Abstract: A method for forming interlevel dielectric levels in a multilevel interconnect structure formed by a damascene process. The conductive features characteristic of the damascene process are formed in a removable mandrel material for each level of the interconnect structure. In at least one level, a portion of the mandrel material underlying the bond pad is clad on all sides with the metal forming the conductive features to define a support pillar. After all levels of the interconnect structure are formed, the mandrel material surrounding the conductive features is removed to leave air-filled voids that operate as an interlevel dielectric. The support pillar is impermeable to the etchant such that mandrel material and metal inside the support pillar is retained. The support pillar braces the bond pad against vertical mechanical forces applied by, for example, probing or wire bonding and thereby reduces the likelihood of related damage to the interconnect structure.

Abstract: A transistor (10) is formed as a matrix of transistor cells (13) that have drain metal strips (50) for contacting drains (15) of the transistor cells and source metal strips (55) for contacting sources (35) of the transistor cells. An interconnect layer (1030) overlying the matrix of transistor cells has first portions (201) that contact one the drain metal strips with first and second vias (79) and second portions (101) that contact one of the source metal strips with third and fourth vias (78).

Abstract: A structure for reducing stress-induced voiding in an interconnect of an integrated circuit, the interconnect having a first portion and at least a second portion narrower than the first portion. The structure comprises at least one interior slot disposed in the first portion in proximity to the intersection of the first portion and the second portion. The present invention also includes methods of making the interconnect and the structure. A conductive interconnect structure comprises a first portion and at least a second portion narrower than the first portion; and a stress reducing structure comprising a transition portion formed at an intersection of the first portion and the second portion.

Abstract: A wiring board houses a bare radio-frequency IC. Shield wiring films are provided above and below the IC. A plurality of shield interlayer-connection conductor films, i.e., shield via-holes, is provided so as to surround the IC. The shield wiring films and the shield interlayer-connection conductor films define a shield cage, which can electrostatically shield the IC. Thus, there is no need to attach a shield cap.

Abstract: The invention provides a semiconductor device that allows high-scale integration of a pattern layout to reduce the pitch of wiring lines without changing a design rule, and to provide an electro-optical unit and an electronic apparatus including the semiconductor device. The semiconductor device can include a substrate, which has the following layers thereon: in order, a first conductive layer, an insulating interlayer having a contact hole therein at a position where it overlaps the first conductive layer in plan view, and a second conductive layer electrically connected to the first conductive layer via the contact hole. The first conductive layer entirely overlaps the contact hole, while the second conductive layer partially overlaps the contact hole in plan view. The first conductive layer is in contact with the second conductive layer at a part of a bottom area of the contact hole.

Abstract: Disclosed is a semiconductor device including: a semiconductor substrate; at least one layer of a first insulating film formed above the semiconductor substrate and having a relative dielectric constant of 3.8 or less, an entire layer of the first insulating film being separated at least near four corners of the semiconductor substrate by a lacking portion that extends along the four corners; and a second insulating film covering a side face of the entire layer of the first insulating film in the lacking portion on a center side of the semiconductor substrate and having a relative dielectric constant of over 3.8.

Abstract: A semiconductor device includes a first wiring layer section formed above a semiconductor substrate; and a second wiring layer section formed on the first wiring layer section. The latter includes a first interlayer insulating film; a plurality of first via-plugs formed in the first interlayer insulating film separated from each other by a first distance; and a plurality of first wiring lines formed on the plurality of first via-plugs in the first interlayer insulating film and connected with the plurality of first via-plugs. The second wiring layer section includes a second interlayer insulating film; a plurality of second via-plugs formed in the second interlayer insulating film, separated from each other by a second distance which is longer than the first distance; and a plurality of second wiring lines formed on the plurality of second via-plugs in the second interlayer insulating film and connected with the plurality of second via-plugs, respectively.

