Patents Issued in May 6, 2004
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Publication number: 20040084775Abstract: The present invention provides a solid device having a layered structure in which a film having a low dielectric constant serves as an interlayer insulating film or a protective membrane which will hardly undergo separation, and method for fabrication thereof.Type: ApplicationFiled: August 28, 2003Publication date: May 6, 2004Inventors: Takashi Sugino, Masaki Kusuhara, Masaru Umeda
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Publication number: 20040084776Abstract: Semiconductor equipment includes a semiconductor substrate, a plurality of transistors having a source cell and a drain cell disposed alternately on the substrate, and upper and lower layer wirings for electrically connecting the source cells and the drain cells. The lower layer wiring includes a first source wiring for connecting the neighboring source cells and a first drain wiring for connecting the neighboring drain cells. The upper layer wiring includes a second source wiring for connecting to the first source wiring and a second drain wiring for connecting to the first drain wiring. A width of the second source wiring is wider than that of the first source wiring, and a width of the second drain wiring is wider than that of the first drain wiring. The second source wiring and the second drain wiring are disposed alternately.Type: ApplicationFiled: October 21, 2003Publication date: May 6, 2004Inventors: Yutaka Fukuda, Hirofumi Abe, Yoshinori Arashima, Shigeki Takahashi
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Publication number: 20040084777Abstract: The semiconductor device comprises on a semiconductor substrate an insulating structure formed of a plurality of insulating films; an interconnection structure buried in the insulating structure and formed of a plurality of conducting layers; and a plurality of dummy patterns formed of the same conducting layer as the conducting layers forming the interconnection structure and buried in a surface side of the respective insulating films, and the dummy patterns near the interconnection structure are connected with each other through via portions. Thus, the insulating structure near the interconnection structure are reinforced, and the generation of cracks and peelings in the interfaces between the insulating films or in the inter-layer insulating films due to mechanical stresses or thermal stresses can be prevented.Type: ApplicationFiled: October 29, 2003Publication date: May 6, 2004Applicant: FUJITSU LIMITEDInventors: Akira Yamanoue, Tsutomu Hosoda
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Publication number: 20040084778Abstract: The semiconductor device comprises an insulating film 114 formed mainly of a film of polyallyl ether resin; an interconnection structure 116 buried in the insulating film 114, and having a via portion buried in a groove-shaped via hole and an interconnection portion formed on the via portion and having an eave-shaped portion horizontally extended beyond the via portion; an insulating film 118 formed on the insulating film 114 with the interconnection structure 116 buried in and formed mainly of a film of organosilicate glass; and an interconnection structure 120 buried in the insulating film 118 and connected to the interconnection structure 116. Thus, the stresses to be exerted to the insulating films are decreased, the generation of cracks and peelings generated in the interfaces between the insulating films and in the insulating films due to the stresses generated at the ends of the interconnection structures can be effective prevented.Type: ApplicationFiled: October 29, 2003Publication date: May 6, 2004Applicant: FUJITSU LIMITEDInventors: Tsutomu Hosoda, Akira Yamanoue
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Publication number: 20040084779Abstract: A bonding pad suitable for use in wire bonding an integrated circuit includes an approximately rectangular metal pattern. The bonding pad has at least one slot or hole in it, located at or adjacent to at least one corner of the approximately rectangular metal pattern. The slot or hole provides peeling stress relief.Type: ApplicationFiled: October 31, 2002Publication date: May 6, 2004Applicant: Taiwan Semiconductor Manufacturing Co. Ltd.Inventors: Tai-Chun Huang, Tze-Liang Lee
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Publication number: 20040084780Abstract: An improved dual damascene structure is provided for use in the wiring-line structures of multi-level interconnects in integrated circuit. In this dual damascene structure, low-K (low dielectric constant) dielectric materials are used to form both the dielectric layers and the etch-stop layers between the metal interconnects in the IC device. With this feature, the dual damascene structure can prevent high parasite capacitance to occur therein that would otherwise cause large RC delay to the signals being transmitted through the metal interconnects and thus degrade the performance of the IC device. With the dual damascene structure, such parasite capacitance can be reduced, thus assuring the performance of the IC device.Type: ApplicationFiled: July 29, 2003Publication date: May 6, 2004Inventors: Tri-Rung Yew, Yimin Huang, Water Lur, Shih-Wei Sun
