Abstract: A gun rack comprising a plurality of swivel shoes and a plate or disc, wherein each swivel shoe is pivotally attached on either side to a bracket on the plate or disc, and wherein the swivel shoe is shaped to hold the butt of a gun. A gun rack comprising a top receiver disc, a bottom receiver disc, a base unit, a shaft, a plurality of swivel shoes, a plurality of barrel receivers, and a plurality of barrel receiver brackets, wherein each swivel shoe is pivotally attached on either side to a barrel receiver bracket, and wherein the barrel receiver brackets are attached to the bottom receiver disc. The barrel receivers insert into notches on the barrel receiver brackets and are optionally vertically adjustable. An optional shotgun plate for use in lieu of a barrel receiver. An optional pistol pole for holding pistols.

Abstract: Support for hunting weapon has five rigid components (1), (2), (3), (4) and (5), of roughly equal length, mutually connected in movable manner, the four of which components (2), (3), (4), and (5), are being connected at their upper and lower parts, while the fifth component (1) is being connected to the structure only at its upper part, where the upper parts of the four rigid components which are being connected in two locations form a letter “V” (6) and the four rigid components are connected by means of elastic links (7). The support upon folding, it takes form of a narrow slat upon folding.

Abstract: A bin system includes a plurality of bins arranged in stacks, wherein each of the bins in a stack includes a first element which interlocks with a second element in a lower bin in a stack of bins. The interlock holds the upper bin in a defined position on the lower bin. The first element includes a projection and the second element includes a lateral recess in a side wall of the bin. The system further includes two cross beams for supporting the stacks of bins, wherein the first element of the lowermost bin of a stack of bins is received between the two cross beams. The first element may comprise at least one additional projection arranged to engage an inner side of the side wall for additional support. The interlock between the first and second elements provides a self stacking function in that the interlock retains the upper bin on the lower bin.

Abstract: A presentation display for use in displaying products, samples and/or premiums. The display is comprised a shelf that is attached to a backer panel by means of a flexible hinge. The display may be made with flexible material as in paperboard, or with more permanent material as in plastic, wood, metal or other suitable material. Additional shelves may be added. The orientation of the additional shelves should be in a “nesting” way where when they are in the “Up” or “Closed” position there is minimal space between the shelves (“nesting” way), and when they are in the “Down” or “Open” position the area covered up during storage or shipping is revealed, giving a substantially “open” look a and feel to the display and allowing for easy access to the product. The revealed area may contain imagery or messaging to inform, entertain or to help sell the product.

Abstract: A hanger for detachable supporting a display device includes a support portion, a plurality of holding portion and a hanging portion. The support portion is formed at the bottom of the hanger to support the display device. The holding portions are formed on two sides of the hanger connect to the support portion to stabilize the display device. The hanging portion is formed at the top of the hanger connects to the holding portions to hang the hanger and the display device. In addition, the hanger is a curved linear structure.

Abstract: An open top bakery tray that is stackable and nestable on trays of like design. The tray has a generally rectangular configuration including a bottom wall, end walls and sidewalls. One of the walls is cut away to define a merchandising window to facilitate the removal of materials from the tray and the viewing and inspection of such materials and the tray further includes a gate moveable between an open position in which the window is unobstructed to allow free access to the tray and a closed position in which the gate extends across the window to preclude the inadvertent displacement of merchandise from the tray.

Abstract: There is provided an adjustable display pallet and a method for manufacturing display pallets. In certain embodiments, display pallets have a pallet base, corner columns, and span members that are adapted to hold individual products or trays of product. Corner columns are adhered to the pallet base in the desired locations. Span members are then inserted through insertion portions on the corner columns. The insertion portions are shaped to receive and secure span member ends. Optional end caps, backer panels and print panels may be provided on the pallet displays to enhance visual aspects of the display, as well as provide additional marketing space.

