Abstract: A high aspect ratio contact structure using a metal silicide adhesion layer that is interposed between titanium and titanium nitride (TiN) to promote adhesion of TiN to Ti. The metal silicide adhesion layer created from silicon doped CVD Ti can be deposited over the unreacted Ti after the silicidation reaction or deposited directly on the silicon substrate in place of CVD Ti. The contact structure further includes contact fill that is comprised of TiCl4 based TiN, which affords improved step coverage in the contact structure.

Abstract: Certain methods of the invention permit spacerless manufacture of stacked microelectronic devices by mechanically supporting a second microelectronic component with a wire coating. This wire coating may be sufficiently adhesive to also mechanically bond the second microelectronic component to a first microelectronic component. Other embodiments of the invention provide spacerless stacked microelectronic devices wherein a second microelectronic component is mechanically supported by a wire coating.

Abstract: A multichip module that utilizes an angled interconnect to electrically interconnect chips in the module that are positioned at an angle relative to each other. The multichip module may comprise a first and second chips that are positioned in an orthogonal manner. The first and second chips are electrically interconnected via an interconnect structure comprising a first conductive pillar that extends from an outer surface of the first chip. A distal end of the first pillar is electrically connected to an outer surface of the second chip via a solder ball or another conductive pillar that is interposed between the distal end of the first conductive pillar and the second chip.

Abstract: Supports (40) of microelectronic devices (10) are provided with underfill apertures (60) which facilitate filling underfill gaps (70) with underfill material (74). The underfill aperture may have a longer first dimension (62) and a shorter second dimension (64). In some embodiments, a method of filling the underfill gap (70) employs a removable stencil (80). If so desired, a stencil (80) can be used to fill multiple underfill gaps through multiple underfill apertures in a single pass.

Abstract: In connection with a semiconductor device which adopts the face down mounting method, it is intended to provide a technique which can check the state of continuity between electrode pads formed on a semiconductor chip and electrode pads formed on a wiring substrate.

Abstract: A configuration of conductive bumps on a flip chip and a redistribution layer is disclosed. The configuration comprise: a plurality of power bumps and ground bumps disposed in hive-shaped arrangement on the core of a flip chip; a plurality of power lines slanted by 60-degree angle, relative to a horizontal line, for connecting power bumps; and a plurality of ground lines slanted by 60-degree angle, relative to a horizontal line, for connecting ground bumps. The conductive bumps of the second embodiment are disposed in a checkerboard arrangement. The conductive bumps of the third embodiment are disposed in a staggered arrangement, and the power bumps and the ground bumps are respectively connected by power lines and ground lines, which are slanted in 45-degree angle, relative to a horizontal line. The power lines and the ground lines are in the redistribution layer.

Abstract: A method for forming printed re-routing for wafer level packaging, especially chip size packaging. The method includes forming a contact layer on a semiconductor die, forming a conductive redistribution structure on the contact layer, and etching the contact layer of the die by using the conductive redistribution structure as a self-aligning mask. The present method significantly decreases the complexity and costs for generating redistribution structures in wafer level packaging by discarding expensive processes for photolithography and plating. Furthermore, using the redistribution structures as a self-aligning mask improves alignment and reduces the number of processes required, leading to greater production optimization and efficiency.

Abstract: A microelectronic assembly, and method of making the same, including a wire stitch bonded on an electroplated gold bump or electroless nickel/gold bump on a bond pad of an integrated circuit chip. The electroplated gold bump or electroless nickel/gold bump provides a relatively flat upper surface which is excellent for making a wire stitch bond thereto. The microelectronic assembly may include a multiple integrated circuit chip stack attached to a substrate such as a ball grid array. The electroplated gold bumps or electroless nickel/gold bumps may be formed on all of the integrated circuit chips and wire stitch bonds formed on the electroplated gold bumps or electroless nickel/gold bumps thereby connecting the integrated circuit chips to each other or to an underlying ball grid array.

