System including multiple instrument modules and arrangement thereof

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Description

FIG. 1 is a front perspective view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 2 is a rear perspective view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 3 is a front elevational view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 4 is a rear elevational view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 5 is a left side elevational view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 6 is a right side elevational view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 7 is a top view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 8 is a bottom view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 9 is a front perspective view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 10 is a front elevational view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 11 is a rear elevational view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 12 is a left side elevational view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 13 is a right side elevational view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 14 is a top view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment; and,

FIG. 15 is a bottom view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment.

Applicants claim the design for a system including multiple instrument modules and arrangement thereof as shown in the drawing figures. The broken lines shown in the figures represent portions of the system including multiple instrument modules and arrangement thereof that form no part of the claimed design.

Claims

The ornamental design for a system including multiple instrument modules and arrangement thereof, as shown and described.

Referenced Cited
U.S. Patent Documents
D645367 September 20, 2011 Hayashi
D669189 October 16, 2012 Liu
D676143 February 12, 2013 Liu
D676568 February 19, 2013 Liu
D685483 July 2, 2013 LiCalzi
D724753 March 17, 2015 Gutmann
D735878 August 4, 2015 Chang
D738243 September 8, 2015 Selberg
Patent History
Patent number: D820995
Type: Grant
Filed: Jun 27, 2016
Date of Patent: Jun 19, 2018
Assignee: Siemens Healthcare Diagnostics Inc. (Tarrytown, NY)
Inventors: Daniel LiCalzi (New York, NY), Youngsang Lee (Flushing, NY), Mark Lloyd (Townsend, DE), Gregory Bange (Newark, DE), Richard Warwick (Newark, DE), Robert Faranda (Boxborough, MA), Richard Watson (Norwell, MA), Justin Cumming (Topsfield, MA), Scott Salmon (Tenafly, NJ), Josh Hartl (Philadelphia, PA)
Primary Examiner: Wan Laymon
Assistant Examiner: Mark Booker
Application Number: 29/569,428
Classifications
Current U.S. Class: Specimen Handling, Preparation Or Testing (62) (D24/216)