Abstract: A container made from thermoplastic material, of the type with a domed base, including a central projecting pimple, a peripheral support region and an intermediate arch, provided with ribs, extending from the central pimple to the support region but not therein, the ribs having a dihedral form with a straight section in a V in the medial plane, essentially parallel to the axis of the container and running into each other without a break. The ribs have a longitudinal profile which is curvilinear, the bases of the ribs, in the region thereof adjacent to the central pimple, extending higher than the base of said central pimple and the bases and crests of the ribs, in the region thereof adjacent to the support region, having curves merging progressively into a continuous rounding of unbroken curvature immediately above the support region such that the latter is essentially planar and continuous over the whole length thereof.

Abstract: Progressively-collapsible disposable container, of the type in which at least part (2) of the container lateral surface consists of a bellows structure including a plurality of adjacent folds (A-G), each fold being formed by two opposite surfaces of different width, characterised in that the larger-width surface (A-D) is stiffer than the smaller-width one (D-E). Preferably, the greater stiffness of the larger surface of the folds is a shape stiffness, obtained shaping the surface with a stiffening step-rib (A-C), having rounded-off edges, projecting outwards of the container.

Abstract: A method for fabricating a semiconductor device is provided. The method includes: forming an insulation layer over a substrate; forming a hard mask layer over the insulation layer; forming a photoresist pattern over the hard mask layer; forming a polymer over the photoresist pattern to increase a thickness of the photoresist pattern; patterning the hard mask layer by using the photoresist pattern having the increased thickness; and selectively removing the insulation layer by using the photoresist pattern having the increased thickness and the hard mask layer as an etch mask to form a contact hole.

Abstract: According to one embodiment, a method for manufacturing a magnetic recording medium includes forming patterns having protrusions and recesses of a ferromagnetic material onto a recording track section and a servo section on a substrate, forming a flattening film, a top surface of which is higher than that of the protrusion of the ferromagnetic material, onto the ferromagnetic material, and performing ion beam etching onto the flattening film up to a top surface of the protrusion of the ferromagnetic material, and determining an end point of flattening etching on the basis of a change in the total number of incident particles by means of an ion counter installed so as to be at an angle ? with respect to a perpendicular direction to the substrate in accordance with a material of the flattening film.

Abstract: A method and structure for reducing optical signal loss in a silicon waveguide formed within a silicon-on-insulator (SOI) structure uses CMOS processing techniques to round the edges/corners of the silicon material along the extent of the waveguiding region. One exemplary set of processes utilizes an additional, sacrificial silicon layer that is subsequently etched to form silicon sidewall fillets along the optical waveguide, the fillets thus “rounding” the edges of the waveguide. Alternatively, the sacrificial silicon layer can be oxidized to consume a portion of the underlying silicon waveguide layer, also rounding the edges. Instead of using a sacrificial silicon layer, an oxidation-resistant layer may be patterned over a blanket silicon layer, the pattern defined to protect the optical waveguiding region.

Abstract: A method of micro-machining a semiconductor substrate to form one or more through slots therein. The semiconductor substrate has a device side and a fluid side opposite the device side. The method includes diffusing a p-type doping material into the device side of the semiconductor substrate in one or more through slot locations to be etched through a thickness of the substrate. The semiconductor substrate is then etched with a dry etch process from the device side of the substrate to the fluid side of the substrate so that one or more through slots having a reentrant profile are formed in the substrate.

Abstract: After a resist mask with a predetermined thickness profile is overlaid on a piezoelectric substrate, the substrate is shaped to an objective three-dimensional configuration by dry etching process using an etching gas with a differential etching rate between the piezoelectric substrate and the mask. The thickness profile may be given to the mask by reflow of masking material or by compression with a precision stamp. The substrates can be shaped to a three-dimensional configuration corresponding to an amplified thickness profile of the mask by compositional control of a reactive gas during dry etching. Since the piezoelectric material is accurately shaped to an objective form without defects, high-quality elements and devices are provided.

