Abstract: There is provided a solution to the problem of the poor adhesion in the pad portion while inhibiting the dishing in the pad portion. An SiON film, which covers insulating areas and has an opening above Cu pad areas, is formed, and a barrier metal film is formed in the opening of the SiON film. Such constitution provides the structure, in which the upper portion of the interfaces between the Cu pad areas and the insulating areas are covered by the SiON film.

Abstract: A method and structure for a MIM capacitor, the structure including: an electronic device, comprising: an interlevel dielectric layer formed on a semiconductor substrate; a copper bottom electrode formed in the interlevel dielectric layer, a top surface of the bottom electrode co-planer with a top surface of the interlevel dielectric layer; a conductive diffusion barrier in direct contact with the top surface of the bottom electrode; a MIM dielectric in direct contact with a top surface of the conductive diffusion barrier; and a top electrode in direct contact with a top surface of the MIM dielectric. The conductive diffusion barrier may be recessed into the copper bottom electrode or an additional recessed conductive diffusion barrier provided. Compatible resistor and alignment mark structures are also disclosed.

Abstract: Interconnect structure having enhanced adhesion between the various interfaces encompassing an organo-silicate glass (OSG) film, for use in semiconductor devices is provided herein. The novel interconnect structure includes a non-damaged plasma-treated low-k OSG surface to enhance the adhesion of the hardmask material to the OSG surface, and an unique deposition scheme for the hardmasks in order to make the entire structure pliant towards implementing mild processing condition during the reactive ion etch patterning of the dielectric structure in a damascene and dual-damascene scheme. The methods for making a semiconductor device having an enhanced adhesion and micromasks free profiles are also provided.

Abstract: The present invention provides an electronic device having high insulating reliability, in which metal portions of a circuit are not electrically conductive with each other via an adhesive layer even when the electronic device is used in high-temperature low-humidity conditions or high-temperature high-humidity conditions, and provides a production method for the electronic device, and a semiconductor device comprising the electronic device. In the electronic device in which a circuit formed by pattern formation of metal portions is attached via an adhesive layer to an insulating base, the adhesive layer, which contacts adjacent metal portions, is divided. Typically, the electronic device is one of a lead frame having a lead frame fixing tape, a TAB tape, and a flexible printed circuit board.

Abstract: A semiconductor device according to the present invention comprises a semiconductor substrate, a gate insulating film which is composed of a material whose main component is a tetravalent metal oxide, a mixture of a tetravalent metal oxide and SiO2, or a mixture of a tetravalent metal oxide and SiON and which containing B when it is in an nMOS structure on the semiconductor substrate or containing at least one of P and As when it is in a pMOS structure on the semiconductor substrate, and a gate electrode made of a metal having a work function of 4 eV to 5.5 eV.

Abstract: A semiconductor device is equipped with fuses each made of a conductive material vertically extended through an insulator layer employed in the semiconductor device. Holes are formed which vertically penetrate the insulator layer. Sidewalls are formed on their corresponding wall surfaces of the holes. The holes formed with the sidewalls are buried with a conductive material.

Abstract: A semiconductor device and the production method thereof capable of reducing warps of a semiconductor wafer when packaging at a wafer level in a SiP type semiconductor device, is configured that an insulating layer is formed by stacking a plurality of resin layers on a semiconductor chip formed with an electronic circuit, wiring layers are buried in the insulating layer and electrically connected to electrodes, and formation areas of the plurality of resin layers become gradually smaller from an area of an upper surface of the semiconductor chip as they get farther from the semiconductor chip, so that a side surface and an upper surface of each of the resin layers and the upper surface of the semiconductor chip form a stepwise shape.

Abstract: A semiconductor device comprises a first insulating film formed on a semiconductor substrate, a first metal pattern formed on the first insulating film, a second insulating film formed on the first metal pattern, a second metal pattern formed on the second insulating film, and a third metal pattern formed in the second insulating film and connecting between the first metal pattern and the second metal pattern. The third metal pattern is a single continuous structure, and the principal orientation axes of crystals of a metal constituting the third metal pattern are parallel to the principal surface of the semiconductor substrate.