Abstract: A semiconductor device comprises a chip; a plurality of bonding pads provided on the chip; and a plurality of inner leads arranged opposite to the bonding pads. Further the semiconductor device comprises a plurality of bonding wires electrically connecting the bonding pads and the corresponding inner leads, respectively. Each of the bonding wires has a plurality of bends electrically isolated from conductive parts on the chip, and the bonding pads are arranged at optional positions on a surface of the chip. Hence the shorting of the chip by the bonding wires can be reliably prevented, the bonding wire having a high mechanical strength can be stably fed, the bonding pads may be optionally arranged on the chip, the degree of freedom of designing the layout of the internal circuit of the chip is high, and the semiconductor device and the wire bonding apparatus can be developed at a high efficiency.

Abstract: To provide a semiconductor memory device that can be mounted on both sides of a circuit board having a relatively simple wiring pattern and can be manufactured at a low cost, the semiconductor memory chip of the present invention includes a plurality of memory cells, a control circuit formed on a semiconductor substrate, a plurality of electrode pads are formed on one of the principal planes for the purpose of input and output of signals to/from the control circuit, wherein at least a pair of the electrode pads consist of selective connection electrode pads that can drive the control circuit by selecting and connecting either one thereof, and the two selective connection electrode pads are disposed on both sides of a longitudinal or lateral chip centerline on the one principal plane.

Abstract: A power semiconductor device having a power element sealed into a package, which comprises the package, the power element fixed in the package, a bonding wire connected to the power element, and a gel insulator for covering the power element, characterized in that foam material is further charged so as to fill a cavity left inside of said package.

Abstract: A molding die set includes a first molding die which comprises cavities and a parting surface; a second molding die which comprises cavities and a parting surface arranged to face the first molding die; and an O-ring supported on the first molding die to surround the cavities and to have a peripheral line which does not extend outwardly from the parting surface.

Abstract: A method and apparatus for aligning a semiconductor device with a corresponding landing site on a carrier substrate. At least two apertures are formed in a semiconductor device, the apertures passing from a first major surface to a second, opposing major surface of the semiconductor device. Corresponding alignment features are provided on the carrier substrate at the landing site to which the device is to be mounted. The alignment features are aligned with the corresponding apertures to effect alignment of the device. The alignment features may include apertures corresponding in size, shape and arrangement to the semiconductor device apertures. An alignment pin may be placed through the two sets of apertures and to assist with alignment.

Abstract: A method of aligning a plurality of empty-spaced buried patterns formed in semiconductor monocrystalline substrates is disclosed. In an exemplary embodiment, high-temperature metal marks are formed to include a conductive material having a melting temperature higher than an annealing temperature used to form such empty-spaced buried patterns. The high-temperature metal marks are formed prior to the formation of the empty-spaced buried patterns formed in a monocrystalline substrate, so that the empty-space buried patterns are aligned to the marks. Subsequent semiconductor structures that are formed as part of desired semiconductor devices can be also aligned to the marks.

Abstract: A dual-polycide semiconductor structure and method for forming the same having reduced dopant cross-diffusion. A conductive layer is formed over a polysilicon layer having a first region doped with a first dopant and a second region adjoining the first region at an interface doped with a second dopant. A region of discontinuity is then formed in the conductive layer located away from the interface. The conductive layer formed over the polysilicon gate overlaps the interface to provide electrical continuity between the first and second regions of the polysilicon gate, but also includes a region of discontinuity to reduce dopant cross-diffusion.

Abstract: Disclosed is a combined humidifier for improving sanitary conditions, which is capable of completely sterilizing bacteria contained in moisture provided to the atmosphere in the form of a cool mist, which is capable of widely spreading the moisture in the air so as to smoothly control the humidity of the atmosphere, by instantaneously evaporating sprayed water during compulsory exhaust of the water with the aid of a blower after spraying water as a mist due to operation of an ultrasonic oscillator, wherein an evaporator having pluralities of radiating plates is installed in a passage for guiding water within the humidifier.

