Patents Issued in January 11, 2007
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Publication number: 20070007656Abstract: An insulation interlayer having first contact holes exposing first contact pads is formed on a semiconductor structure having the first and second contact pads. Conductive patterns connected to the first contact pads through the first contact holes are formed on the insulation interlayer. Insulation layer patterns are formed on the insulation interlayer and the conductive patterns. The conductive patterns and the insulation layer patterns extend in different directions. Portions of the insulation layers, exposed between the conductive patterns and the insulation layer patterns, are etched to form second contact holes exposing the second contact pads. Capping patterns are formed on portions of the insulation layer patterns, exposed between the insulation layer patterns, and side faces of the second contact holes. Contact plugs electrically connected to the second contact pads are formed between the capping patterns and the contact plugs.Type: ApplicationFiled: June 29, 2006Publication date: January 11, 2007Inventor: Kuk-Han Yoon
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Publication number: 20070007657Abstract: Methods for forming conductive vias in a substrate include oxidizing at least a portion of a metallic structure that is exposed through an opening in a substrate to form an oxidation injury in the metallic structure. The oxidation injury is at least partially reversed, and conductive material is provided within the opening in the substrate. Electronic devices and systems include at least one conductive via extending through a substrate and contacting at least one conductive interconnect structure along an interface. The conductive interconnect structure includes an at least partially reversed oxidation injury at the interface between the conductive via and the interconnect structure.Type: ApplicationFiled: September 5, 2006Publication date: January 11, 2007Inventors: Max Hineman, Stephen Russell
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Publication number: 20070007658Abstract: First wirings and first dummy wirings are formed in a p-SiOC film formed on a substrate. A p-SiOC film is formed, and a cap film is formed on the p-SiOC film. A dual damascene wiring, including vias connected to the first wirings and the second wirings, is formed in the cap film and the p-SiOC film 22. Dummy vias are formed on the periphery of isolated vias.Type: ApplicationFiled: September 18, 2006Publication date: January 11, 2007Applicants: RENESAS TECHNOLOGY CORP., MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Kazuo TOMITA, Keiji HASHIMOTO, Yasutaka NISHIOKA, Susumu MATSUMOTO, Mitsuru SEKIGUCHI, Akihisa IWASAKI
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Publication number: 20070007659Abstract: An integrated circuit (IC) chip, semiconductor wafer with IC chips in a number of die locations and a method of making the IC chips on the wafer. The IC chips have plated chip interconnect pads. Each plated pad includes a noble metal plated layer electroplated to a platable metal layer. The platable metal layer may be copper and the noble metal plated layer may be of gold, platinum, palladium, rhodium, ruthenium, osmium, iridium or indium.Type: ApplicationFiled: June 29, 2006Publication date: January 11, 2007Inventors: Chandrasekhar Narayan, Kevin Petrarca
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Publication number: 20070007660Abstract: Method and apparatus for supporting and transferring a substrate in a semiconductor wafer processing system are provided. In one aspect, an apparatus is provided for supporting a substrate comprising a cover ring comprising a base having a bore disposed therethough, the base having an upper surface and one or more raised surfaces disposed adjacent the bore, wherein the raised surface comprise one or more first substrate support members disposed adjacent an edge of the bore and a capture ring disposed on the cover ring, the capture ring comprising a semi-circular annular ring having an inner perimeter corresponding to the bore of the cover ring and one or more second substrate support members disposed on the inner perimeter and adapted to receive a substrate, wherein the capture ring is adapted to mate with the cover ring and form one contiguous raised surface on the cover ring.Type: ApplicationFiled: September 11, 2006Publication date: January 11, 2007Inventors: Khiem Nguyen, Peter Satitpunwaycha, Alfred Mak