Abstract: Methods of selectively removing post-etch polymer material and dielectric antireflective coatings (DARC) without substantially etching an underlying carbon-doped low k dielectric layer, and compositions for the selective removal of a DARC layer and post-etch polymer material are provided. A composition comprising trimethylammonium fluoride is used to selectively etch a dielectric antireflective coating layer overlying a low k dielectric layer at an etch rate of the antireflective coating layer to the low k dielectric layer that is greater than the etch rate of the antireflective coating to a TEOS layer. The method and composition are useful, for example, in the formation of high aspect ratio openings in low k (carbon doped) silicon oxide dielectric layers and maintaining the integrity of the dimensions of the formed openings during a cleaning step to remove a post-etch polymer and antireflective coating.

Abstract: One via contact through which upper and lower interconnections of a multilevel interconnection are connected to each other is provided when the width or volume of the lower interconnection is not larger than a given value. A plurality of via contacts are arranged at regular intervals, each of which is not larger than a given value, in an effective diffusion region of voids included in the lower interconnection, when the width or volume of the lower interconnection exceeds a given value.

Abstract: A semiconductor device and a method of manufacturing the same which yields high reliability and a high manufacturing yield. The semiconductor device includes a metal line layer having a plurality of metal line patterns spaced apart from each other, and at least one underlying layer under the metal line layer, wherein the space between two adjacent metal line patterns has a sufficient width to prevent a crack from occurring in one or more of the underlying layers. The cracking of an underlying layer may also be prevented by providing a slit in a direction parallel to the space between two adjacent metal line patterns at a sufficient distance from the space between the two adjacent metal line patterns.

Abstract: An electroluminescent device (1) comprises a supporting substrate (2); at least two electrodes (3) positioned on the substrate (2); at least a three-dimensional percolated layer (4), positioned on the substrate (2) between the two electrodes (3), having a metallic mesoporous structure defining a multitute of cavities of micrometric or nanometric dimensions. Present in the cavities of the three-dimensional percolated layer (4) are a multitude of luminescent inclusions (5), which operate to emit light when energized by electrons which, as a result of electron tunneling, effect pass through the three-dimensional percolated layer (4).

Abstract: There is provided a bonding material and a bonding method which enable lead-free bonding that can replace high-temperature soldering. The bonding material of the present invention comprises a dispersion in an organic solvent of composite metallic nano-particles having such a structure that a metal core of a metal particle having an average particle diameter of not more than 100 nm. The bonding material can be advantageously used in a stepwise bonding process containing at least two bonding steps.

Abstract: The invention provides an optical device that enables a mutual electrical connection between the stacked semiconductor substrates to be realized with ease and high reliability and to provide for miniaturization. The optical device has a first semiconductor substrate having an optical part and a first pad, a second semiconductor substrate having an integrated circuit and a second pad which is stacked under the first semiconductor substrate, a through-hole continuously extending through the first and the second semiconductor substrate, and a conductive part so formed as to include the inside of the through-hole.

Abstract: The present invention provides a semiconductor contact structure and a method of forming the same. An interlayer dielectric is patterned to form a contact hole that exposes a predetermined region of conductive material on a semiconductor substrate. A recess is formed in the conductive material exposed by the contact hole and undercuts the walls that define the sides of the contact hole such that the recess is wider than the contact hole. A contact plug fills the recess as well as the contact hole. The contact plug is maintained in position stably atop the underlying conductive material because the lower part of the contact plug is wider than the upper part of the contact plug. Accordingly, the contact plug will not fall over even if the interlayer dielectric reflows during a subsequent process.

Abstract: A first inventive semiconductor device includes: a die pad 1; a mother chip 2; a daughter chip 3; a conductor film 7 formed on the back surface of the daughter chip 3; bumps 4; a lead 5; and a bonding wire 6, as shown in FIG. 1B. The conductor film 7 is connected to an external member via the bonding wire 6 and the lead 5, thus stabilizing a substrate potential. In addition, the conductor film 7 has a high heat conductivity and a low electrical resistance, thereby improving the heat radiation performance of the semiconductor device and suppressing noise radiation.

Abstract: A semiconductor device includes a substrate provided with terminals for connecting conductive wires, a first semiconductor chip mounted face-up on the substrate and electrically connected to the terminals provided on the substrate by the conductive wires and a second semiconductor chip having a projecting part formed on a rear surface thereof and attached onto the first semiconductor chip via the projecting part.