Abstract: A bubbler for gaseous delivery comprises a receptacle for containing a liquid, a gas inlet conduit, and a gas outlet conduit. The gas inlet conduit includes a first end for receiving a carrier gas and a second end terminating in the receptacle for bubbling the carrier gas into the liquid. The gas outlet conduit includes a first portion, a second portion, and a third portion. The first portion includes an opening located within the receptacle but above the liquid. The opening has a first cross-sectional area. The second portion has a second cross-sectional area larger than the first cross-sectional area. The third portion has a third cross-sectional area smaller than the second cross sectional area. The second portion causes a burp of the liquid entering the opening to not enter the third portion as gas is bubbled through the liquid.

Abstract: A method and system for increasing the quantity of a gas, e.g., ozone, dissolved in a liquid, e.g., ultrapure deionized water, are provided. The gas to be dissolved is introduced to the liquid under pressure and the resulting admixture delivered to the end-use station under pressure Once at the end-use station, the admixture comprising the liquid and dissolved gas is subjected to controlled dispensing. Thus, the method and system of the present invention are able to provide, e.g., ozonated water, continuously, efficiently and without cooling, thus providing a simple, cost efficient method of producing high concentration ozonated water.

Abstract: A method of manufacturing a plate-like body formed of first and second members stuck together through liquid includes the steps of (a) applying the liquid on a surface of the first member and (b) feeding gas between the first and second members at an instant of initial contact of the liquid with the second member when the second member is superimposed on the first member.

Abstract: A high volume lens curing system is described. The high volume lens curing system is configured to cure multiple eyeglass lenses in a continuous manner.

Abstract: A high volume lens curing system is described. The high volume lens curing system is configured to cure multiple eyeglass lenses in a continuous manner.

Abstract: A high volume lens curing system is described. The high volume lens curing system is configured to cure multiple eyeglass lenses in a continuous manner.

Abstract: A high volume lens curing system is described. The high volume lens curing system is configured to cure multiple eyeglass lenses in a continuous manner.

Abstract: A high volume lens curing system is described. The high volume lens curing system is configured to cure multiple eyeglass lenses in a continuous manner.

Abstract: Methods for preparing microspheres containing imidazole derivatives are provided. Also provided is the use of imidazole derivatives containing microspheres for treating fungal infections. Oral dosage forms for oral administration are also provided.

Abstract: The rotary tablet press comprises a housing, in which a compression unit (14) is detachably mounted. The compression unit (14) comprises a die table (15) with punches (17, 18), a feeding device for the supply of material to be compressed into the dies (16), and a tablet discharge device for removal of compressed material in the form of tablets. The compression unit (14) encloses each die opening and its corresponding first punch end (21, 22) in a chamber, the feeding device and the tablet discharge device are enclosed, the feeding device communicates with an inlet for detachable connection with an external supply channel, and the tablet discharge device communicates with an outlet.

Abstract: The present invention provides a hydraulic actuating mechanism of an injection molding machine, in which a plurality of hydraulic actuators are driven by one hydraulic pump, wherein the hydraulic pump of the hydraulic actuating mechanism is a variable discharge pump having the maximum necessary delivery capacity at least for each of the hydraulic actuators at the time of the highest rotational speed of the pump; the discharged fluid pressure is controlled by a discharge cutoff function of a pressure compensator ancillary to the variable discharge pump; and the pump is driven by a motor whose rotation can be controlled in a stepless mode.

Abstract: An implant designing method to be applied to a body of bone which has a bone deficient portion, wherein the bone being substantially symmetric with respect to a plane of symmetry, includes generating three-dimensional data of the bone based on a plurality of pieces of tomographic data of the bone, and estimating a shape of a bone that is to exist at the bone deficient portion using part of the three-dimensional data corresponding to a symmetrical part of the bone deficient portion.

Abstract: A method for providing a uniformly dense polymer foam body having a density between about 0.013 g/cm3 to about 0.5 g/cm3 is disclosed. The method utilizes a thermally expandable polymer microballoon material wherein some of the microballoons are unexpanded and some are only partially expanded. It is shown that by mixing the two types of materials in appropriate ratios to achieve the desired bulk final density, filling a mold with this mixture so as to displace all or essentially all of the internal volume of the mold, heating the mold, for a predetermined interval at a temperature above about 130° C., and then cooling the mold to a temperature below 80° C. the molded part achieves a bulk density which varies by less then about ±6% everywhere throughout the part volume.

