Gas inlet attachment for substrate processing apparatus
Latest KOKUSAI ELECTRIC CORPORATION Patents:
- Method of manufacturing semiconductor device, method of processing substrate, recording medium, and substrate processing apparatus
- Method of manufacturing semiconductor device, substrate processing method, non-transitory computer-readable recording medium and substrate processing apparatus
- EJECTION APPARATUS, SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM
- SUBSTRATE PROCESSING APPARATUS, PROTECTOR, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM
- METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM
Description
FIG, 5 is a right side elevational view thereof;
Claims
I claim the ornamental design for a gas inlet attachment for substrate processing apparatus, as shown and described.
Referenced Cited
U.S. Patent Documents
| D326272 | May 19, 1992 | Nakao |
| 7700054 | April 20, 2010 | Hayashida |
| D890572 | July 21, 2020 | Saiki |
| D901564 | November 10, 2020 | Murata |
| 20030159653 | August 28, 2003 | Dando |
| 20080302302 | December 11, 2008 | Horita |
| 20130220221 | August 29, 2013 | Sanchez |
| 20130276707 | October 24, 2013 | Pierreux |
| 20140239091 | August 28, 2014 | Huang |
| 20150240359 | August 27, 2015 | Jdira |
| 20170051408 | February 23, 2017 | Takagi |
| 20170073810 | March 16, 2017 | Hyon |
| 20170241015 | August 24, 2017 | Sim |
| 20170283947 | October 5, 2017 | Rasheed |
| 20180087156 | March 29, 2018 | Fukushima |
Patent History
Patent number: D924953
Type: Grant
Filed: Dec 4, 2018
Date of Patent: Jul 13, 2021
Assignee: KOKUSAI ELECTRIC CORPORATION (Tokyo)
Inventor: Hironori Shimada (Toyama)
Primary Examiner: Selina Sikder
Application Number: 29/672,229
Type: Grant
Filed: Dec 4, 2018
Date of Patent: Jul 13, 2021
Assignee: KOKUSAI ELECTRIC CORPORATION (Tokyo)
Inventor: Hironori Shimada (Toyama)
Primary Examiner: Selina Sikder
Application Number: 29/672,229
Classifications