Abstract: A semiconductor device, and a method of fabricating the device, having a copper wiring level and an aluminum bond pad above the copper wiring level. In addition to a barrier layer which is normally present to protect the copper wiring level, there is a composite layer between the aluminum bond pad and the barrier layer to make the aluminum bond pad more robust so as to withstand the forces of bonding and probing. The composite layer is a sandwich of a refractory metal and a refractory metal nitride.

Abstract: Disclosed herein is a reinforcing system and method for reinforcing a contact pad of an integrated circuit. Specifically exemplified is a system and method that comprises a reinforcing structure interposed between a top contact pad layer and an underlying metal layer.

Abstract: The invention includes a process for manufacturing an integrated circuit, comprising providing a substrate comprising a dielectric layer over a conductive material, depositing a hardmask over the dielectric layer, applying a first photoresist over the hardmask and photodefining a trench, etching the hard mask and partially etching the dielectric to form a trench having a bottom, stripping the photoresist, applying a second photoresist and photodefining a slit across the trench, selectively etching the dielectric from the bottom of the trench down to the underlying conductive material. Both the hardmask and the second photoresist are used as a mask. Later, a connection to the underlying metal is formed and integrated circuits made thereby.

Abstract: An apparatus and method to provide a via with an increased via contact area. A semiconductor support layer is coupled to a dielectric layer and a contact is coupled to the dielectric layer. A via, having an enlarged end within the semiconductor support layer, passes through the semiconductor support layer and the dielectric layer and connects to the contact. In one embodiment, the formation of the via and the enlarged end in the semiconductor support layer are completed in a single dry etch process.

Abstract: A semiconductor apparatus includes a first conductive film and a second conductive film provided on respective sides of an insulating resin film. A circuit element is mounted on the second conductive film. The circuit element is electrically connected to the second conductive film. The second conductive film is provided to cover a via plug. The via plug is tapered with a progressively smaller diameter toward the second conductive film and away from the first conductive film.

Abstract: The semiconductor device of the present invention comprises a substrate; at least one through hole formed through the substrate between front and back surfaces of the substrate; an electrical connection portion formed by a semiconductor process on at least one surface of the front and back surfaces of the substrate in a vicinity of an end opening of the through hole; an insulating layer formed of an organic material on an inside surface of the through hole; and an electroconductive layer formed on an inside surface of the insulating layer, wherein the electrical connection portion is electrically connected to the electroconductive layer to be electrically connected to a side of the other surface of the substrate.

Abstract: A semiconductor die having a through via formed therein is disclosed. A first conductive layer is formed on the front side of the die and a second conductive layer is formed on the backside of the die, and coupled with the through via. A first package substrate is electrically coupled with the first conductive layer, and a second package substrate is electrically coupled with the second conductive layer. In another embodiment, a substrate ball electrically couples the first and second package substrates. In a further embodiment, a flip chip bump is attached to the first package substrate.

Abstract: An electronic parts built-in substrate of the present invention includes a wiring substrate having connecting pads, a first electronic parts a bump of which is flip-chip connected to the connecting pad, a second electronic parts having a larger area than an area of the first electronic parts a bump of which is flip-chip connected to the connecting pad arranged on an outside of a periphery of the first electronic parts and which is packaged at a predetermined interval over the first electronic parts, and a filling insulating body filled in a clearance between the first electronic parts and the wiring substrate and clearances between the second electronic parts and the first electronic parts and the wiring substrate, wherein the first electronic parts is buried in the filling insulating body.

Abstract: A circuit substrate has one or more active components and a plurality of passive circuit elements on a first surface. An active semiconductor device has a substrate with layers of material and a plurality of terminals. The active semiconductor device is flip-chip mounted on the circuit substrate and at least one of the terminals of the device is electrically connected to an active component on the circuit substrate. The active components on the substrate and the flip-chip mounted active semiconductor device, in combination with passive circuit elements, form preamplifiers and an output amplifier respectively. In a power switching configuration, the circuit substrate has logic control circuits on a first surface. A semiconductor transistor flip-chip mounted on the circuit substrate is electrically connected to the control circuits on the first surface to thereby control the on and off switching of the flip-chip mounted device.

