Light emitting diode chip

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Description

FIG. 1 is a front perspective view of a light emitting diode chip showing my new design;

FIG. 2 is a rear perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a bottom view thereof; and,

FIG. 7 is a cross-sectional view taken along line 7-7 in FIG. 4.

The broken lines shown in the drawings are for illustrative purpose only and form no part of the claimed design.

Claims

The ornamental design for a light emitting diode chip, as shown and described.

Referenced Cited
U.S. Patent Documents
6713868 March 30, 2004 Ueno
D619977 July 20, 2010 Ni
D631021 January 18, 2011 Ni
D640644 June 28, 2011 Tsou
8421093 April 16, 2013 Okada
8546828 October 1, 2013 Takayama
8648365 February 11, 2014 Won
D737784 September 1, 2015 Song
9455388 September 27, 2016 Kim
20060220050 October 5, 2006 Higaki
Patent History
Patent number: D778849
Type: Grant
Filed: Apr 4, 2016
Date of Patent: Feb 14, 2017
Assignee: DOWA ELECTRONICS MATERIALS CO., LTD. (Tokyo)
Inventor: Tsukasa Maruyama (Akita)
Primary Examiner: Selina Sikder
Application Number: 29/560,176
Classifications