Abstract: The flip chip package includes a semiconductor chip electrically connected to a circuit substrate. A protective cap is disposed over the semiconductor chip, and includes at least one portion extending beyond an edge of the semiconductor chip.

Abstract: A flip-chip attach method includes the steps of: attaching a chip on a transparent substrate such that each connecting pad of the chip is aligned with each electrical connection pad on the transparent substrate; and irradiating each connecting pad and each electrical connection pad from a side of the transparent substrate with a laser beam so as to weld the connecting pad to the electrical connection pad. Furthermore, the invention also provides a flip-chip attach structure including a transparent substrate and at least one chip. A surface of the transparent substrate is formed with a plurality of electrical connection pads, and the chip has a plurality of connecting pads. The connecting pads and the electrical connection pads are irradiated with a laser beam and are welded to each other. Thus, the chip is mounted to the transparent substrate.

Abstract: The variation of the parasitic inductance generated at the output terminal of a transistor in the final stage of a multistage amplifier unit is reduced. One side of the semiconductor chip that includes the final stage transistor is put in contact with the inner wall of a square recess formed in a wiring substrate. The semiconductor chip is positioned and fixed accurately at the bottom of the recess, whereby the drain wire of the transistor is fixed. Then, a chip edge at which the drain electrode is disposed on top of the chip is put in contact with the inner wall of the recess, which is closer to the drain bonding pad. A metallized layer is formed of the same size as that of the chip at the bottom of the recess and a fusion bonding material is supplied on the metallized layer.

Abstract: To provide a semiconductor device which can be down-sized and integrated to a high degree.

Abstract: The invention relates to a method for producing Grignard compounds, according to which magnesium is reacted in a suitable fluid reaction medium in a protective atmosphere with hologen-substituted organic compounds by means of microwave radiation.

Abstract: An apparatus for delivering water vapor to a gas is formed from a plurality of hollow fiber membranes each defining a passage for the flow of gas from an upstream end of the passage and enclosed by an enclosure. The hollow fiber membranes have a combined surface area in the range of about 90 square centimeters to about 110 square centimeters. The enclosure contains an air inlet positioned to direct air to the upstream end of each of the passages of the hollow fiber membranes and an air outlet positioned to direct air from the downstream end of each of the passages of the hollow fiber membranes. The enclosure preferably has a water inlet positioned to direct water toward the outer surfaces of the hollow fiber membranes and a water outlet positioned to direct water from the enclosure.

Abstract: Tools and methods for making molded an optical integrated circuit including one or more waveguides are disclosed. In one embodiment, a molding die is provided that includes a substrate that has a topographically patterned first surface. A conformal protective film is provided over the first surface of the substrate. The substrate may be formed of silicon or gallium arsenide, and may be patterned using conventional semiconductor patterning techniques, such as plasma etching. The protective film may be metal (e.g., nickel or titanium), diamond, or some other hard material. Typically, a plurality of such molding dies are formed from a wafer of the substrate material. The die is pressed into a moldable material, such as thermal plastic, to form the wave guide(s) of the optical integrated circuit. A plurality of the dies may be mounted around the curved surface of a heated roller, and a heated tape of the waveguide material may be fed under the roller in a mass production process.

Abstract: A method for producing a polymer optical waveguide including: (1) preparing a template that is made of a template forming curable resin and has a concave portion, (2) applying an ozone treatment or irradiating light having a wavelength of 300 nm or less to at least one of a surface of the template having the concave portion and a core formation surface of a cladding film substrate, (3) bringing the cladding film substrate into close contact with the template, (4) filling a core forming curable resin into the concave portion of the template with which the cladding film substrate is in close contact, (5) curing the filled core forming curable resin to form a core, (6) removing the template from the cladding film substrate, and (7) forming a cladding layer on the cladding film substrate on which the core has been formed.