Abstract: The present invention relates to the implementation of minute patterns and thus improving pattern resolution and transcription property. Provided is a printing substrate for a liquid crystal display comprising a transparent insulating substrate, and a material layer for dry etching formed on an upper surface of the transparent insulating substrate, the material layer for dry etching constituting a printing pattern, and a manufacturing method of a printing substrate for a liquid crystal display comprising forming a material layer on a transparent insulating substrate, applying a photo resist along a printing pattern on the upper side of the material layer, dry-etching the material layer along the printing pattern using the photo resist as an etching mask, and striping the photo resist.

Abstract: The present invention provides a series of methods, compositions, and articles for patterning a surface with multiple, aligned layers of molecules, by exposing the molecules to electromagnetic radiation. In certain embodiments, a single photomask acts as an area-selective filter for light at multiple wavelengths. A single set of exposures of multiple wavelengths through this photomask may make it possible to fabricate a pattern comprising discontinuous multiple regions, where the regions differ from each other in at least one chemical and/or physical property, without acts of alignment between the exposures. In certain embodiments, the surface includes molecules attached thereto that can be photocleaved upon exposure to a certain wavelength of radiation, thereby altering the chemical composition on at least a portion of the surface. In some embodiments, the molecules attached to the surface may include thiol moieties (e.g., as in alkanethiol), by which the molecule can become attached to the surface.

Abstract: The amount and area of irradiation of excited species to the surface of a workpiece can be increased, the irradiation can be uniformly performed on the whole surface, and the loss of effective excited species is suppressed, so that the treating performance and efficiency can be remarkably improved. A pulse voltage is applied between discharge electrodes which are opposingly positioned, to produce a corona discharge between pointed ends of the discharge electrodes, and the surface of a workpiece is irradiated with excited species including plasma produced by the corona discharge, thereby treating the surface. The discharge electrodes are configured by a central electrode and two peripheral electrodes opposingly placed in a state where the central electrode is interposed between the peripheral electrodes.

Abstract: A dry etching method comprises: exposing an etching region of a workpiece to a plasma product of a depositive gas, the depositive gas having a CF group in a reaction chamber; exposing the etching region to a plasma product of an etching gas in the reaction chamber; exposing the etching region to a plasma product of the depositive gas in the reaction chamber; and exposing the etching region to a plasma product of the etching gas in the reaction chamber. Alternatively, a dry etching method comprises: exposing an etching region of a workpiece to a plasma product of a depositive gas, the depositive gas containing a fluorocarbon-based gas and at least one of CO (carbon monoxide) gas, hydrogen gas, and CH4 gas in a reaction chamber; exposing the etching region to a plasma product of an etching gas in the reaction chamber; exposing the etching region to a plasma product of the depositive gas in the reaction chamber; and exposing the etching region to a plasma product of the etching gas in the reaction chamber.

Abstract: Disclosed is an etching method for semiconductor processing by which a pattern loading phenomenon is reduced. First, plasma is generated while setting a bias power applied to a wafer to zero and applying a source power. After a predetermined time period, an etching process is implemented onto a predetermined layer formed on the wafer by setting the bias power to a predetermined value. Since by-products generated during preceding etching processes can be readily removed during an etching using plasma, an etching process change due to a difference of pattern densities can be reduced. In addition, a progressive pattern loading generated as the number of processed wafers increase, can be prevented.

Abstract: The present invention is a plasma processing method including: a step of introducing a substrate into a processing container, a metal or metallic compound film being formed on a surface of the substrate; a step of supplying a noble gas and an H2 gas into the processing container; and a step of generating plasma in the processing container while the noble gas and the H2 gas are supplied, so that a natural oxide film formed on a surface of the metal or metallic compound film is removed by means of the plasma. According to the invention, the noble gas and the H2 gas are supplied into the processing container, the plasma is generated in the processing container, and the plasma acts on the natural oxide film formed on a surface of the metal or metallic compound film. Thus, active hydrogen in the plasma reduces the natural oxide film, and active species of the noble gas etch the natural oxide film. As a result, the natural oxide film can be removed with a satisfactory selective ratio.