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Publication number: 20040084781Abstract: An improved integrated circuit package for providing built-in heating or cooling to a semiconductor chip is provided. The improved integrated circuit package provides increased operational bandwidth between different circuit devices, e.g. logic and memory chips. The improved integrated circuit package does not require changes in current CMOS processing techniques. The structure includes the use of a silicon interposer. The silicon interposer can consist of recycled rejected wafers from the front-end semiconductor processing. Micro-machined vias are formed through the silicon interposer. The micro-machined vias include electrical contacts which couple various integrated circuit devices located on the opposing surfaces of the silicon interposer. The packaging includes a Peltier element.Type: ApplicationFiled: June 26, 2003Publication date: May 6, 2004Applicant: Micron Technology, Inc.Inventors: Kie Y. Ahn, Leonard Forbes, Eugene H. Cloud
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Publication number: 20040084782Abstract: A system for interconnecting a set of device chips by means of an array of microjoints disposed on an interconnect carrier is taught. The carrier is provided with a dense array of microjoint receptacles with an adhesion layer, barrier layer and a noble metal layer; the device wafers are fabricated with an array of microjoining pads comprising including an adhesion layer, barrier layer and a fusible solder layer with pads being located at matching locations in reference to the barrier receptacles; said the device chips are joined to said the carrier through the microjoint arrays resulting in interconnections capable of very high input/output density and inter-chip wiring density.Type: ApplicationFiled: October 23, 2003Publication date: May 6, 2004Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: John Harold Magerlein, Kevin Shawn Petrarca, Sampath Purushothaman, Carlos Juan Sambucetti, Richard Paul Volant, George Frederick Walker
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Publication number: 20040084783Abstract: An integrated circuit design is provided capable of operating in multiple insertion orientations. In particular, the inventive circuit design includes an integrated circuit package having a plurality of contact elements extending from the integrated circuit package and arranged symmetrically thereon for enabling the integrated circuit to be inserted on a circuit board in at least two discrete orientations. A plurality of the contact elements are designated as orientation pins, the orientation pins being arranged such that, upon integrated circuit package power up, the orientation pins transmit orientation signals indicative of the integrated circuit packages insertion orientation in the circuit board. A plurality of multiplexer devices are provided for routing signals between the contact elements and integrated circuit functional circuitry in response to the orientation signals from the orientation pins.Type: ApplicationFiled: July 16, 2003Publication date: May 6, 2004Applicant: Globespan Virata Inc.Inventor: David Stuart Baker
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Publication number: 20040084784Abstract: A packaged electronic component and a method for packaging an electronic component are proposed, in which a chip is attached to the upper side of a die pad. The die pad and the chip are enclosed by a plastic molding compound. A gel is disposed on the upper side of the chip and on the lower side of the die pad.Type: ApplicationFiled: December 22, 2003Publication date: May 6, 2004Inventors: Stefan Mueller, Frieder Haag
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Publication number: 20040084785Abstract: The present invention provides a resin-encapsulated semiconductor apparatus comprising a semiconductor device having a ferroelectric film and a surface-protective film, and an encapsulant member comprising a resin; the surface-protective film being formed of a polyimide. The present invention also provides a process for fabricating a resin-encapsulated semiconductor apparatus, comprising the steps of forming a film of a polyimide precursor composition on the surface of a semiconductor device having a ferroelectric film; heat-curing the polyimide precursor composition film to form a surface-protective film formed of a polyimide; and encapsulating, with an encapsulant resin, the semiconductor device on which the surface-protective film has been formed. The polyimide may preferably have a glass transition temperature of from 240° C. to 400° C. and a Young's modulus of from 2,600 MPa to 6 GPa. The curing may preferably be carried out at a temperature of from 230° C. to 300° C.Type: ApplicationFiled: September 29, 2003Publication date: May 6, 2004Applicant: Hitachi, Ltd.Inventors: Jun Tanaka, Keiko Isoda, Kiyoshi Ogata
