Circuit package lid

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Description

FIG. 1 is a front perspective view of a circuit package lid;

FIG. 2 is a front view of the circuit package lid;

FIG. 3 is a top view of the circuit package lid;

FIG. 4 is a bottom view of the circuit package lid;

FIG. 5 is a left side view of the circuit package lid;

FIG. 6 is a right side view of the circuit package lid; and,

FIG. 7 is a rear view of the circuit package lid.

Claims

The ornamental design for a circuit package lid, as shown and described.

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Patent History
Patent number: D641720
Type: Grant
Filed: Mar 26, 2010
Date of Patent: Jul 19, 2011
Assignee: Advanced Micro Devices, Inc. (Sunnyvale, CA)
Inventors: Stephen Heng (Las Gatos, CA), Sanjay Dandia (San Jose, CA), Nikon Banouvong (San Jose, CA), Chia-Ken Leong (Fremont, CA)
Primary Examiner: Selina Sikder
Attorney: Vedder Price P.C.
Application Number: 29/358,472