Wafer carrying-in/out apparatus

- Tokyo Electron Limited
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Description

FIG. 1 is a top plan view of a wafer carrying-in/out apparatus or the like, showing our new design;

FIG. 2 is a left side elevational view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a top, front and right side perspective view thereof;

FIG. 8 is a top, front and right side perspective view thereof shown when the doors thereof have been opened;

FIG. 9 is a front elevational view thereof shown with the windows thereof installed;

FIG. 10 is a left side elevational view thereof; and,

FIG. 11 is a rear elevational view thereof.

The features shown in broken lines in the drawings form no part of the claimed design.

Claims

The ornamental design for a wafer carrying-in/out apparatus or the like, as shown and described.

Referenced Cited
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Other references
  • U.S. Appl. No. 29/266,907, filed Oct. 2, 2006, Hosaka, et al.
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Patent History
Patent number: D607424
Type: Grant
Filed: Oct 2, 2006
Date of Patent: Jan 5, 2010
Assignee: Tokyo Electron Limited (Tokyo)
Inventors: Hiroki Hosaka (Nirasaki), Shuji Akiyama (Nirasaki), Tadashi Obikane (Nirasaki)
Primary Examiner: Selina Sikder
Attorney: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
Application Number: 29/266,907