Abstract: An improved process for the preparation of microcapsules consist sentially of a wall material and a core material in condensing a melamine-formaldehyde precondensate and/or methyl ethers thereof in an aqueous dispersion of a water-insoluble core material and in the presence of an acrylic acid/acrylamide copolymer at acidic pH and at a temperature in the range of from 20° to 100° C., and hardening thereafter the melamine-formaldehyde precondensate to form the walls of the microcapsules at an elevated temperature, wherein the core material is dispersed in the precondensate/copolymer solution without initial partial condensation of the precondensate and copolymer and wherein the hydrophobe point of the precondensate and/or its methyl esters is less than 90° C., as well as microcapsules, paper and pressure-sensitive recording material comprising such microcapsules.

Abstract: The present invention is concerned with the formation of submicron particles of an antineoplastic agent, particularly paclitaxel, by precipitating the antineoplastic agent in an aqueous medium to form a pre-suspension followed by homogenization. Surfactants with phospholipids conjugated with a water soluble or hydrophilic polymer such as PEG are used as coating for the particles. The particles produced generally have an average particle size of less than about 1000 nm and are not rapidly soluble.

Abstract: A ceramic tape is provided in its green state so that it is malleable and formable to a mold for forming a dental restoration, but will not break or crack as it is applied to the mold. Pressure may be applied to further form or adapt the ceramic tape to the shape of the mold. Heat is applied simultaneously with pressure or in a separate step to achieve high density and strength in the ceramic material. A vacuum atmosphere may be used with the application of pressure and/or heat. One or more layers of surface material such as porcelain or composite resin may be applied to the ceramic to form the dental restoration. The process is useful in the manufacture of dental materials or restorations including but not limited to orthodontic appliances, bridges, space maintainers, tooth replacement appliances, splints, crowns, partial crowns, dentures, posts; teeth, jackets, inlays, onlays, facing, veneers, facets, implants, abutments, cylinders, and connectors.

Abstract: A method for making a dental restoration by milling a dental model from a partially sintered ceramic material, applying dental material thereon, and curing the dental material on the model to obtain a dental restoration. The method can be used for forming a variety of dental restorations including, but not limited to, crowns, bridges, space maintainers, tooth replacement appliances, orthodontic retainers, dentures, posts, jackets, inlays, onlays, facings, veneers, facets, implants, abutments, splints, partial crowns, teeth, cylinders, pins, and connectors.

Abstract: A method for manufacturing a long molding having an axial bend, includes: forming a long first member; performing an axial bending process for the first member, when the first member passes through a gripping portion; and extruding a heated and molten liquid resin molding material for formation of a second member through a second member molding opening of a second member extrusion die while following a bend of the first member to integrate the second member made of the molding material with the first member. The second member extrusion die has a changeable substantial opening shape of the second member molding opening. The second member having a different cross sectional shape between one part and the other part in the longitudinal direction is extruded in accordance with a change of the opening shape.

Abstract: A manufacturing method for a refrigerator door is disclosed. The method uses only a transparent plastic layer to make the refrigerator door. The present invention can simplify the manufacturing process, and reduce the number of parts required for the refrigerator door to reduce costs. Furthermore, an appearance pattern on the refrigerator door can be painted or printed onto the surface of the transparent plastic layer with different types, and a male mold of a vacuum forming machine can provide different shapes to make the refrigerator door into variety shapes. Moreover, because the appearance pattern can be painted or printed on the inner surface of the transparent plastic layer, the appearance pattern will not come off because of frequent touching.

Abstract: The invention relates to a process and an apparatus for simultaneously coating and forming a body (11), comprising the following steps:

Abstract: A method for producing a material useful for forming a component for an electrochemical fuel cell is provided. More particularly, the component is formed of a sheet (10) of a compressed mass of expanded graphite particles. The component is treated with a water resistant additive sufficient to provide utility as a component in an electrochemical fuel cell. Preferably, the water resistant additive is a fluoropolymer material. More preferably, the water resistant additive is a polytetrafluoroethylene material. The treatment preferably occurs by coating and/or impregnating the water resistant material in the sheet of graphite particles.

Abstract: A resin molded product according to this invention is produced as follows. Firstly, a resist pattern formation step is performed to form a resist pattern.