Abstract: The present invention is directed toward a floor-etching solution comprising a ketone such as 1-methyl-2-pyrrolidinone, a surfactant, and water. The solution further comprises a viscosity such that it may be applied to a surface by spraying, spritzing, or other similar application methods. The solution further comprises an evaporation rate low enough that it does not completely evaporate from the surface for at least 15 minutes.

Abstract: There is proposed a polishing method. The method includes feeding a slurry onto a polishing pad, press-contacting a semiconductor substrate held on a polishing head with the polishing pad, the semiconductor substrate having an organic film thereon, and chemically mechanically polishing the organic film by repeating a sequence of rotation and halt of rotation of the polishing pad and the polishing head.

Abstract: There is disclosed a substrate processing method of polishing a peripheral portion of a substrate to-be-processed by sliding a polishing member and the peripheral portion of the substrate to each other to remove a SiN film deposited on the peripheral portion of the substrate. The method includes supplying a solution containing at least one of polyethyleneimine and tetramethylammonium hydroxide to a slide portion between the peripheral portion of the substrate and the polishing member.

Abstract: The present invention is to provide a method and device for polishing a glass substrate, suitable for polishing a large-sized glass substrate. The device for polishing a substrate is adapted so that a substrate is attached to a film stretched on a frame; the frame is installed on a carrier; the carrier and a polishing surface-plate are brought closer relative to each other to polish a surface to be polished of the substrate attached to the film by pressing the substrate to the polishing surface-plate; the frame is removed from the carrier after the completion of the polishing, and the polished substrate is removed from the frame.

Abstract: A laser machining apparatus includes a nozzle connected to a pressurized gas and liquid reservoir for propelling a fine spray, mist or stream of a liquid such as water at the workpiece to be machined. A laser beam, preferably as may be generated by a UV laser or other source of exposure radiation, but is not strongly absorbed by the liquid assist material, is focused to the workpiece using, e.g., a focusing or imaging lens, while the fine spray, mist or liquid stream is propelled at the workpiece creating a layer of the liquid on its surface as the beam is incident upon the workpiece for machining.

Abstract: A vacuum insulated switchgear comprising: a vacuum container; a vacuum insulated switch having a movable contact connected to a movable electrode and a fixed contact connected to a fixed electrode for interrupting and closing current; an operating rod connected to the movable electrode and connected to a magnetic drive mechanism; and a connecting mechanism for operating the operating rod; wherein the magnetic drive mechanism and the connecting mechanism are aligned on a straight line, wherein each of the magnet drive mechanisms has a shape of a rectangular parallelopiped shape.

Abstract: The laser machining device is provided for drilling holes in components of a fluid injection device, particularly for injecting fuel into a combustion engine. The laser resonator is formed by an optically pumped diode laser solid state active medium. The resonator is arranged for supplying primary pulses in the microsecond range. Modulation means are arranged between the resonator and a machining head for modulating the amplitude of the primary pulses supplied by the resonator, so as to obtain a secondary pulse train of smaller length for each of said pulses.

Abstract: A bonding apparatus including a capillary 40 having a high-frequency coil 50 on its tip end portion and allowing a bonding wire 2 to pass therethrough, a position changing unit for changing the position of the tip of the bonding wire, a gas supply unit for supplying gas into the capillary, and a high-frequency power supply unit for supplying high-frequency power to the high-frequency coil. When the bonding wire is outside a plasma region 52 in the capillary, a microplasma generated in the plasma region is ejected out of the capillary and removes foreign matter or contaminants on the surface of a bonding subject. When the bonding wire is inside the plasma region, the material of the bonding wire is turned into fine particles, and a microplasma 303 containing sputtered fine particles is ejected from the capillary, allowing the material the same as the bonding wire to be deposited on the bonding subject.