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Publication number: 20070007661Abstract: A radio frequency identification device (RFID) includes a non-conductive first substrate, an integrated circuit device mounted to the carrier substrate and having at least one conductive terminal and a patterned conductive coating applied to the non-conductive substrate and in contact with the at least one conductive terminal. The patterned conductive coating includes a polymeric matrix and a conductive particulate filler, the polymeric matrix being capable of undergoing at least 2% deformation elastically and without significant change in the conductive properties of the patterned conductive coating serving as an antenna. The RFID can be fabricated by affixing an IC chip to a surface of a substrate having a patterned conductive coating and applying a bridging coating to connect terminals of the IC chip to the antenna.Type: ApplicationFiled: June 7, 2006Publication date: January 11, 2007Inventors: Lester Burgess, F. Kovac
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Publication number: 20070007662Abstract: A semiconductor device including: a semiconductor layer including an element formation region and an isolation region provided around the element formation region; an element formed in the element formation region; an interlayer dielectric formed above the semiconductor layer; an electrode pad formed above the interlayer dielectric; a passivation layer formed above the electrode pad and having an opening which exposes at least part of the electrode pad; and a bump formed in the opening and having a rectangular planar shape having a short side and a long side, the bump at least partially covering the element when viewed from a top side, and the semiconductor layer positioned within a specific range inward and outward from a line extending vertically downward from the short side of the bump being a forbidden region.Type: ApplicationFiled: June 29, 2006Publication date: January 11, 2007Inventors: Akinori Shindo, Masatoshi Tagaki, Hideaki Kurita
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Publication number: 20070007663Abstract: An embodiment includes a dual interconnection form in which power/ground pads and signal pads of a semiconductor chip are electrically connected to a package substrate in different connection manners. First connection members that electrically connect the power/ground pads with the substrate have relatively large cross-sectional dimensions in comparison to its length, for example, solder bumps or gold bumps. Second connection members that electrically connect the signal pads with the substrate have relatively small cross-sectional dimensions in comparison its length, for example, conductive wires or beam leads. Such different ways of electrically connecting different kinds of pads with the substrate realize the most suitable electrical performance, effectively meeting the needs of high speed and low power consumption of the semiconductor devices.Type: ApplicationFiled: March 7, 2006Publication date: January 11, 2007Inventors: Seung-Duk Baek, Sun-Won Kang
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Publication number: 20070007664Abstract: Provided are a semiconductor package having a semiconductor chip, a rear surface of which is molded, and a method of fabricating the semiconductor package. The semiconductor package includes a semiconductor chip including a wafer and a metal pad formed on a front surface of the wafer; a solder ball formed on a front surface of the wafer, and electrically connected to the metal pad; and a reinforcing member formed on a rear surface of the wafer. The reinforcing member is formed of an epoxy molding compound, and the reinforcing member protrudes at least 5 ?m from side surfaces of the semiconductor chip.Type: ApplicationFiled: June 30, 2006Publication date: January 11, 2007Inventors: Chung-Sun LEE, Yong-Hwan KWON, Kyoung-Sei CHOI, Woon-Byung KANG
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Publication number: 20070007665Abstract: An electrical structure and method comprising a first substrate electrically and mechanically connected to a second substrate. The first substrate comprises a first electrically conductive pad and a second electrically conductive pad. The second substrate comprises a third electrically conductive pad, a fourth electrically conductive pad, and a first electrically conductive member. The fourth electrically conductive pad comprises a height that is different than a height of the first electrically conductive member. The electrically conductive member is electrically and mechanically connected to the fourth electrically conductive pad. A first solder ball connects the first electrically conductive pad to the third electrically conductive pad. The first solder ball comprises a first diameter. A second solder ball connects the second electrically conductive pad to the first electrically conductive member. The second solder ball comprises a second diameter. The first diameter is greater than said second diameter.Type: ApplicationFiled: July 5, 2005Publication date: January 11, 2007Applicant: INTERANTIONAL BUSINESS MACHINES CORPORATIONInventors: Lawrence Clevenger, Mukta Farooq, Louis Hsu, William Landers, Donna Zupanski-Nielsen, Carl Radens, Chih-Chao Yang