Abstract: A method of forming an elastomeric article includes providing a former, coating the former with a coagulant composition including zinc stearate, dipping the former into a polymer composition including an elastomeric polymer and water, curing the elastomeric polymer at a temperature above the melting point of the zinc stearate, and removing the water from the polymer composition on the former to form the elastomeric article.

Abstract: An apparatus for manufacturing a silicone cover for a breast implant, comprising a dipping station for repeatedly immersing at least one mould of said cover in a plastic solution, wherein the mould at its lower side is placed on an adjustable arm such that during operation at least prior to a complete immersion of the mould, an upper end of the mould comes in contact with the plastic solution.

Abstract: A plastic part is molded onto a top of a container having folded flaps on the top of the container. The container is formed into a tube shape from a flexible web material with crease lines. Contents are filled into the tube of web material, the tube is transverse sealed and a primary shape container is obtained by cuffing the web material along crease lines. A final shape container is obtained with multi-folding of folded flaps onto the container top. A mold of an injection molding apparatus is applied against the top of the container, and fusion thermoplastic material is injected into the cavity formed between the mold and the top of the container. The thermoplastic material is then cooled, and the mold removed to leave the plastic part molded to the top of the container.

Abstract: Wear components of a powder coating system are provided with a coded visual element in one aspect of the invention. The coded visual element can provide an indication of the manufacturer or a characteristic of the part. In molded parts, the coded visual element can be implemented as a different color overmolded part wherein a material of one color is overmolded on a base material of another color. The overmolded material can be elastomeric and formed with integral exterior rings to provide a friction fit for the wear component in, for example, a venturi pump or a spray gun while eliminating the need for separate O-rings and the need to machine or form grooves in the exterior of the parts to receive the O-rings. Similarly, integral flanges can be formed to eliminate the need for separate snap rings and grooves to accept the snap rings. Color coding of the overmolded material can also be implemented in a way to provide an indication of wear.

Abstract: The present invention provides methods for packaging small size memory cards wherein the methods comprise molding over a populated printed circuit board, thereby an encapsulated memory card is obtained with desirable external dimensions and features. In one aspect of the invention, methods are provided for preventing mold bleed underneath of the contact pads of memory cards. In one embodiment, the mold bleeding is prevented by using slidable holding pins that exert pressure directly upon the contact pins during the molding process. In another embodiments, the mold bleeding is prevented by covering the contact pads with temporary substrate coverage during the molding process. In yet another embodiment, the mold bleeding is prevented by using pressing edges that exert pressure directly upon the area of contact pads during the molding process. In still another embodiment, the mold bleeding is prevented by using vacuum pressure to secure the populated PCB onto the bottom of a molding apparatus.

Abstract: An injection moulding process for the preparation of an oral delivery device comprising a core which contains a pharmaceutically active agent, having a coating with one or more openings leading to such a core. The invention also relates to devices produced by the process, and to injection moulds suitable for performing the process.

Abstract: A method of making a vehicle door assembly by assembling a super-plastic formed inner door panel with a super-plastic formed outer panel. A flanging and roll hemming tool are used to form a hem flange to secure the outer door panel to the inner door panel. A room temperature curable two-part epoxy adhesive is used to lock the inner and outer door panels together. The epoxy adhesive is permitted to cure before the assembly is heated in electro-operations or paint ovens. Hinge and striker attachment areas are provided that are not substantially thinned or stretched during the super-plastic forming process so as to preserve the strength of the inner and outer door panels in such areas.

Abstract: A method of manufacturing consumer products such as cosmetic packages has the steps of providing a mold or die, filling the mold or die with a UV curable material, and exposing the UV curable material to a UV light source to cure said UV curable material to a solid mass.

Abstract: The method involves making a hollow blow molded thermoplastic article having an integral handle. An unblown preform of polyethylene terephthalate (PET) is inserted into a blow mold and thereafter stretched by a stretch rod. Blow gas is then injected into the interior of the preform when the blow mold is closed and the preform is at a stretch temperature. After the preform is blown into the shape of the bottle in the mold, blow gas is discharged from the stretch rod onto an interior wall surface where the handle is to be formed. Heated movable mold segments are then advanced within the blow mold from a first retracted position to a second position thereby compressing an interior wall surface of the article into contact with a facing interior wall surface of the bottle to bond the surfaces at an elevated temperature and form an integral handle extending from the exterior wall of the blow molded article.