Abstract: A substrate having a built-in semiconductor apparatus includes: a semiconductor apparatus which comprises a first semiconductor chip having a first electrode pad formed on a main surface thereof, a protruding portion which is in contact with the first semiconductor chip and protrudes from a side surface of the first semiconductor chip to the outside, an apparatus wiring portion which is provided so as to extend from the first electrode pad onto a surface of the protruding portion, a conductive portion which is in connected with the apparatus wiring portion and provided on the apparatus wiring portion, and a sealing layer which covers the main surface and the surface of the protruding portion so as to expose a top face of the conductive portion; an insulating layer in which the semiconductor apparatus is embedded; an external terminal provided on the insulating layer; and a substrate wiring portion which electrically connects the conductive portion with the external terminal.

Abstract: An embodiment of an encapsulated organic optoelectronic device is described. The encapsulated device includes an organic optoelectronic device on a substrate and that organic optoelectronic device has a cathode. The encapsulated device further includes a diffusion layer that is on the organic optoelectronic device and that diffusion layer covers exposed areas of the organic optoelectronic device. An adhesive layer is on the substrate and is around a perimeter of the diffusion layer. An encapsulation lid is on the adhesive layer, and a getter is on the encapsulation lid such that the getter overlies the organic optoelectronic device. The diffusion layer slows a rate of absorption of reactive gasses by the cathode and increases a proportion of the reactive gasses absorbed by the getter relative to the cathode.

Abstract: A semiconductor device in which chips are resin-molded, including: frames having front and back surfaces and die pads; power chips mounted on the surfaces of the die pads; an insulation resin sheet having a first and a second surfaces which are opposed against each other, the resin sheet being disposed such that the back surfaces of the die pads contact the first surface of the resin sheet; and a mold resin applied on the first surface of the resin sheet so as to seal up the power chips. The thermal conductivity of the resin sheet is larger than that of the mold resin.

Abstract: A manufacturing method of forming an encapsulation layer on a back surface of a wafer mainly comprises the following steps. Firstly, there is provided a wafer having an active surface and a back surface, wherein the active surface has a plurality of bumps formed thereon. Next, an encapsulation is provided on the back surface of the wafer and a mold is provided to have a mold surface of the mold disposed over the back surface. Afterwards, the mold surface is heated and moved to press the encapsulation simultaneously so as to have the encapsulation entirely distributed over the back surface of the wafer to form the encapsulation layer, with a flat surface, covering the back surface of the wafer.

Abstract: The electronic component has a semiconductor chip embedded in a plastic compound. The electronic component is produced by first producing a number of electronic components on a panel and subsequent dicing into single electronic components. The semiconductor chip of this component is disposed on a substrate which includes or is entirely formed of plastic and is embedded in a plastic package molding compound. The plastic of the substrate has a glass transition temperature range which is lower than the glass transition temperature range of the plastic package molding compound.

Abstract: A semiconductor device includes an alignment mark which is arranged adjacent to each corner of a semiconductor chip, and a plug which contacts the alignment mark. The alignment mark is formed by part of the uppermost interconnection layer in a multilevel interconnection which is formed on the semiconductor chip and obtained by stacking low-permittivity insulating layers and interconnection layers. The plug is buried in a contact hole formed in the low-permittivity insulating layer below the alignment mark, and contacts the alignment mark.

Abstract: A humidifier has a first sealable reservoir feeding water to a second reservoir communicating with ambient atmosphere. A blower is adapted to blow a stream of air through the humidifier to ambient atmosphere, such that the stream of air picks up water vapor from any water that may be in the second reservoir. A feeder valve feeds a quickly-evaporable quantity of water from the first reservoir into the second reservoir. The quickly-evaporable quantity of water in the second reservoir is substantially smaller than the water capacity of the first reservoir. A dry-out mechanism shuts off the feeder valve upon a user command and continues to run the blower at least until the quickly-evaporable quantity of water has evaporated to an extent effective in inhibiting the growth of microorganisms in the microorganism-vulnerable reservoir.

Abstract: A sparger for delivering fluid comprising a sparger pipe for carrying the fluid from a fluid source and downwardly directed nozzles to direct the delivery of fluid is disclosed. A substantially vertical connection pipe connects the sparger to the nozzles. Also, a method of delivering oxygen to an oxygen-depleted zone in the bottom of the fermenter using the sparger is disclosed.

