Circuit package lid

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Description

FIG. 1 is a front perspective view of the circuit package lid;

FIG. 2 is a front view of the circuit package lid;

FIG. 3 is a top view of the circuit package lid;

FIG. 4 is a bottom view of the circuit package lid;

FIG. 5 is a left side view of the circuit package lid;

FIG. 6 is a right side view of the circuit package lid; and,

FIG. 7 is a rear view of the circuit package lid.

The broken line showing of the circuit package lid is for illustrative purposes only and forms no part of the claimed design.

Claims

The ornamental design for a circuit package lid, as shown and described.

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Patent History
Patent number: D658607
Type: Grant
Filed: Jun 17, 2011
Date of Patent: May 1, 2012
Assignee: Advanced Micro Devices, Inc. (Sunnyvale, CA)
Inventors: Stephen Heng (Los Gatos, CA), Sanjay Dandia (San Jose, CA), Nikon Banouvong (San Jose, CA), Chia-Ken Leong (Fremont, CA)
Primary Examiner: Selina Sikder
Attorney: Faegre Baker Daniels LLP
Application Number: 29/394,524