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Publication number: 20070007666Abstract: A substrate for manufacturing semiconductor device includes a wafer; a plurality of semiconductor elements formed on the wafer; a bump arranged in each peripheral section of the semiconductor elements; an alignment mark arranged in the each peripheral section of the semiconductor elements; and an adhesive layer formed on the semiconductor elements. The adhesive layer has a greater thickness in each central section of the semiconductor elements where the bump is not provided than in the each peripheral section of the semiconductor elements.Type: ApplicationFiled: June 29, 2006Publication date: January 11, 2007Inventor: Hideo Imai
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Publication number: 20070007667Abstract: An electronic package for a photo-sensing device is provided. The package is formed to include a substrate of a material substantially transparent to light within a predetermined range of wavelengths. The package further formed to include at least one photo-sensing die having a photo-sensing area defined on a front side thereof. The photo-sensing die is mounted to the substrate by a plurality of interconnection joints disposed about the photo-sensing area, whereby the front side of the photo-sensing die is spaced by a gap from a front surface of the substrate. A sealing structure is formed to extend about the interconnection joints to fill portions of the gap thereabout, such that the sealing structure contiguously encloses an internal cavity in substantially sealed manner between the photo-sensing die and substrate. This internal cavity communicates with the photo-sensing area of the photo-sensing die.Type: ApplicationFiled: September 15, 2006Publication date: January 11, 2007Inventor: Deok-Hoon Kim
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Publication number: 20070007668Abstract: A microelectronic assembly includes an integrated circuit die spaced apart from a substrate and connected by bump interconnections, and an polymeric encapsulant molded about the die. The encapsulant extends into the gap about the interconnections, but is confined to the perimeter so as to define an underchip optical window adjacent the central region of the die. The window allows optical access to the active face of the die, including to optical sensors thereon. During manufacture of the assembly, following attachment of the die on the substrate, a molding cavity is positioned about the die on the substrate. Polymeric material is injected into the cavity at a pressure effective to initiate flow into the gap about the solder bump interconnections. The pressure is then reduced to prevent flow of the polymeric material into the central region.Type: ApplicationFiled: September 15, 2006Publication date: January 11, 2007Inventors: Scott Brandenburg, Jeenhuei Tsai, Jeffrey Burns
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Publication number: 20070007669Abstract: A wire-bonding method and a semiconductor package using the same are provided. The semiconductor package includes a carrier; a chip mounted on the carrier; a plurality of first wires and second wires alternatively arranged in a stagger manner, with a wire loop of each second wire being downwardly bent to form a deformed portion so as to provide a height different between the wire loops of each first wire and each second wire, wherein the first and second wires electrically connect the chip to the carrier; and an encapsulant for encapsulating the chip, the first wires, the second wires and a portion of the carrier. The height difference between the wire loops of each first wire and each second wire increases a pitch between adjacent first and second wires thereby preventing the wires from contact and short circuit with each other due to wire sweep during an encapsulation process.Type: ApplicationFiled: September 15, 2006Publication date: January 11, 2007Applicant: Siliconware Precision Industries Co., Ltd.Inventors: Chin-Teng Hsu, Ming-Chun Laio, Holman Chen, Chun-Yuan Li, Fu-Di Tang
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Publication number: 20070007670Abstract: A bond pad structure includes a plurality of normal bond pads, a conductive structure and a plurality of backup bond pads. The conductive structure has a plurality of blocks, and at least one of the backup bond pads is disposed on individual blocks. The blocks are isolated from each other by a dielectric material. The normal bond pads on the blocks correspond to the backup bond pads, and each normal bond pad is electrically connected with the corresponding backup bond pad.Type: ApplicationFiled: December 13, 2005Publication date: January 11, 2007Inventor: Te-Wei Chen