Abstract: A method for manufacturing artificial eyes includes forming a recess in a shell, disposing a sheet member having a pattern or veins into the recess of the shell. A lens is then disposed into the recess of the shell and engaged onto the sheet member, and heated to secure the lens and the sheet member in the recess of the shell. A cavity is formed in the lens to form a spatial pupil for the lens, and a color material is applied into the cavity of the lens, before disposing the lens into the recess of the shell. The shell and the sheet member may be heated to secure the veins of the sheet member onto the shell.

Abstract: Single-core and multi-core microcapsules are provided, having multiple shells, at least one of which is formed of a complex a coacervate of two components of shell materials. The complex coacervate may be the same or different for each shell. Also provided are methods for making the microcapsules.

Abstract: A method for controlling the operation of an article forming system by incorporating into the article forming system a monitoring system which reads an identifier disposed on or in a sheet of material. The identifier provides information regarding the sheet of material so as to indicate whether or not the sheet of material relates to a particular category. The operation of the article forming system can then be modified based on the sheet information encoded by the identifier which is read by the monitoring system.

Abstract: Slabstock foam free of cavities can be produced without any restriction, i.e. also from rapidly reacting chemical systems, by introducing the liquid reaction mixture from underneath, in front of, and/or through an optionally swivellable floor plate, wherein the floor plate and the inlet for introducing the liquid reaction mixture is arranged in a manner such that the reaction mixture above the floor plate is substantially still liquid.

Abstract: A low-pressure CO2 tank or an air compressor with a refrigerated air dryer is attached either at or after the vent zone of a standard twin-screw extruder. During or after extrusion, the gas is dissolved in the wood-plastic melt. The CO2 expands which foams the wood-plastic material.

Abstract: The present invention relates to a high strength material and a high strength molded article comprising 65 to 100 wt. % of cellulose microfibrils; and products comprising these. The material, which is lightweight and has a very high strength, can be used for various purposes and can be produced by recycling wastepaper, used cloth and the like. Furthermore, by appropriately selecting the type and/or amount of binder, the material comprising microfibrils as a main component can be decomposed by microbes or the like after being dumped as waste, and is thus friendly to the global environment.

Abstract: Process and system for fabricating a multidirectional fibrous reinforcement designed to be a porous preform for producing a part made of a composite material. Reinforcing thread is deposited in successive layers on a support surface. A binder is provided in association with the reinforcing thread so as to adhere the reinforcing thread to the support surface and the successive layers of thread. The reinforcing thread is pressed against the support surface in a manner that exerts a pressure substantially perpendicular to the support surface at the point where the thread is deposited. The binder may be pre-applied to the support surface or it can be applied simultaneously with the reinforcement thread.

Abstract: The invention relates to a nanofiber web preparing apparatus and method via an electro-blown spinning. The nanofiber web preparing method comprises: feeding a polymer solution, which is dissolved into a given solvent, toward a spinning nozzle; discharging the polymer solution via the spinning nozzle, which is applied with a high voltage, while injecting compressed air via the lower end of the spinning nozzle; and collecting fiber spun in the form of a web on a grounded suction collector under the spinning nozzle, in which both of thermoplastic and thermosetting resins are applicable, solution doesn't need to be heated and insulation is readily realized.

Abstract: In a process for manufacturing monofilaments of a polypropylene having a melt flow index (MFI) at 230° C./2.16 kg of 2 to 16 g/10 min and possessing a diameter of greater than 0.050 mm and an improved abrasion resistance, from 20 to 0.1% by weight of an additive is added to the polypropylene upstream of the extruder, the melt is spun into a water bath, drawn into monofilaments and the monofilaments are wound up. The monofilament of a polypropylene having a melt flow index (MFI) at 230° C./2.16 kg of 2 to 16 g/10 min and possessing a diameter of greater than 0.050 mm and an improved abrasion resistance has a strength of at least 50 cN/tex for an elongation corresponding to the maximum tensile stress (elongation at break) of less than 30%. It also has an abrasion of less than 0.05% and a relative fracture energy>100% after treatment for 24 hours at 120° C.

