Heater for heating semiconductor wafer
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Description
The broken lines shown represent the portions of the heater for heating semiconductor wafer that form no part of the claimed design.
Claims
The ornamental design for a heater for heating semiconductor wafer, as shown and described.
Referenced Cited
U.S. Patent Documents
Patent History
Patent number: D913230
Type: Grant
Filed: Oct 15, 2019
Date of Patent: Mar 16, 2021
Assignee: TOKYO ELECTRON LIMITED (Tokyo)
Inventor: Toshiki Kobayashi (Tokyo)
Primary Examiner: Derrick E Holland
Application Number: 29/709,589
Type: Grant
Filed: Oct 15, 2019
Date of Patent: Mar 16, 2021
Assignee: TOKYO ELECTRON LIMITED (Tokyo)
Inventor: Toshiki Kobayashi (Tokyo)
Primary Examiner: Derrick E Holland
Application Number: 29/709,589
Classifications
Current U.S. Class:
Inductor (e.g., Coil, Etc.) (D13/117)