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Publication number: 20070007671Abstract: A semiconductor device including a semiconductor substrate having a plurality of electrodes, a resin protrusion formed on the semiconductor substrate, and an interconnect electrically connected to the electrodes and formed to extend over the resin protrusion. A depression is formed in a top surface of the resin protrusion. The interconnect has a cut portion disposed over at least part of the depression.Type: ApplicationFiled: July 5, 2006Publication date: January 11, 2007Inventor: Shuichi Tanaka
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Publication number: 20070007672Abstract: The present invention provides an electrode material package, by which the electrode materials are protected from damages due to external impacts, etc. during the transportation or storage. Further, with the electrode material package of the present invention, the electrode material can be kept under a low humidity atmosphere, and the term over which the quality of the electrode material is guaranteed can be prolonged. The electrode material package 20 has a roll of the electrode material 1 wound onto a winding core 2; a pair of flanges 21, of which the side faces 21a have larger dimensions than the roll of the electrode material 1, holding both sides of the roll of the electrode material 1 through a pair of cushion materials 22; and a bag 19 made of a package film 10. The package film 10 of the bag 19 includes a moisture proof layer 12 of an aluminum foil and an intermediate layer 13 of an oriented nylon, which is located inside of the moisture proof layer 12 and faces the electrode material 1.Type: ApplicationFiled: September 29, 2004Publication date: January 11, 2007Inventors: Satoshi Goishihara, Kei Hasegawa
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Publication number: 20070007673Abstract: Disclosed is a nebulizer mounted to an ultrasonic humidifier. In the nebulizer, a heat sink holder can be directly connected to one side of a bottom plate in the humidifier, by using a flange provided at the upper end portion of the heat sink holder to which a heat sink for irradiating the heat generated in a PCB outward is mounted. Further, a vibrator assembled with the heat sink can be easily separated and replaced, because the heat sink is stacked on and assembled with the heat sink holder. Furthermore, the size of the ultrasonic humidifier is reduced, because a water level sensor is assembled and integrated with the upper surface of the heat sink. Furthermore, the durability of a vibrator as well as the heat sink is improved, because the heat sink is made of brass coated with a nickel plating layer.Type: ApplicationFiled: March 27, 2006Publication date: January 11, 2007Inventors: Jeung Jae-Bong, Jung Dong-Min
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Publication number: 20070007674Abstract: A humidifying apparatus comprising: a pleated functional element comprising a pleated structure and, secured to the pleated structure around a periphery thereof, a reinforcing frame, wherein the pleated structure is comprised of a humidifying membrane and, superimposed on at least one surface thereof, a gas-permeable reinforcing material layer, and a dry-side channel and a wet-side channel which are, respectively, provided on opposite sides of the pleated functional element, wherein each of the dry-side channel and the wet-side channel has at least one pair of a gas-intake and a gas-outlet, the humidifying apparatus having a first pressure-buffering means between the gas-intake and an outside conduit connected thereto and a second pressure-buffering means between the gas-outlet and an outside conduit connected thereto, wherein the humidifying membrane divides the internal space of the pleated functional element into spaces which form a part or whole of the dry-side channel and a part or whole of the wet-sideType: ApplicationFiled: May 28, 2004Publication date: January 11, 2007Applicant: ASAHI KASEI KABUSHIKI KAISHAInventors: Takuya Hasegawa, Takahiko Kondo, Yoshimichi Mitamura
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Publication number: 20070007675Abstract: A method of manufacturing a compound optical element that reduces any damage to the mold and the lens base material caused by tight contact between the mold and the resin layer, enables easy control of thickness of the resin layer and realizes high productivity is provided. For this purpose, the method of manufacturing a compound optical element having a resin layer on a surface of a base material includes the steps of: applying a liquid of ultraviolet curing resin to at least one of the base material and the mold body; adjusting arrangement of the base material and the mold body; curing the liquid of ultraviolet curing resin at an outer circumference of a release facilitating region; curing the liquid of ultraviolet curing resin at the release facilitating region; and separating a resin layer formed by curing from the mold body.Type: ApplicationFiled: July 10, 2006Publication date: January 11, 2007Applicant: SANYO ELECTRIC CO., LTD.Inventor: Youhei Nakagawa
