Wafer handling assembly

- Veeco Instruments Inc.
Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a top perspective view of a first embodiment of a wafer handling assembly.

FIG. 2 is a top view of the wafer handling assembly of FIG. 1.

FIG. 3 is a side view of the wafer handling assembly of FIG. 1.

FIG. 4 is another side view of the wafer handling assembly of FIG. 1.

FIG. 5 is a bottom perspective view of the wafer handling assembly of FIG. 1.

FIG. 6 is a top perspective view of a second embodiment of a wafer handling assembly.

FIG. 7 is a top view of the wafer handling assembly of FIG. 6.

FIG. 8 is a side view of the wafer handling assembly of FIG. 6.

FIG. 9 is another side view of the wafer handling assembly of FIG. 6.

FIG. 10 is a bottom perspective view of the wafer handling assembly of FIG. 6.

FIG. 11 is a top perspective view of a third embodiment of a wafer handling assembly.

FIG. 12 is a top view of the wafer handling assembly of FIG. 11.

FIG. 13 is a side view of the wafer handling assembly of FIG. 11.

FIG. 14 is another side view of the wafer handling assembly of FIG. 11.

FIG. 15 is a bottom perspective view of the wafer handling assembly of FIG. 11.

FIG. 16 is a top perspective view of a fourth embodiment of a wafer handling assembly.

FIG. 17 is a top view of the wafer handling assembly of FIG. 16.

FIG. 18 is a side view of the wafer handling assembly of FIG. 16.

FIG. 19 is another side view of the wafer handling assembly of FIG. 16.

FIG. 20 is a bottom perspective view of the wafer handling assembly of FIG. 16.

FIG. 21 is a top perspective view of a fifth embodiment of a wafer handling assembly.

FIG. 22 is a top view of the wafer handling assembly of FIG. 21.

FIG. 23 is a side view of the wafer handling assembly of FIG. 21.

FIG. 24 is another side view of the wafer handling assembly of FIG. 21.

FIG. 25 is a bottom perspective view of the wafer handling assembly of FIG. 21.

FIG. 26 is a top perspective view of a sixth embodiment of a wafer handling assembly.

FIG. 27 is a top view of the wafer handling assembly of FIG. 26.

FIG. 28 is a side view of the wafer handling assembly of FIG. 26.

FIG. 29 is another side view of the wafer handling assembly of FIG. 26; and,

FIG. 30 is a bottom perspective view of the wafer handling assembly of FIG. 26.

Claims

The ornamental design for a wafer handling assembly, as shown and described.

Referenced Cited
U.S. Patent Documents
4029351 June 14, 1977 Apgar et al.
5643366 July 1, 1997 Somekh et al.
5791895 August 11, 1998 Kyung
6249342 June 19, 2001 Cheng
6276892 August 21, 2001 Haraguchi
6357996 March 19, 2002 Bacchi et al.
6514033 February 4, 2003 Sundar
6537011 March 25, 2003 Wang
6692219 February 17, 2004 Coomer et al.
6935466 August 30, 2005 Lubomirsky
8008884 August 30, 2011 Krupyshev
D674366 January 15, 2013 Kajiwara
D674761 January 22, 2013 Iida
8920097 December 30, 2014 Chan
20050111944 May 26, 2005 Aho
20080107508 May 8, 2008 Chan
20150075431 March 19, 2015 Barriss et al.
20170256434 September 7, 2017 Rashkovsky
20170256436 September 7, 2017 Rashkovsky
Foreign Patent Documents
2012099755 May 2012 JP
2016001863 January 2016 WO
Patent History
Patent number: D803283
Type: Grant
Filed: May 16, 2016
Date of Patent: Nov 21, 2017
Assignee: Veeco Instruments Inc. (Plainview, NY)
Inventors: Yuliy Rashkovsky (Millburn, NJ), Brett Stuart Snowden (Manasquan, NJ), Miguel Angel Saldana (Aptos, CA)
Primary Examiner: Patricia A Palasik
Application Number: 29/564,740
Classifications
Current U.S. Class: Element Or Attachment (D15/138)