Layout for contact pads and connection bridges of a transponder chip module

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Description

FIG. 1 is a perspective view of a layout for contact pads and connection bridges of a transponder chip module showing our new design;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a left side elevation view thereof; and,

FIG. 6 is a right side elevation view thereof.

Portions of the article not shown form no part of the claimed design.

Claims

The ornamental design for a layout for contact pads and connection bridges of a transponder chip module, as shown and described.

Referenced Cited
U.S. Patent Documents
5031026 July 9, 1991 Ueda
D327883 July 14, 1992 Gloton
D328599 August 11, 1992 Gloton
D342728 December 28, 1993 Gloton
D344502 February 22, 1994 Gloton
D353136 December 6, 1994 Gloton
D357909 May 2, 1995 Gloton
D358142 May 9, 1995 Gloton
D393458 April 14, 1998 Merlin
D406821 March 16, 1999 Fischer
D406822 March 16, 1999 Huber
D416246 November 9, 1999 Hileman
D492688 July 6, 2004 Wallace
D571810 June 24, 2008 Ikeda
D602885 October 27, 2009 Nielsen
8649820 February 11, 2014 Schwandt
D701864 April 1, 2014 Lepp
D702240 April 8, 2014 Lepp
D703208 April 22, 2014 Lepp
D720354 December 30, 2014 Komatsu
D721047 January 13, 2015 Vinciarelli
20070205017 September 6, 2007 Takakusaki
20140104133 April 17, 2014 Finn
20140152511 June 5, 2014 Merlin et al.
Other references
  • Smart card, Wikipedia, Jul. 24, 2014, 12 pages (page 1 shows many different contact pad layouts, for SIMs).
Patent History
Patent number: D756317
Type: Grant
Filed: Aug 26, 2014
Date of Patent: May 17, 2016
Assignee: Féinics AmaTech Teoranta (Tourmakeady, Co. Mayo)
Inventors: David Finn (Tourmakeady), Mustafa Lotya (Celbridge)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/500,475