Abstract: A microwave plasma processing method is provided which enables a uniform thin film layer to be formed on a surface to be processed and which enables a short time processing. In the microwave plasma processing method, microwaves are introduced into a plasma processing chamber 1, and a processing gas is transformed into plasma to form a thin film layer on a base substance 13 disposed in the plasma processing chamber 13, and the method comprises: fixing the base substance 13 coaxially with a central axis of the plasma processing chamber 1; setting a standing wave mode of the microwaves in the plasma processing chamber to a TE mode or a TEM mode from a mouth portion 131 to a body portion 133 of the base substance; and setting a mode having both the TE mode and a TM mode in a bottom portion 132 of the base substance.

Abstract: Apparatus and methods for controlling weld conditions during welding include identifying a transition between a first mode of operation during which no spatter is produced and a second mode of operation during which some amount of spatter is produced. A power supply voltage is adjusted such that welding occurs under conditions associated with the transition. Identifying the transition includes identifying near zero voltage fluctuations in the power supply voltage.

Abstract: The invention relates to an installation for the plasma processing of a continuous material (1). Said installation comprises at least one evacuatable discharge chamber (3a, 3b), through which the continuous material (1) can be conveyed continuously, a device for setting a gas atmosphere in the at least one discharge chamber (3a, 3b), wherein the device for setting a gas atmosphere comprises a prechamber system (10, 11, 12) and a postchamber system (2), with sluice openings being provided between the chambers (2, 3a, 3b, 10, 11, 12) of said systems, through which openings the continuous material (1) can be guided with low friction through the prechamber system (10, 11, 12) and the postchamber system (2). The device for setting a gas atmosphere comprises a recovery system wherein gas can be recirculated from a postchamber (2a . . . 2k) into a prechamber (10, 11, 12) and/or postchamber (2a . . . 2k) having a higher pressure level.

Abstract: A system and method for controlling a piston-cylinder assembly of a welding apparatus, said piston-cylinder assembly including a plurality of pressure chambers, wherein said piston-cylinder assembly is operatively coupled to at least one welding electrode of said welding apparatus so as to effect movement of said electrode in a pre-stroke and weld motion, comprises: connecting to a first port of the piston-cylinder assembly a first fluid pressure, said first port in communication with a first pressure chamber so as to effect the pre-stroke motion of the electrode; and connecting to a second port of the piston-cylinder assembly a second fluid pressure, said second port in communication with a second pressure chamber so as to effect the weld stroke motion of the electrode, wherein the second fluid pressure is different from the first fluid pressure.

Abstract: Since a welding apparatus according to an exemplary embodiment of the present invention is formed to radiate a laser beam at at least one position in at least one direction, a working hour may be reduced and productivity may be increased when a welding operation is performed by using the welding apparatus according to the exemplary embodiment of the present invention.

Abstract: An embodiment of the present invention is a technique to ablate patterns using laser patterning. A mask structure having features corresponding to first and second patterns receives an incident laser beam at a wavelength. A substrate panel is irradiated by the incident laser beam through the mask structure to have the first and second patterns ablated to first and second depths, respectively, such that a difference between the first and second depths is compensated according to an absorptivity of the mask structure. Hence, the first and the second patterns are ablated simultaneously.

Abstract: A coating removal apparatus utilizing a common optics path to provide laser pulses and light illumination to a coated surface. Reflected light resulting from the light illumination impinging the coated surface is directed to a photosensitive detector and analyzer. The reflected light is either sensed directly from the coated surface by the photosensitive detector or the reflected light is directed along at least a portion of the common optics path to the photosensitive detector. The apparatus is an integrated device including a laser source, a beam splitter, scanning optics, a waste removal apparatus, one or more light illuminators, a photosensitive detector, a comparator, and a control logic circuit. Alternatively, the coating removal apparatus is configured as a head component coupled to a body component.

Abstract: A technique of easy manufacture of a column and a bed of a machine tool in a short time is provided by having an assembly structure of sheet metal members. A column body of the machine tool is constituted by combining a front member 110 with a rear member 130 and mounting a side cover. Its inside is reinforced by a plurality of ribs 150, 160. Each of the members is made by precision laser machining of sheet plate materials. The column body is assembled by inserting projection portions provided on one member into slits formed on the other member.