Abstract: A molding process and apparatus which improves on and simplifies the manufacturing apparatus for forming of laminated plastic parts. There is provided a main press having upper and lower mold parts which define a mold cavity corresponding to the laminated part. The upper mold part is movable into an open booking position so as to cooperate with an opposed injection molding tool associated with a partial injection molding press for injection molding of a backing layer therebetween. A thin skin can be formed in the open lower mold half of the main press. A quantity of foamable urethane is deposited in the open lower mold half over the skin. The upper mold half is then moved into closed position with the lower mold half, and the urethane reacts to fill the cavity and join to the opposed backing layer and skin to create the laminated part.

Abstract: An extruded, polystyrene-based resin foam plate produced by extruding a foamable molten composition containing a polystyrene-based resin and a blowing agent consisting of (a) isobutane and (b) a blowing agent component other than isobutane, chlorofluorocarbons and fluorocarbons from a high pressure zone into a lower pressure zone. The extruded foam plate has a thickness of at least 10 mm and an apparent density of 25-60 kg/m3 contains residual isobutane in an amount of 0.45-0.80 mol per 1 kg thereof, has cells having an average diameter in the thickness direction thereof of 0.05-0.18 mm and a cell strain rate of 0.7-1.2, wherein the cell strain rate is obtained by dividing the average diameter in the thickness direction of the extruded foam plate by the average diameter in the horizontal direction of the extruded foam plate, meets the flammability standard on extruded polystyrene foam insulation plates as defined in JIS A9511-1995, and has a thermal conductivity of not greater than 0.028 W/m·K.

Abstract: The present invention provides a method for extruding polymer blend resin which is capable of satisfying performances which are necessary as a resin-coated metal can even when the resin-coated metal can is produced through an extremely stringent working such as drawing, deep drawing, bend-elongation by drawing, stretching or ironing. After feeding thermoplastic resin A to a biaxial extruder through a first raw material feed port of the extruder, the thermoplastic resin A is plasticized in a molten state and is subjected to degassing under reduced pressure. Thereafter, thermoplastic resin B whose melting temperature or softening temperature is lower than a melting temperature or a softening temperature of the thermoplastic resin A is fed to the extruder through a second raw material feed port. Assuming Lb as a length of a blending zone and D as a screw diameter of the extruder, the thermoplastic resin B is blended with the thermoplastic resin A in the blending zone of Lb/D=0.5 to 5.

Abstract: A composition and method of making a strength enhanced composition are described. The composition comprises zinc oxide, silica and colloidal oxide solution. The colloidal oxide solution is utilized as a binding agent to provide a strength enhanced absorbent composition that can be utilized in an absorption process for the purpose of removing sulfur contaminants from fluid streams.

Abstract: A boron containing ceramic-aluminum metal composite is formed by mixing a boron containing ceramic with a metal powder comprised of aluminum or alloy thereof, shaping the mixture into a porous preform, contacting the preform with an infiltrating metal comprised of aluminum or alloy thereof that melts at a lower temperature than the metal powder and heating to a temperature sufficient to melt the infiltrating metal, but insufficient to melt the metal powder, such that the infiltrating metal infiltrates the porous preform to form the composite. The composite that is formed may be used for vehicular parts.

Abstract: A method for manufacturing shoe inserts includes the processes of loading, coupling, injecting, trimming and finished products to wrap and bond PU with a covering fabric (or other suitable shoe insert materials) to become an integrated product without the tedious processes of gluing, pre-cutting, bonding, folding rims or compression. The method is adaptable for mass production.

Abstract: Method and apparatus for molding a sealing surface of revolution on a molded part in first and second partable mold halves that mate at a major parting line plane. First and second mold inserts each have a sub-insert trim wheel component shaped to mold form the sealing surface of revolution when closed at a minor parting line plane. The sub-inserts are rotatable between a position flush with the major parting line plane and a starting position angularly offset therefrom. The mold cavity is filled with liquid molding material that is allowed to harden to at least a self-sustaining solidification strength. The sub-inserts are then rotated to thereby move any minor parting line flash toward a position angularly offset from their starting position. This rotation causes any parting line flash that might otherwise remain on the sealing surface to be removed from attachment to, and/or smeared smooth along, such surface.

