Cooling jacket for semiconductor device
Description
Claims
The ornamental design for a cooling jacket for semiconductor device, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
D295401 | April 26, 1988 | Klees |
D441727 | May 8, 2001 | Sekimoto |
6397932 | June 4, 2002 | Calaman et al. |
7516777 | April 14, 2009 | Terakado et al. |
D616378 | May 25, 2010 | Chang et al. |
7721788 | May 25, 2010 | Atarashi et al. |
20060219387 | October 5, 2006 | Atarashi et al. |
20060219388 | October 5, 2006 | Terakado et al. |
20090065178 | March 12, 2009 | Kasezawa et al. |
20110188204 | August 4, 2011 | Horiuchi et al. |
2001-024126 | January 2001 | JP |
2001-308246 | November 2001 | JP |
2006-287017 | October 2006 | JP |
- Takahisa Hitachi, Hiromichi Gohara, and Fumio Nagaune; Direct Liquid Cooling IGBT Module for Automotive Applications; vol. 84 No. 5 2011; Issued on May 17, 2011.
- Fumio Nagaune, Hiromichi Gohara, Shinichiro Adachi, Takahisa Hitachi, Hiroki Shibata, Akira Morozumi and Akira Nishiura; Small Size and High Thermal Conductivity IGBT Module for Auto-motive Applications; PCIM Europe 2011, May 17-19, 2011, Nuremberg, Germany; Issued on Nov. 10, 2011.
Patent History
Patent number: D684544
Type: Grant
Filed: Nov 14, 2011
Date of Patent: Jun 18, 2013
Assignee: Fuji Electric Co., Ltd. (Kanagawa)
Inventor: Fumio Nagaune (Kanagawa)
Primary Examiner: Selina Sikder
Application Number: 29/406,390
Type: Grant
Filed: Nov 14, 2011
Date of Patent: Jun 18, 2013
Assignee: Fuji Electric Co., Ltd. (Kanagawa)
Inventor: Fumio Nagaune (Kanagawa)
Primary Examiner: Selina Sikder
Application Number: 29/406,390
Classifications
Current U.S. Class:
Heat Sink (D13/179)