Heat dissipation apparatus

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Description

FIG. 1 is a perspective view of a heat dissipation apparatus showing our new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

The ornamental design for a heat dissipation apparatus, as shown.

Referenced Cited
U.S. Patent Documents
4899210 February 6, 1990 Lorenzetti et al.
6025643 February 15, 2000 Auger
D471168 March 4, 2003 Ge et al.
6736204 May 18, 2004 Gollan et al.
6975511 December 13, 2005 Lebo et al.
7371965 May 13, 2008 Ice
7529094 May 5, 2009 Miller
7539018 May 26, 2009 Murr et al.
7593230 September 22, 2009 Abul-Haj et al.
20080066888 March 20, 2008 Tong et al.
Patent History
Patent number: D618630
Type: Grant
Filed: May 30, 2009
Date of Patent: Jun 29, 2010
Assignee: Foxsemicon Integrated Technology, Inc. (Chu-Nan, Miao-Li Hsien)
Inventors: Tien-Ho Wei (Miao-Li Hsien), Yung-I Chen (Miao-Li Hsien), Wen-Jang Jiang (Miao-Li Hsien)
Primary Examiner: Selina Sikder
Attorney: Raymond J. Chew
Application Number: 29/337,861
Classifications
Current U.S. Class: Heat Sink (D13/179)