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Publication number: 20040084786Abstract: A priming system for the carburetor of a small internal combustion engine which is used with a lawnmower, for example, in which the priming system is remotely actuated. The priming system includes a priming feature for supplying an amount of liquid fuel to the carburetor throat to aid in starting the engine, and an enrichment feature for providing an enriched fuel supply to the engine during a warm-up period. In one embodiment, the priming system includes an automatic primer disabling feature which is operative when the engine is warm to block the supply of priming fuel to the carburetor throat and thereby prevent priming during a warm engine re-start. In another embodiment, the priming system includes a primer reduction feature, which is operative when the engine is warm to provide a reduced amount of priming fuel to the carburetor throat during a warm engine re-start, with respect to the amount of fuel which is supplied during a cold engine start.Type: ApplicationFiled: May 21, 2003Publication date: May 6, 2004Inventors: Gordon E. Rado, John F. Hoffman, Adam F. Cox
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Publication number: 20040084787Abstract: A bottle fill humidifier includes a humidification housing removably positioned on a water reservoir base. At least one water bottle is mounted to the base. In order to facilitate an easier and faster means of replacing the humidifier filter and maintain the rigidity of the humidifier, a latch is provided to secure the housing to the base via the mounted bottle.Type: ApplicationFiled: November 5, 2002Publication date: May 6, 2004Applicant: Emerson Electric Co.Inventors: Matthew Williams, Steven Rhea, John Garner
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Publication number: 20040084788Abstract: A fuel mixer box is provided for supplying a fuel mixture to each cylinder of an engine. The fuel mixer box includes an housing defining a chamber for receiving combustion gases generated by the engine during the operation thereof. Input conduits have inputs connectable to a fuel source for receiving fuel therefrom and outputs. Output conduits have inputs communicating with the outputs of corresponding input conduits and outputs connectable to corresponding cylinders of the engine. In addition, the output conduits communicate with the chamber to receive combustion gases to be mixed with the fuel to provide the fuel mixture. In addition, fuel may be supplied directly to the output conduits through corresponding venturis within the housing.Type: ApplicationFiled: November 1, 2002Publication date: May 6, 2004Inventors: Don R. Bayer, Gerald C. Ruehlow
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Publication number: 20040084789Abstract: The present invention provides a humidifier for fuel cells having a housing, a metal heat-exchange plate, a water-trapping reservoir, water permeable stuffing material and water absorbable and permeable stuffing material; the heat-exchange plate, disposed in the housing, divides the housing into a first gas passage and a second gas passage, the water permeable stuffing material is disposed in the first gas passage, and the water saturation aperture and the water-trapping reservoir are disposed underneath the heat-exchange plate with the water-trapping reservoir having the water absorbable and permeable material disposed therein, thus the dry and cold oxygen/air shall be channeled to the first gas passage within the housing of the humidifier and conveyed to the oxygen/air inlet of the fuel cell, and high-temperature and high-moisture exhaust gas discharged from the fuel cell is introduced to the second gas passage within the housing of the humidifier, such that water and heat of the exhaust gas in the second gType: ApplicationFiled: January 2, 2003Publication date: May 6, 2004Applicant: Industrial Technology Research InstituteInventors: Yi-Yie Yan, Jar-Lu Huang, Keh-Chyun Tsay, Falin Chen, Hsin-Sen Chu
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Publication number: 20040084790Abstract: A method of manufacturing an electro-active lens is disclosed. The lens is manufactured by providing a lens blank having a front and back surface, a thickness, and an index of refraction. An electro-active element is placed on one of the front or back surfaces of the lens blank. A covering surface is then formed over the surface of the lens blank containing the electro-active element. In some embodiments, the electro-active lens may then be surfaced to provide a desired fixed optical power and edged to fit within a spectacles frame.Type: ApplicationFiled: August 20, 2003Publication date: May 6, 2004Inventors: Ronald D. Blum, William Kokonaski, Dwight P. Duston
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Publication number: 20040084791Abstract: The present invention relates to biodegradable polyurethane capsules for molded product of polyurethane foam and to methods for manufacturing the same, the inventive biodegradable polyurethane capsule comprises a powder made from a biodegradable material, first coating layer of calcium alginate gel formed on the surface of said power and second coating layer of foamable polyurethane resin formed on the surface of said first coating layer. Products manufactured from the biodegradable polyurethane capsule according to the present invention can be widely used as heat isolating materials and heat isolating structural materials because the basic physical properties such as heat insulation are good.Type: ApplicationFiled: December 29, 2003Publication date: May 6, 2004Inventors: Kyu-Tek Han, Jung-Hoon Choi, In-Gyu Lee, lk-Soo Chung