Abstract: Thermoplastics may be melt spun at high production rates, and without physical property degradation, by spinning a blend of the thermoplastic and a minor amount of a specified liquid crystalline polymer.

Abstract: A unique isotropic sub-denier spunbond nonwoven product created by an apparatus and method comprising a unique multi-head resin metering system, a spinneret head with spinning sections, separated by a quench fluid extraction zone, a two sided, multilevel quench system, a fluid volume control infuser system which automatically guides the filaments into the filament drawing system while conserving energy by using a portion of the quench fluid as part of the drawing fluid and also minimizing turbulence at the entrance to the draw slot. The filament drawing system comprises a draw jet assembly with adjustable primary and secondary jet-nozzles and a variable width draw jet-slot. The entire draw jet assembly is moveable vertically for filament optimization. The offset, constant flow secondary jet-nozzle system provides an unexpectedly high velocity increment to the filaments by oscillating the filaments and increasing their drag resulting in remarkably low fiber denier on the order of 0.5 to 1.2.

Abstract: The invention relates to a process for simultaneous spin-drawing of one or more heavy-duty yarns, comprising the following steps:

Abstract: A method of making a mould directly from the object to be moulded is disclosed. The object is placed within a walled enclosure having a closed bottom and open top. A plurality of elongated metal rod elements is vertically introduced and packed into the enclosure in vertical contact with said object and side by side contact with one another. An infiltration agent, such as a liquid resin or metal, is introduced over the elongated metal rod elements and allow to permeate into the spaces between the rod elements. The mass consisting of the liquid infiltration agent and the elongated metal elements is allowed to solidify into a mould which is removed from the object.

Abstract: A washer door or lid as defined by a tempered glass panel bordered by an open frame-like encapsulation of one-piece injection molded polymeric/copolymeric synthetic plastic material. The latter material is preferably acrylonitrile/styrene/acrylate polymer blended with mica glass beads at a ratio of substantially 70%-30% to 90%-10% by weight, but preferably 80%-20% by weight. Further specifics of the washer lid include a relatively thick inner periphery of the encapsulation which securely grips and reinforces an outer peripheral edge of the tempered glass panel, a rigid outer peripheral skirt, an indiscrete handle, a reinforced hand corder for a switch actuator and opposite rear corners carrying hinges for securing the washer lid to an associated washer opening.

Abstract: A forming track forms flexible plastic tubing which carries fuel from a fuel tank to an engine into a desired shape. The forming track includes a curved channel to receive a round tubing and a pair of opposing flanges to secure the tubing in the forming track. The tubing slightly deforms between the pair of opposing flanges as the plastic tubing is positioned in the channel. After the tubing is inserted, the opposing flanges secure the tubing in the forming track. While positioned in the forming track, the tubing is set by heating and rapid cooling, thermosetting the tube into the shape of the forming track.

Abstract: A method and apparatus for curing large radial pneumatic tires using a plurality of like molds each having top and bottom mold sections provided with radially movable groove-defining tread segments which are automatically extended into a tire to be cured when the molds are positioned within an autoclave and which are automatically retracted when the molds are withdrawn from the autoclave to free the cured tire from its respective mold.

Abstract: The object of the invention is a process for the production of holes, particularly of micro-perforations, in a composite material, constituted by fibers embedded in a resinous matrix, characterized in that it consists in a preliminary step of carrying out on a specimen of the composite material, with the help of a laser beam, tests consisting in adjusting the duration of illumination at a predetermined place on the specimen, as well as the focusing and power of said laser beam, so as to confine the temperature in the mass of the material to a range of temperatures both greater than the thermal decomposition temperature of the matrix resin and below the temperature of altering the physical properties of the fibers, so as to carry out the elimination of the resin without affecting the physical integrity of the fibers, then in reproducing on the material (8) to be treated, at each position of a perforation to be made, the operating conditions of the laser (10, 12) so as to constitute in said material a through p