Abstract: An apparatus (1) for producing a transparent polypropylene sheet, which comprises a sheet formation means (11) for melt-kneading a resin composition comprising (A) 60 to 97 mass % of a polypropylene resin having an iostactic pentad proportion of 0.85 to 0.99 and a melt index of 2 to 10 g/10 min and (B) 40 to 3 mass % of a polypropylene resin having a racemic pentad proportion [rrrr/(1-mmmm)] of 0.15 to 0.50 and a melt index of 2 to 10 g/10 min and extruding it into s sheet, a first cooling means (12) for cooling a sheet (20) into a solid, a preheating means (13) for re-heating the cooled sheet (20), a heat treatment means (14) for heat-treating the sheet (20) into a sheet (21) and a second cooling means (15) for cooling the sheet (21) after heat treatment.

Abstract: A process of molding a container closure comprises depositing a gob of thermoplastics material in a mold cavity and then moving mold plates in an upper mold portion relative to an opposing lower mold portion to form the container closure in the mold cavity.

Abstract: A connector includes a hollow member having an open first end and an open second end joined by a bore extending through the body having a first bore section and a second bore section that is stepwise reduced from the first bore section creating an annular shoulder therebetween. The first bore section tapers inwardly from the shoulder toward a third bore section, a sealing member receiver integrally formed into the connector and located within the second bore section near the third bore section. A sealing member seated within the sealing member receiver and at least partially protrudes inwardly into the second bore section.

Abstract: A sensor is provided for the determination of various concentrations of one or more components within a fluid sample. The sensor includes an injection molded body, at least two electrodes, an enzyme, and if desired, an electron transfer mediator. The body includes a reaction zone for receiving a fluid sample. The electrodes are at least partially embedded within the plastic body and extend into the reaction zone. Also contained within the reaction zone is an enzyme capable of catalyzing a reaction involving a compound within the fluid sample. Additionally, the sensor incorporates fill detection which activates a meter, attached to the sensor, for measuring the electrochemical changes occurring in the reaction zone.

Abstract: A molding machine and method for reducing the length of a mold cycle by enabling access to a previously molded part while the mold is closed. The machine includes a fixed platen and a platen movable toward and away from the fixed platen. A turret having a plurality of faces is positioned between the fixed and movable platens such that rotatation thereof brings different faces of the turret into alignment with the fixed platen. The fixed platen and at least two opposed turret faces have complementary mold halves that, when closed, define between them the desired shape of a part to be molded.

Abstract: A method of making a thermotropic liquid crystal polymer film includes continuously heat treating of the thermotropic liquid crystal polymer film 2 while the latter is jointed to a sheet-like support member 4, and subsequently separating the heat-treated thermotropic liquid crystal polymer film 2 from the support member 4. The continuous heat treatment of the thermotropic liquid crystal polymer film 2 then jointed to the support member 4 is carried out for a predetermined heating time within the range of 5 to 60 seconds at a predetermined heating temperature T° C. equal to or higher than the melting point Tm° C. of the thermotropic liquid crystal polymer film less 15° C. (i.e., Tm?15° C.), but lower than the melting point Tm° C. (thus, Tm?15° C.?T° C.<Tm° C.), to thereby increase the thermal expansion coefficient of the thermotropic liquid crystal polymer film.

Abstract: A method and apparatus to focus a short pulse laser beam onto a particle defect on a wafer surface, then ablate, or explosively evaporate, the particle defect with the short pulse laser beam.

Abstract: A process for making a molded running board assembly for installation on a vehicle includes blow molding the body of the running board and incorporating one or more additional components such as a step plate or a trim strip. The process involves placing the insert into the blow mold cavity in a subcavity, holding the insert by vacuum pressure and then extruding and blow molding a parison to simultaneously mold the running board and integrate the insert.

Abstract: A blow molding apparatus comprises a base, a blow molding extruder, a carriage, and first and second molding stations. The carriage is movably mounted to the base in a manner such that the carriage is movable along a non-linear path between first and second positions relative to the extruder and in a manner such that the carriage maintains a constant rotational orientation relative to the base as the carriage moves along the non-linear path. Each of the first and second molding stations is mounted to the carriage in a manner such that the first and second molding stations move with the carriage relative to the base as the carriage moves along the non-linear path.