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Publication number: 20040084792Abstract: A dental device and method of making it, by shaping a first and a second wax-like polymerizable dental material to form a polymerizable dental device.Type: ApplicationFiled: October 16, 2003Publication date: May 6, 2004Inventors: Benjamin J. Sun, Andrew M. Lichkus
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Publication number: 20040084793Abstract: Method of forming a (CFX)n containing adsorbent composition by combining a fine particle (CFX)n starting material with a non-fluorinated carbonaceous material prior to the formation of a solid body and intermediate materials employed in conducting the method.Type: ApplicationFiled: October 31, 2002Publication date: May 6, 2004Inventors: Martin Bulow, Donald P. Satchell, Edward F. Ezell, Jan-Thomas Kuhnert, Wolfgang Schops
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Publication number: 20040084794Abstract: A method for producing a moulded part in a mould comprising at least one cavity that is surrounded by a mould wall. The temperature of the mould wall and the internal pressure of the mould are measured and analyzed and the analysis is used to regulate the injection speed, the dwell pressure, the dwell pressure time and/or the mould temperature.Type: ApplicationFiled: September 30, 2003Publication date: May 6, 2004Inventor: Jurgen Frey
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Publication number: 20040084795Abstract: The present invention uses supercritical and near supercritical fluid technology for the processing of polymer-containing formulations without induced foaming, giving benefits of either reduced melt viscosity and/or lower melt temperatures. Its application is particlarly beneficial to difficult to process materials, including unplasticised PVC, polycarbonate, PTFE, UHMWPE and polymers containing high loadings of fillers of organic origin. Shear and thermally sensitive materials can also be processed using this method with less risk of degradation, due to the lower shear input and reduced processing temperatures necessary. The production of foamed ceramic materials and metallic components by such a method is also disclosed.Type: ApplicationFiled: October 14, 2003Publication date: May 6, 2004Inventors: Peter Ridsdale Hornsby, Siobhan Matthews
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Publication number: 20040084796Abstract: A side-by-side or eccentric sheath-core bicomponent fiber wherein each component comprises a different poly(trimethylene terephthalate) composition and wherein at least one of the compositions comprises styrene polymer dispersed throughout the poly(trimethylene terephthalate), and preparation and use thereof.Type: ApplicationFiled: September 10, 2003Publication date: May 6, 2004Inventors: Jing C. Chang, Joseph V. Kurian, Ray W. Miller
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Publication number: 20040084797Abstract: Disclosed herein are a mixed resin compound, a resin pipe, a process for producing said resin pipe, and a photosensitive drum. The resin compound meets at least one of the following requirements. It is a mixture of two or more kinds of resins blended in a specific manner, it undergoes annealing under specific conditions, and it has specific values of surface roughness, Vickers hardness, coefficient of linear expansion, flexural modulus, and thermal conductivity. The resin pipe is suitable for use as the cylindrical base of the photosensitive drum for electrophotographic machines, such as copying machines, facsimiles, and printers. It is superior in surface smoothness, dimensional stability, coatability, and handlability, and hence it is very little vulnerable to damage during handling and dimensional change due to resin shrinkage and is superior in heat resistance (desirable for solvent removal) and mechanical strength (desirable for flange fitting).Type: ApplicationFiled: October 23, 2003Publication date: May 6, 2004Applicant: BRIDGESTONE CORPORATIONInventors: Munenori Iizuka, Kunio Machida
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Publication number: 20040084798Abstract: A carbonaceous composite material molded from a carbonaceous composite compound composed mainly of graphite, a thermosetting resin, and a fibrous base material, wherein molding is carried out in such a way that said fibrous base material is oriented in said carbonaceous composite material; a process for producing said carbonaceous composite material; a fuel cell separator having said carbonaceous composite material as a component; and a polymer electrolyte fuel cell. The carbonaceous composite material can be produced by injection molding, transfer molding or extrusion molding without difficulties encountered in the past. It has high strength, with a minimum amount of warpage. It contributes to productivity.Type: ApplicationFiled: October 28, 2003Publication date: May 6, 2004Applicant: Nisshinbo Industries, Inc.Inventors: Kazuo Saito, Atsushi Hagiwara, Takashi Maki, Atsushi Miyazawa
