Cassette receiving tool for semiconductor manufacturing apparatus
Latest KOKUSAI ELECTRIC CORPORATION Patents:
- Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording medium
- Nozzle cleaning method, substrate processing method, method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium
- Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
- Substrate processing method, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatus
- Insulating ring of semiconductor manufacturing apparatus
The broken lines shown in the drawings represent portions of the cassette receiving tool for semiconductor manufacturing apparatus that form no part of the claimed design.
Claims
The ornamental design for a cassette receiving tool for semiconductor manufacturing apparatus, as shown and described.
| 5947675 | September 7, 1999 | Matsushima |
| 5947677 | September 7, 1999 | Matsushima |
| 6152680 | November 28, 2000 | Howells |
| 6270307 | August 7, 2001 | Sinha |
| 6595841 | July 22, 2003 | Lai |
| D665759 | August 21, 2012 | Sato |
| D674365 | January 15, 2013 | Kajiwara |
| D695240 | December 10, 2013 | Iida |
| D701498 | March 25, 2014 | Iida |
| 8676375 | March 18, 2014 | Kraus |
Type: Grant
Filed: Jul 17, 2017
Date of Patent: Nov 26, 2019
Assignee: KOKUSAI ELECTRIC CORPORATION (Tokyo)
Inventor: Tadayoshi Karasawa (Toyama)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/610,856