Abstract: This invention concerns a process for coating a substrate, and an extrusion coatig structure. According to the present process, the coating is provided by producing a bimodal polyethylene composition by subjecting ethylene, optionally with hydrogen and/or comonomers to polymerization or copolymerization reactions in a multistage polymerization sequence of successive polymerization stages. The polymerization reactions are carried out in the presence of a single site catalyst capable of forming a composition which comprises a low molecular weight component with an MFR2 of 20 g/10 min or more and a density higher than the density of the composition, and a high molecular weight component, said composition having a melt flow rate MFR2 of 5 g/10 min or more and a density of 915-960 kg/m3. The composition is extruded on the substrate as such or by adding 10 wt-% or less, calculated from the total weight of the coating, of high pressure PE-LD by blending into the extrusion composition or by coextrusion.

Abstract: A method provides for full or partial infusion of resin into three-dimensional, woven textile preforms. Resin film is placed at selected locations adjacent the preform, and the resin film may be separated from other areas of the preform using separator sheets or other materials. The preform is heated and may be vacuum-bagged to apply pressure, or may be rolled or fed through a die. The heat and pressure cause the resin to infuse into the selected areas of the preform adjacent the resin films. The amount of resin in the partial infusion is the same as is necessary to fully infuse the preform, but the resin remains localized in the selected areas until heated again at cure to cause the resin to flow throughout the preform. The method may also be used to fully infuse the preform with resin by providing sufficient temperature and time at that temperature during the initial infusion.

Abstract: A method and apparatus (20) for forming a fibrous web (50) includes a movable, foraminous forming surface (22) and a substantially stationary, vacuum-commutator duct system (24) which is located substantially subjacent the forming surface (22). The vacuum-commutator duct system (24) has an entrance opening (26) that changes in configuration along a longitudinal dimension (30) of the entrance opening (26).

Abstract: A gas spring for moving a load relative to a body includes a cylinder member having an axis, an inner surface forming a chamber, a rod end and a closed end, a piston rod seal/guide received in the rod end of the cylinder member, and a piston rod received in the seal/guide for movement into and out of the cylinder member. A floating piston is received in the cylinder member for movement along the axis and in sealed engagement with the inner wall to define in the chamber a gas section between the floating piston and the rod end and a closed end section between the floating piston and the closed end. A mass of gas under a pressure above atmospheric pressure is contained in the gas section. A powered drive is provided for moving the floating piston axially of the cylinder member to vary the volume of the gas section of the chamber. A sensing device senses a characteristic of the gas spring that is indicative of the force applied to the rod by the gas in the gas section and produces a signal indicative thereof.

Abstract: A clamp assembly for servicing electronic circuits is disclosed. The clamp assembly has two or more clamps (1, 2). The clamps are mounted on a rod (3) extending through each clamp. The space between the clamps may be stably increased or reduced by simply sliding one or both of the clamps along the rod to engage the ball bearing in each clamp on a dimple in the rod. A bushing is used as a pivot for each clamp. The rod passes through the bushing and the bushing holds the flanges of the clamp together on the rod. A spring (6) is fitted to the clamp arms (5A) by a locating dowel on each arm of the clamp. Squeezing the ends (5A) of the lever arms together allows the clamp to open. Each of the clamps is preferably lined with an insulating and heat resistant ceramic or plastic pad. These pads have V-shaped grooves formed in them to assist in the holding of small electrical components or electrical leads. This allows wiring etc.

Abstract: The present invention provides a new and improved portable ski and snowboard tuning table that can be employed with skis or snowboards of any length, width or binding style including downhill, telemark or cross-country. In addition, the device allows the skis or snowboards to be installed in either a horizontal or side mounted fashion depending on the user's preference. The device is integrated to include storage for all of the tools required to tune the skis as well as being completely portable in a compact package. The lower surface of the work surface has four legs that are pivotally connected and can be selectable rotated to either a retracted position beneath the work surface or an extended position for use of the table. The ski supports only support the skis from the lower surface and do not wrap around the edges of the ski providing an obstruction to the optimal full stroke tuning method.