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Publication number: 20040084799Abstract: Systems and methods for making a material composition are disclosed. The method includes mixing a thermoset polymer, a petroleum distillate, a release agent, and a catalyst to form an admixture. A cellulosic material is mixed with the admixture to form a generally homogenous furnish. The system includes a mixing chamber, a feeding chamber, and a die. The die includes a pressing chamber, which has a volume formed by first and second platens. The platens are in facing opposition to one another and have a length extending continuously from an entrance to an exit of the die. The platens have a plurality of orifices and heating elements disposed along the length. The platens are disposed in first and second positions. The first position forms a first volume and the second position forms a second volume.Type: ApplicationFiled: November 1, 2002Publication date: May 6, 2004Inventors: Sean Robert Broker, Jonathan Philip Alexander, David J. Bleha, Randy Jon Clark, Walter B. Davis
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Publication number: 20040084800Abstract: In a method of manufacturing a friction member used for a vibration wave driving apparatus including a vibration member, a contact member which is brought into frictional contact with the vibration member and relatively moved by vibrations produced in the vibration member, and the friction member formed on one of friction portions of the vibration member and contact member, a molded member is formed by compression molding of a fluoroplastic powder and an additive, a sintered member is formed by sintering the molded member, a sheet is formed by cutting the sintered member in the form of a sheet, and a modified layer formed by cutting is removed from the friction surface of the sheet.Type: ApplicationFiled: August 20, 2003Publication date: May 6, 2004Applicant: CANON KABUSHIKI KAISHAInventors: Satoru Kitajima, Yutaka Maruyama
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Publication number: 20040084801Abstract: A method of fabricating discrete risers for shelving units includes the step of providing a plurality of openable and closable mold segments arranged end to end along a continuous path, and circulating the plurality of mold segments through multiple revolutions of the continuous path such that the mold segments are closed while traveling along a molding section of the continuous path. A molten stream of plastic is continuously extruded at an upstream end of the molding section and into mold cavities of the closed or closing mold segments. A pressure differential is applied to the mold cavities of the closed mold segments to conform the molten stream of plastic to the mold cavities. A continuous train of interconnected risers is ejected at a downstream end of the molding section. Discrete risers are separated from the continuous train.Type: ApplicationFiled: November 4, 2002Publication date: May 6, 2004Inventors: Gregory S. Floyd, Robert G. States
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Publication number: 20040084802Abstract: Improvements in preventing heat- and moisture-shrink problems in specific polypropylene tape fibers are provided. Such tape fibers are basically manufactured through the initial production of polypropylene films or tubes which are then slit into very thin, though flat (and having very high cross sectional aspect ratios) tape fibers thereafter. These inventive tape fibers (and thus the initial films and/or tubes) require the presence of relatively high amounts of certain compounds that quickly and effectively provide rigidity to the target polypropylene tape fiber. Generally, these compounds include any structure that nucleates polymer crystals within the target polypropylene after exposure to sufficient heat to melt the initial pelletized polymer and allowing such an oriented polymer to cool. The compounds must nucleate polymer crystals at a higher temperature than the target polypropylene without the nucleating agent during cooling.Type: ApplicationFiled: November 2, 2002Publication date: May 6, 2004Inventors: Brian G. Morin, Martin E. Cowan, Jack A. Smith
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Publication number: 20040084803Abstract: A three-layer microwavable, plastic wrap having a core layer between a cling layer and a release layer. The cling layer comprises a base resin and an effective amount of a hydrocarbon tackifier to provide sufficient cling to different surfaces such as aluininum, stainless steel, ceramic, plastic and laninated cardboard. The release layer includes an effective amount of an anti-blocking agent to facilitate dispensing of the wrap from a dispensing roll.Type: ApplicationFiled: October 28, 2003Publication date: May 6, 2004Inventor: Douglas D. Bonke
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Publication number: 20040084804Abstract: A continuous process for the preparation of absorbable polymers and their processing into articles is disclosed. The process comprises a reactive extrusion step where cyclic monomers and other additives are polymerized into absorbable homopolymer or copolymer compositions, which are then extruded continuously and molded into desirable articles using regular molding techniques.Type: ApplicationFiled: April 28, 2003Publication date: May 6, 2004Inventor: Amy T. Jonn