Abstract: An optical scan system welds or marks a part by directing an optical beam onto the part at a sufficient energy density level to weld or mark it. A method of controlling a pattern where the part is to be exposed to the beam at the sufficient energy density level includes disposing a waveguide between the part and an optical source of the optical scan system to prevent areas of the part that are not to be welded or marked from being exposed to the beam at the sufficient energy density level to weld or mark them, allowing the areas to be welded or marked to be exposed to the beam at the sufficient energy level. In an aspect, the waveguide prevents the beam from being reflected in an undesired direction. In an aspect, the waveguide redirects the beam from the areas of the part that are not to be welded or marked to areas that are to be welded or marked to concentrate the energy on the areas to be welded or marked.

Abstract: A laser processing machine is provided in which a machining tool is automatically exchanged with a laser processing tool to be mounted to a processing head thereof to perform machining operations such as tapping to works. A machining tool 70 which is exchangeably clamped to a mounting section 510 of a processing head 50 of a laser processing machine has a body 720 and a piston member 730 in the body 720, and the piston member 730 supports an air motor 740, a reducer 750, a tool chuck 760, and a tap 762. Air is sent to the air motor 740 from an air source 551b by switching a valve, and an assist gas for a normal or reverse rotation is sent from an assist gas source 554b to the upper portion of the piston member 730, so that a tap is lowered to perform tapping to a work.

Abstract: A technology is provided in which a contaminant on a condenser lens in a laser processing machine is detected by detecting a change in focal lengths of the lens. A laser beam LB emitted from a laser resonator 10 is condensed by a condenser lens 100 in a processing head 50 to be irradiated from a nozzle 60 toward a test piece TP. A control device of the laser processing machine controls the moving of the processing head 50 in the Z axis direction and records the Z coordinate of the head. When a focal point falls on a surface of the test piece TP, a blue flame BF is generated. A light receiving device 300 receives the blue flame and sends a signal to the control device. In a contaminated condenser lens 100, a heat is accumlated, which expands the lens and reduces the focal length of the lens. A contaminant on the condenser lens is detected by using this change.

Abstract: A device for compacting and/or welding electric conductors (10), in particular for producing via nodes or end nodes of stranded conductors. The device includes a first electrode, one section of which constitutes a first delimitation surface of a compacting chamber that receives the conductor, the chamber in addition being delimited by one section of a counter-electrode that forms a second delimitation surface and by at least one additional third delimitation surface that is formed by a section of a delimitation element. The inventions simplifies the construction of the device, enabling repeated compacting and welding of conductors. To achieve this, a compacting chamber has a substantially triangular open cross-section, which is surrounded by the sections of the first electrode and the counter-electrode, these sections being adjustable in relation to one another, and by the delimitation element.

Abstract: A welding voltage judgment portion 16 of judging to see if a predetermined value of welding voltage inputted from an input device 11 falls within a predetermined certain range is provided, and when the aforementioned welding voltage judgment portion 16 judges that the predetermined value of welding voltage deviates from the certain range, a standard voltage corresponding to the aforementioned inputted predetermined value of welding current is selected from a unitary voltage table portion 19, making it possible to always keep the welding voltage stored in the welding device within a proper voltage range even when the worker inputs conditions deviating from the proper range during the operation of inputting welding conditions.

Abstract: The invention relates to a gas nozzle and to a welding torch equipped with the gas nozzle, a nozzle assembly and with a contact tube that have an artificially produced patina layer for the purpose of reducing the adhesion of welding spatters at least on a partial area of the surface thereof. The invention also relates to a cleaning device for welding torches having a brush provided with bristles. These bristles are made of a very soft elastic material, preferably plastic, and abrasive grains are embedded in the bristles.

Abstract: A method and apparatus for feeding wire from a source of wire to a weld includes one or more motors disposed adjacent the wire to drive the wire to the weld. A buffer is disposed between the source and an arc end of the torch. Another motor may be disposed near the wire source. A wire tension controller may be provided. The one or more motors advance and retract the wire, and wire is stored, or the path length altered, when the wire is retracted.

