Process tube for manufacturing semiconductor wafers
Latest Tokyo Electron Limited Patents:
- ETCHING METHOD AND PLASMA PROCESSING SYSTEM
- Method of transporting workpiece and processing apparatus
- Plasma processing apparatus, analysis apparatus, and storage medium
- Apparatus and methods for beam processing of substrates
- Purification processing apparatus, substrate processing system, and processing method
The broken lines are shown for illustrative purpose only and form no part of the claimed design.
Claims
The ornamental design for a process tub for manufacturing semiconductor wafers, as shown and described.
| 5618349 | April 8, 1997 | Yuuki |
| D404368 | January 19, 1999 | Shimazu |
| D405062 | February 2, 1999 | Shimazu |
| D406113 | February 23, 1999 | Hanagata et al. |
| 5948300 | September 7, 1999 | Gero et al. |
| 6251189 | June 26, 2001 | Odake et al. |
| 6538237 | March 25, 2003 | Yang et al. |
| D520467 | May 9, 2006 | Ishii et al. |
| D521464 | May 23, 2006 | Ishii et al. |
| 20020014483 | February 7, 2002 | Suzuki et al. |
Type: Grant
Filed: Mar 9, 2007
Date of Patent: Sep 22, 2009
Assignee: Tokyo Electron Limited (Tokyo)
Inventors: Hiroyuki Matsuura (Tokyo), Koichi Shimada (Tokyo)
Primary Examiner: Selina Sikder
Attorney: Smith, Gambrell & Russell, LLP
Application Number: 29/273,613