Abstract: An internal bubble cooling process and apparatus for cooling extruded thermoplastic thin wall tubular bubbles emanating from an extrusion die head employing a first central channel for introducing cooling air into the bubble and a second channel formed between the outer wall of the central channel and the inner wall of the die head for withdrawing heated air from the bubble. Integration of the die head and airflow channels with a cooling tower and the method of use are also disclosed.

Abstract: A ceramic electronic element having improved the continuity of inner electrode layers while suppressing the decrease in adhesion between its dielectric layers and inner electrode layers and the deterioration in functions of the inner electrode layers, and a method of making the same are provided. In the method of making a ceramic capacitor (10) in accordance with the present invention, an electrode paste (22) is applied to a surface (20a) of a green sheet (20) and fired, so as to form a dielectric layer (12) laminated with an electrode layer (14). Since the electrode paste (22) is doped with a BaTiO3 powder, the adhesion between the dielectric layer (22) and inner electrode layer (14) after firing is significantly restrained from lowering, and the sintering start temperature of the electrode paste (22) is close to that of the green sheet (20).

Abstract: Disclosed is a method and structure for forming a silicide on a silicon material. The invention places the silicon material in a vacuum environment, forms metal on the silicon material, and then heats the silicon surface and the metal without breaking the vacuum environment. The processes of forming the metal and heating the silicon can be performed simultaneously without breaking the vacuum environment to form the silicide as the metal is being deposited. After the foregoing processing, the invention can remove the silicon surface from the vacuum environment and perform additional heating of the silicon surface. The first heating process forms a monosilicide and the additional heating forms a disilicide.

Abstract: Disclosed is a bonding structure between a nozzle body of a continuous casting nozzle and a refractory sleeve inserted into the nozzle body, wherein the refractory sleeve contains 20 mass % or more of CaO. An adhesive including a mixture of a refractory aggregate and a binder is applied to a joint zone defined in either one of at least a portion of the outer peripheral surface of the refractory sleeve and at least a portion of the inner surface of the hollowed nozzle to which the refractory sleeve is attached, or between the inner surface of the nozzle body and the outer peripheral surface of the refractory sleeve inserted into the nozzle body. The adhesive is adjusted to have a porosity in the range of 15 to 90% after dried in the joint zone.

Abstract: A sink assembly supported by a countertop surface or a freestanding cabinet to form a food preparation station is provided. The sink assembly includes a sink basin, a stanchion, a cutting board supported by the stanchion, and a coupling member fastening the cutting board and stanchion. The stanchion has first and second uprights extending between lower edges that are coextensive with the basin floor and terminating in a platform spanning therebetween. Mounts, such as slotted brackets, releasably secure the stanchion to the basin floor. The coupling member may be first and second pairs of cooperating fasteners associated with the cutting board and platform. The fasteners can be a cooperating tab and slot and a cooperating spring clip and peg. The basin floor may be sloped in multiple directions while the cutting board, when coupled to the stanchion, extends generally parallel to the horizontal plane of the support surface.

Abstract: A sheet processing apparatus which is capable of accurately superimposing or aligning sheets discharged from an image forming apparatus during buffering even when the space intervals between the sheets are reduced. A sheet processing apparatus sequentially receives sheets discharged from an image forming apparatus and carries out post-processing on the sheets. During execution of the post-processing on the sheets, a plurality of sheets are discharged successively from the image forming apparatus and superimposed one upon another around a buffer roller. The conveying speed of the sheets is controlled such that a conveying time period over which a sheet preceding a final one of the sheets to be superimposed one upon another around the buffer roller is conveyed over a predetermined path section is shorter than a conveying time period over which the final one is conveyed over the predetermined path section.

Abstract: A printer is provided incorporating a printhead for printing on pages of print media, an adhesive applicator for applying a two part adhesive to the printed pages, and a support tray for sequentially receiving and stacking the printed pages having the adhesive applied thereon. The two part adhesive has two parts which must contact each other to form an adhesive bond. The adhesive applicator is arranged to apply the two parts to opposite sides of each of the printed pages, and the support tray is arranged to stack the pages so that the first part of the adhesive on one page contacts the second part of the adhesive on an adjacent page in the stack so as to form a bound document.