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Publication number: 20040084805Abstract: A continuous process for the preparation of absorbable block copolymers and their processing into monofilament fibers is disclosed. The process comprises a reactive extrusion step where cyclic monomers and other additives are polymerized in stages to form the absorbable block copolymer compositions, which are then continuously extruded and spun into monofilament fibers using regular fiber spinning and drawing techniques.Type: ApplicationFiled: April 28, 2003Publication date: May 6, 2004Inventor: Amy T. Jonn
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Publication number: 20040084806Abstract: A process of fabricating a molded body. A molding tool operable to mold the body is submersed under a body of liquid to a depth sufficient to exert a pressure greater than atmospheric pressure on at least one of the molding tool and resin forming the molded body.Type: ApplicationFiled: December 19, 2003Publication date: May 6, 2004Inventors: Paul S Biermann, Walter Chappas
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Publication number: 20040084807Abstract: Injection-moulding machine for producing plastic containers, comprising an upper platen (1), a moving mould-carrying platen (2), a support bar (3) for lips constituted by two respective separable members (15a, 15b), a plurality of male members (6) applied to said upper platen (1), a cavity-carrying platen (4) in which there are provided removable means (16) adapted to delimitate the travel of said moving mould-carrying platen (2) towards the cavity-carrying platen (4), so that the moving mould-carrying platen (2) can be positioned at a pre-selectable distance with respect to the cavity-carrying platen (4). Said removable means (16) are referably constituted substantially by a number of resting cylinders, or parallelepipeds, arranged parallel with respect to each other and having the same height, the axis of which is parallel to the moving direction of the moving mould-carrying platen (2).Type: ApplicationFiled: January 27, 2003Publication date: May 6, 2004Inventors: Luigino Bischer, Paolo Fugolo, Matteo Zoppas
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Publication number: 20040084808Abstract: A mold flow pin that is a cylindrical element and includes first and second ends. The first end is attached to an ejector plate of an injection mold. The second end of the cylindrical element is disposed near a gate opening of a mold cavity. The second end includes flow modifying geometry formed on the cylindrical element. The flow geometry is designed to increase a mass of plastic material near the gate opening. The geometry also reduces the injection pressure of the plastic material and increases a flow rate of plastic material into the mold cavity when compared with conventional injection molding gate orifices.Type: ApplicationFiled: November 6, 2002Publication date: May 6, 2004Inventor: Ronald D. Clarke
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Publication number: 20040084809Abstract: Servo side shuttle apparatus and method for a molding machine includes structure and/or steps whereby a shuttle plate is disposed adjacent at least one of a first mold half and a second mold half of the molding machine. A guidance assembly is coupled to the mold half and guides the shuttle plate linearly across a molding face of the mold half. A drive mechanism is provided to drive the shuttle plate in a linear direction. An operation structure is coupled to the shuttle plate and is configured to perform an operation on a molded article disposed either in the mold cavity or on the mold core. The operation may include removing the molded article from a mold core, applying a label to a mold cavity, and/or closing the lid of a molded article while it is resident on the mold core.Type: ApplicationFiled: November 5, 2002Publication date: May 6, 2004Inventors: James A. Vanderploeg, Jacek Kalemba, Nicholas Seston
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Publication number: 20040084810Abstract: A three-step method in which a printed circuit board (PCB) is laser drilled to form a via, and the internal walls of the via are plated with conductive material to connect conductive layers at the upper and lower ends of the via. In the first step a first laser removes a first portion of the board. In the second step a second laser removes a further portion of the board to form a via. In the third step a third laser ablates conductive material at the bottom of the via to plate the inner walls of the via.Type: ApplicationFiled: November 1, 2002Publication date: May 6, 2004Inventors: Winco Kam-Chuen Yung, Esther Sau-Wai Leung, Mark D. Owen
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Publication number: 20040084811Abstract: A method is provided for fabricating a three-dimensional device. The method includes the steps of providing a container defining a chamber and filling the chamber with a polymerizable material. Masks are positioned between a polymerizing agent and corresponding portions of polymerizable material. The polymerizing agent passes through the masks so as to polymerize selected portions of the polymerizable material within a chamber of the container and form the three-dimensional device.Type: ApplicationFiled: November 1, 2002Publication date: May 6, 2004Inventors: David J. Beebe, David J. Quirk