Abstract: The invention relates to a welding torch device (7) of a welding robot (1), which is provided for electric arc welding, in particular MIG welding or MAG welding. The aim of the invention is to relieve the supply lines during rotational movement and to advantageously adapt them to the welding robot. Said type of welding robot, generally comprises a robot arm (3) whereon a connection flange (6) is fixed thereto and can rotate in relation to the robot arm. The welding torch device comprises a fixing device and a receiving device. A connection for a welding power cable (18) can be electrically connected to a welding power source on the robot side of the welding torch device. The welding torch device also comprises a current transfer device via which the welding power cable can be electrically connected to a welding torch side of the welding torch device.

Abstract: A welding gun adapted to secure a contact tip within the welding gun without threading the contact tip and without the use of tools. The contact tip may be adapted to abut a surface of a first member disposed within the welding gun. The surface may be a surface of a gas diffuser. The surface may be adapted to abut the contact tip. The contact tip also may be adapted for abutment with a second member to urge the contact tip toward the first member. The second member may be a portion of a nozzle adapted to abut the contact tip to urge the contact tip toward the surface of the first member. A method of assembling a welding gun also is provided. The method may comprise disposing a contact tip between a first and a second member and capturing the contact tip between the first and second members.

Abstract: A wire feeder that can be connected to a variety of power supplies which includes a power conditioner that can detect a current and/or voltage level from a particular power supply and modify the current and/or voltage level when required so as to enable the wire feeder to operate in conjunction with the arc welder when connected thereto.

Abstract: A method of annealing a substrate comprising a trench containing a dielectric material, the method including annealing the substrate at a first temperature of about 200° C. to about 800° C. in a first atmosphere comprising an oxygen containing gas, and annealing the substrate at a second temperature of about 800° C. to about 1400° C. in a second atmosphere lacking oxygen. In addition, a method of annealing a substrate comprising a trench containing a dielectric material, the method including annealing the substrate at a first temperature of about 400° C. to about 800° C. in the presence of an oxygen containing gas, purging the oxygen containing gas away from the substrate, and raising the substrate to a second temperature from about 900° C. to about 1100° C. to further anneal the substrate in an atmosphere that lacks oxygen.

Abstract: An electric heating module includes an electric heater (10), a heat pipe (20) having an evaporating section (22) thermally attached to the electric heater and a condensing section (24), and at least one heat radiator (30, 40) thermally attached to the condensing section. The electric heater includes a pair of electrode plates (12, 14) and a heating element (16) sandwiched between and electrically connecting the electrode plates. An insulation frame (19) encloses the electrode plates therein for electrically insulating the electric heater from the heat radiator. For the non-linear PTC heating element, the electric heater can rapidly heat up to and stay at a desired stable temperature. The heat pipe can transfer heat from the electric heater to the heat radiator rapidly and timely by phase change.

Abstract: A fixing device includes a fixing member; a pressing member to be pressed against the fixing member; a first heating member for heating the fixing member; a second heating member for heating the fixing member supplementarily; and a third heating member for heating the pressing member. The first heating member has a first rated output; the second heating member has a second rated output; and the third heating member has a third rated output. The first rated output is greater than the second rated output, and the second rated output is equal to or greater than the third rated output. Further, the second heating member and the third heating member are connected in series relative to a voltage applying device or a power source.

Abstract: A fixing device includes: a fixing roller; a center temperature detection unit including a protective member, the center temperature detection unit contacts the fixing roller in an axial center of the fixing roller and detects a temperature of the center section; an end temperature detection unit that contacts the fixing roller at an end portion of the fixing roller outside of a maximum print area of the recording medium and detects a temperature of the end section; and a control unit that controls heating of the fixing roller performed by the heating unit so that the heating is stopped when the value detected by the center temperature detection unit has exceeded a first upper limit value and when the value detected by the end temperature detection unit has exceeded a second upper limit value, the first upper limit value being lower than the second upper limit value.