Reaction tube
Latest KOKUSAI ELECTRIC CORPORATION Patents:
- Substrate processing apparatus and method of manufacturing semiconductor device
- Method of manufacturing semiconductor device
- Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
- Substrate processing apparatus
- Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
Description
The broken lines in the drawings are for the purpose of illustrating the boundaries of the portions shown enlarged in the views and form no part of the claimed design.
Claims
The ornamental design for a reaction tube, as shown and described.
Referenced Cited
U.S. Patent Documents
D405062 | February 2, 1999 | Shimazu |
D405431 | February 9, 1999 | Shimazu |
D423463 | April 25, 2000 | Hanagata |
D424024 | May 2, 2000 | Hanagata |
D594488 | June 16, 2009 | Toiya |
D600659 | September 22, 2009 | Matsuura |
D629915 | December 28, 2010 | Chia |
D772824 | November 29, 2016 | Yoshida |
D778457 | February 7, 2017 | Hara |
D778458 | February 7, 2017 | Tateno |
D842823 | March 12, 2019 | Okajima |
D842824 | March 12, 2019 | Sato |
D853979 | July 16, 2019 | Kagaya |
D931823 | September 28, 2021 | Murata |
D953567 | May 31, 2022 | Matsuoka |
D953568 | May 31, 2022 | Matsuoka |
D953569 | May 31, 2022 | Matsuoka |
20160168704 | June 16, 2016 | Choi |
Patent History
Patent number: D986826
Type: Grant
Filed: Sep 9, 2020
Date of Patent: May 23, 2023
Assignee: KOKUSAI ELECTRIC CORPORATION (Tokyo)
Inventor: Satoru Murata (Toyama)
Primary Examiner: S. Bryan Reinholdt, Jr.
Assistant Examiner: Leah E Hoeferkamp
Application Number: 29/749,808
Type: Grant
Filed: Sep 9, 2020
Date of Patent: May 23, 2023
Assignee: KOKUSAI ELECTRIC CORPORATION (Tokyo)
Inventor: Satoru Murata (Toyama)
Primary Examiner: S. Bryan Reinholdt, Jr.
Assistant Examiner: Leah E Hoeferkamp
Application Number: 29/749,808
Classifications
Current U.S. Class:
Connector, Conductor Or Housing Therefor (10) (D13/133)