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Publication number: 20040084812Abstract: The present invention relates to a process for the sterilization and/or germ reduction of impression material by means of radiation.Type: ApplicationFiled: June 20, 2003Publication date: May 6, 2004Applicant: Heraeus Kulzer GmbH & Co. KGInventors: Martin Grunwald, Norbert Weber, Birgit Esser
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Publication number: 20040084813Abstract: A method of molding a decorative product packaging, comprising the steps of: molding a product container or cap; applying a UV curable liquid to surfaces and/or cavities in the container or cap; then exposing the UV curable liquid to UV radiation to form a solid coating adhered to surfaces and/or filling cavities on the container or cap. The present invention provides dramatic effects, particularly where the container or cap are clear or tinted, because the solid coating can be tinted a contrasting color, providing a striking contrast to the container or cap.Type: ApplicationFiled: October 31, 2002Publication date: May 6, 2004Inventor: David J. Prague
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Publication number: 20040084814Abstract: A three-dimensional object fabricator with an unbound powder removal system is disclosed. The object fabricator forms an object by binding regions of unbound powder in a chamber having the unbound powder removal system operably secured thereto. Unbound powder is removed from the chamber by the unbound powder removal system.Type: ApplicationFiled: October 31, 2002Publication date: May 6, 2004Inventors: Melissa D. Boyd, Jeffrey Nielsen
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Publication number: 20040084815Abstract: The present invention discloses a method of fabricating a composite material hockey stick shaft using internal bladder pressure molding technology. The bladder is inserted over a mandrel and composite materials are disposed on the bladder forming a soft, uncured piece. The mandrel is removed and the piece is disposed in a mold following which air pressure is applied to the bladder which deforms the piece to conform to the shape of the cavity. The addition of pressure and heat cures the composite materials and produces a finished hockey stick shaft.Type: ApplicationFiled: May 20, 2003Publication date: May 6, 2004Inventor: Ray Blotteaux
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Publication number: 20040084816Abstract: An adapter is disclosed for cooperatively engaging a plunger tip and a plunger rod for forcing molten metal from a shot sleeve into a die of a die-casting apparatus. The adapter includes a distal end adapted to cooperatively engage the plunger tip, an opposite proximal end adapted to cooperatively engage the plunger rod, and a length between the distal end and the proximal end. The adapter has at least one passage extending from the proximal end to the distal end to permit the flow of coolant there through. The adapter is formed of a beryllium-copper alloy to facilitate the transfer of heat from the plunger tip to the coolant passing through the passage of the adapter.Type: ApplicationFiled: October 29, 2003Publication date: May 6, 2004Inventor: Terry Hildreth
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Publication number: 20040084817Abstract: A rolling-lobe air spring (2) includes a cover (cover plate, 6-I or 6-II), a roll-off piston (8) and a rolling-lobe flexible member (4). A support bell (16-I or 16-II) is provided in order to solve stability problems. The support bell (16-I or 16-II) is rigidly connected to the cover (6-I or 6-II) in order to provide a guide of high stiffness to the rolling-lobe flexible member. The support bell (16-I or 16-II) is rigidly connected to the cover (6-I or 6-II) and can be arranged within or outside of the cover (6-I or 6-II). For an inner-lying support bell (16-I) the upper end of the rolling-lobe flexible member is attached to the throat region (18-I) of the support bell (16-I) with the aid of a clamp ring (12-I) applied from the outside. For an outside-lying support bell (16-II), the throat region (18-II) of the support bell (16-II) is deformed against the upper end of the rolling-lobe flexible member and against a support ring (12-II) disposed therebelow.Type: ApplicationFiled: October 27, 2003Publication date: May 6, 2004Inventors: Holger Oldenettel, Jens-Uwe Gleu
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Publication number: 20040084818Abstract: A fluid-elastomeric damper assembly operable for damping relative motion between a first structure and a second structure including a housing structure grounded to the first structure and a plurality of elastomer seals coupled to the housing structure, the housing structure and the plurality of elastomer seals defining a fluid-elastomeric chamber operable for containing a fluid. The fluid-elastomeric damper assembly also including one or more piston structures disposed within the housing structure and the fluid-elastomeric chamber, the one or more piston structures grounded to the first structure and driven by the second structure, and the one or more piston structures each including a first substantially fluid-filled chamber and a second substantially-fluid-filled chamber in communication via an orifice, the first substantially fluid-filled chamber and the second substantially fluid-filled chamber also in communication with the fluid-elastomeric chamber.Type: ApplicationFiled: November 6, 2002Publication date: May 6, 2004Inventor: Donald D. Russell