Abstract: Blanks (12) of thermoplastic material are heated, and a thermoforming step is performed in which the heated blanks are deformed plastically by stretching. Before the thermoforming step, a die-punching step is performed in which the peripheral regions of the blanks are deformed by die-punching while the material of the blanks is held captive on the outside. The installation includes heater means (16) for heating said blanks, thermoforming means (24), and a die-punching tool (26, 28) suitable for deforming the peripheral regions of the blanks before they are thermoformed.

Abstract: An emergency cutting torch system adapted to be stored within a compartment of a rescue vehicle. The emergency cutting torch system may comprise a wheeled cart adapted to maintain a first gas storage tank and a second gas storage tank to the wheeled cart in all orientations of the wheeled cart. The emergency cutting torch system may comprise a rotateable lifting member adapted to be rotate outward to extend from the wheeled cart to facilitate engagement with a hook, or other lifting member, for lifting the emergency cutting torch system. The lifting member may rotate to a stowed position to reduce the outer dimensions of the emergency cutting torch system. The emergency cutting torch system may comprise a quick-release system to enable a hose assembly wound on a cart be removed quickly without having to unwind the hose assembly from the cart.

Abstract: In a process for the thermal treatment of the precusor material of a catalytically active material in a rotary tube furnace through which a gas stream flows, at least a proportion of the gas stream flowing through the rotary tube furnace is circulated, and the associated rotary tube furnace apparatus and tube-bundle reactors for the partial gas-phase oxidation of acrolein to acrylic acid are loaded with catalysts whose catalytically active material is obtainable by the process for the thermal treatment.

Abstract: A refining method and refining apparatus, able to shorten the time required for refining and reduce the refining costs in decarburization refining of a chromium-contained molten steel, which refining method for chromium-contained molten steel etc. performing decarburization refining by blowing a gas containing oxygen gas into a chromium-contained molten steel under a vacuum or atmospheric pressure and vacuum, said refining method for a chromium-contained molten steel etc. characterized by having a first step for blowing oxygen gas while making the inside of the vessel a pressure of a range of 400 Torr (53 kPa) to atmospheric pressure, a second step for blowing oxygen gas while evacuating the inside of the vessel to 250 to 400 Torr (33 to 53 kPa), and third step for blowing gas while evacuating the inside of the vessel to not more than 250 Torr (33 kPa).

Abstract: Represented and described is a gas lance (1) made of a fireproof material, having an entry surface (2) and an exit surface (3), having channels (5) having slit-shaped cross-section, which comprise an entry slit (6) and an exit slit (7). In order to provide a gas lance (1) in which the gas exits in such a manner that a good thorough mixing of the melt is achieved and a simple penetration of the melt by the gas is avoided, it is proposed that the projection of the exit slit (7) of a channel (5) onto the entry surface (6) be offset in relation to the entry slit (7) of the channel.

Abstract: The invention relates to a melt launder (1, 9, 10) comprising a bottom and edges, said melt launder being particularly meant to be used for tapping a molten phase, such as slag, from a smelting furnace, which melt launder is manufactured of copper or copper alloy and provided with cooling channels (8), so that at the bottom (2) of the melt launder (1, 9, 10), there is arranged at least one groove (3).

Abstract: The invention provides an internal filter with an improved filtering ability of removing particularly fine inclusion particles from molten aluminum or molten aluminum alloy. The internal filter includes an aggregate meshed member made of a refractory material and a coating layer formed on a surface of the aggregate meshed member. The coating layer contains a soda silicate that is able to be softened or viscous at a temperature of the molten aluminum alloy.

Abstract: A spring latching connector includes a housing having a bore therethrough, a piston slidably received in said bore, a circular groove formed in one of said bore and piston and a circular coil spring disposed in said groove for latching said piston and housing together. The groove is sized and shaped for controlling, in combination with a spring configuration, disconnect and connect forces of the spring latching connection.