LED chip
Latest Semileds Optoelectronics Co., Ltd. Patents:
- Method For Making Electronic Device Arrays Using A Temporary Substrate
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It will be understood that the dash lines presented in the drawings are for illustration only, and do not form a part of the claimed design.
Claims
The ornamental design for a LED chip, as shown and described in the drawings.
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Type: Grant
Filed: Apr 25, 2012
Date of Patent: Jul 2, 2013
Assignee: Semileds Optoelectronics Co., Ltd. (Miao-Li County)
Inventors: Chen-Fu Chu (Miao-Li County), Chao-Chen Cheng (Miao-Li County)
Primary Examiner: Selina Sikder
Application Number: 29/419,098