Heat dissipation apparatus
Latest Foxsemicon Integrated Technology, Inc. Patents:
Description
Claims
The ornamental design for a heat dissipation apparatus, as shown.
Referenced Cited
U.S. Patent Documents
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D471168 | March 4, 2003 | Ge et al. |
6736204 | May 18, 2004 | Gollan et al. |
6975511 | December 13, 2005 | Lebo et al. |
7371965 | May 13, 2008 | Ice |
7529094 | May 5, 2009 | Miller |
7539018 | May 26, 2009 | Murr et al. |
7593230 | September 22, 2009 | Abul-Haj et al. |
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Patent History
Patent number: D618630
Type: Grant
Filed: May 30, 2009
Date of Patent: Jun 29, 2010
Assignee: Foxsemicon Integrated Technology, Inc. (Chu-Nan, Miao-Li Hsien)
Inventors: Tien-Ho Wei (Miao-Li Hsien), Yung-I Chen (Miao-Li Hsien), Wen-Jang Jiang (Miao-Li Hsien)
Primary Examiner: Selina Sikder
Attorney: Raymond J. Chew
Application Number: 29/337,861
Type: Grant
Filed: May 30, 2009
Date of Patent: Jun 29, 2010
Assignee: Foxsemicon Integrated Technology, Inc. (Chu-Nan, Miao-Li Hsien)
Inventors: Tien-Ho Wei (Miao-Li Hsien), Yung-I Chen (Miao-Li Hsien), Wen-Jang Jiang (Miao-Li Hsien)
Primary Examiner: Selina Sikder
Attorney: Raymond J. Chew
Application Number: 29/337,861
Classifications
Current U.S. Class:
Heat Sink (D13/179)