Layout for contact pads and connection bridges of a transponder chip module
Description
Portions of the article not shown form no part of the claimed design.
Claims
The ornamental design for a layout for contact pads and connection bridges of a transponder chip module, as shown and described.
Referenced Cited
U.S. Patent Documents
Other references
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- Smart card, Wikipedia, Jul. 24, 2014, 12 pages (page 1 shows many different contact pad layouts, for SIMs).
Patent History
Patent number: D756317
Type: Grant
Filed: Aug 26, 2014
Date of Patent: May 17, 2016
Assignee: Féinics AmaTech Teoranta (Tourmakeady, Co. Mayo)
Inventors: David Finn (Tourmakeady), Mustafa Lotya (Celbridge)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/500,475
Type: Grant
Filed: Aug 26, 2014
Date of Patent: May 17, 2016
Assignee: Féinics AmaTech Teoranta (Tourmakeady, Co. Mayo)
Inventors: David Finn (Tourmakeady), Mustafa Lotya (Celbridge)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/500,475
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)