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Publication number: 20040084819Abstract: An orifice device is adapted to be disposed within a fluid chambers of a vibration absorption device. The fluid chamber is defined by at least a wall portion made of resilient material. The orifice device includes an orifice casing, a retaining cover and a membrane that is made of resilient material, such as rubber. The membrane is adapted to be clamped between the orifice casing and the retaining cover. A lock mechanism serves to lock the orifice casing and the retaining cover together when the orifice casing and the retaining cover rotate relative to each other about an axis while the orifice casing and the retaining cover are overlapped with each other.Type: ApplicationFiled: October 27, 2003Publication date: May 6, 2004Applicants: KABUSHIKI KAISHA TOGO SEISAKUSHO, TOKAI RUBBER INDUSTRIES, INC.Inventors: Hiroki Okada, Yasunori Makiuchi, Takanobu Nanno, Hideki Maehashi, Akio Saiki
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Publication number: 20040084820Abstract: A vehicle shock absorber includes a housing, and a shock-absorbing member. The housing has at least one hollow formed therein, is formed of a rigid material, and is fixed to a bone structural member of vehicles. The shock-energy absorbing member is disposed in the hollow of the housing at least, and is formed of a super plastic polymer material. The super plastic polymer material exhibits a tensile breaking elongation of 200% or more, a yield strength of 20 MPa or more with respect to a predetermined strain, and a tensile elastic modulus of 400 MPa or more.Type: ApplicationFiled: October 29, 2003Publication date: May 6, 2004Applicant: TOKAI RUBBER INDUSTRIES, LTD.Inventors: Rentaro Kato, Takahiro Aoi
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Publication number: 20040084821Abstract: The invention comprises a vehicle strut assembly. A strut has a first seat mounted to the strut and a second seat mounted to a vehicle body. A spring is mounted between the first seat and the second seat and is disposed around the strut. The spring has a compressed state and an uncompressed state. In the compressed state, the spring has a middle portion that defines a spring centerline. In the uncompressed state, the spring has ends portions extending towards opposite sides of the spring centerline.Type: ApplicationFiled: November 6, 2002Publication date: May 6, 2004Inventors: Marlon V. Bottene, Joseph A. Fader, Steven J. Doyle, Monte G. Williams, Steven G. Saieg, George N. Lasic, Thomas R. King
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Publication number: 20040084822Abstract: A bushing is shown to include an inner metal component having a performance tuning feature integrated therewith. An elastomer is bonded to the inner metal component. The performance tuning feature may include one or more ribs extending radially outwardly from and circumferentially about the main elongated body portion of the inner metal component.Type: ApplicationFiled: November 5, 2002Publication date: May 6, 2004Inventors: Brent R. Collyer, Daniel R. Adema, Christopher W. Forrest
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Publication number: 20040084823Abstract: A power clamp for use in a manufacturing environment. The power clamp includes a unitized body having a bore in one end thereof The power clamp also includes a piston arranged within the bore and an end cap secured to the body on the end having the bore. The power clamp has a plurality of first links, one of the first links connected to the piston and at least one second link connected to the first link at a pivot point. A plunger is arranged within an orifice of the body and that plunger is connected to a second link. The power clamp also includes a plurality of identical pins with the pins connecting the links. The power clamp also includes a side plate connected to the body to enclose the clamp and protect it from the manufacturing environment.Type: ApplicationFiled: October 30, 2002Publication date: May 6, 2004Inventors: Matthew Rentz, Henry Dykstra
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Publication number: 20040084824Abstract: A wafer support device is provided including a fixed base, a guiding device on the fixed base, a movable base disposed movably vertically with respect to the fixed base by the cross roller guide, and a first pressing device fixed on the fixed base. The first pressing device presses the movable base. A wafer support device is also provided which a &thgr; stage rotatably disposed on the movable base with the vertical direction as a rotation axis, a linear motor fixed on the fixed base, a contact bar disposed on the movable base, a load control device controlling a load of pressing, and a controller controlling a pressing force by the pressing device based on the load detected by the load sensor.Type: ApplicationFiled: October 29, 2003Publication date: May 6, 2004Applicant: NEC CORPORATIONInventor: Toshinobu Ogatsu