 | August 21, 2007 | Misumi et al. |
20020042189 | April 11, 2002 | Tanaka |
20030226640 | December 11, 2003 | Yamazaki et al. |
20050139973 | June 30, 2005 | Matsumura et al. |
Type: Grant
Filed: Nov 30, 2007
Date of Patent: Mar 31, 2009
Assignee: Nitto Denko Corporation (Osaka)
Inventors: Naohide Takamoto (Ibaraki), Sadahito Misumi (Ibaraki), Takeshi Matsumura (Ibaraki), Yasuhiro Amano (Ibaraki)
Primary Examiner: Selina Sikder
Attorney: Osha • Liang LLP
Application Number: 29/293,537