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Publication number: 20070007676Abstract: An electro-optic modulator includes a substrate made of a material which has an electro-optic effect and a pyroelectric effect. In the substrate, an optical waveguide is formed to have at least a pair of optical paths. On the substrate and on the optical waveguide, a transparent buffer layer is formed to cover the optical waveguide. On the buffer layer, first and second electrodes are formed so that the first and the second electrodes are arranged to cause refractive index changes in the pair of optical paths in response to electrical fields surrounding the electro-optic modulator. The buffer layer is a mutual diffusion layer. The mutual diffusion layer is made from laminated films having at least one transparent insulator film and at least one transparent conductor film but has no clear boundary between the transparent insulator film and the transparent conductor film.Type: ApplicationFiled: September 14, 2006Publication date: January 11, 2007Applicant: SEIKOH GIKEN CO., LTD.Inventor: Masahiro Sato
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Publication number: 20070007677Abstract: The present invention is a method of manufacturing polymer particles. The method includes providing an oil in water emulsion, wherein the oil phase comprises a volatile solvent and at least one water insoluble polymer. The volatile solvent has a solubility of not more than 10% in water and the water insoluble polymer has a weight average molecular weight of at least 2000. The water insoluble polymer is soluble in the volatile solvent. The emulsion is supplied to a rotating surface of a rotating surface reactor. The temperature of the rotating surface is maintained at the boiling point of said solvent or greater. The rotating surface of the reactor spins at a speed sufficient to cause the emulsion to spread over the rotating surface as a continuously flowing thin film wherein a vapor phase containing the volatile solvent is removed. The water insoluble polymer particles are then collected as a slurry of polymer particles and water.Type: ApplicationFiled: July 8, 2005Publication date: January 11, 2007Inventors: Stewart Blair, Lloyd Lobo, Tomas McHugh
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Publication number: 20070007678Abstract: Ceramic composite materials have unidirectional alignment of the reinforcing fibers. The ratio of the volume of the fiber strands of the reinforcing fibers to the volume of the matrix is at least 0.5. A process for their production involves initially coating the fiber strands or rovings of the reinforcing fibers with a sacrificial polymer. The coated fiber strands are processed with binder resins into unidirectionally reinforced CFK molded parts. The formed CFK bodies are carbonized to form CFC bodies. The CFC bodies are then silicized with liquid silicon. The liquid silicon diffuses into the pores formed in the CFC body and combines there at least partially with the carbon to form silicon carbide. The sacrificial polymer is pyrolized. The ceramic composite materials also can be used in fiber-reinforced ceramic structural parts.Type: ApplicationFiled: February 28, 2003Publication date: January 11, 2007Inventor: Bodo Benitsch
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Publication number: 20070007679Abstract: The present invention provides a composite material and a carbonized composite material having high electric conductivities and heat conductivities, in each of which nanocarbons are uniformly mixed, and a method for producing the materials. The composite material of the present invention comprises: a high polymer, in which an atomic group including a heteroatom, such as nitrogen, oxygen or sulfur, exists in a main chain or a side chain; and nonocarbons. The carbonized composite material of the present invention is produced by burning the above described composite material.Type: ApplicationFiled: March 15, 2005Publication date: January 11, 2007Inventors: Hitoshi Hashizume, Makoto Shimizu
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Publication number: 20070007680Abstract: The rheology of polyethylene resin may be controlled by measuring the specific energy input (SEI) to the extruder and then adjusting a process parameter in response to a change in the SEI and/or by introducing both a free radical initiator and an alkali earth metal stearate into the polymerization. Indeed, the process parameter changed in response to the SEI measurement may be adjusting the proportion of free radical initiator, adjusting the proportion of alkali earth metal stearate, or both. The free radical initiator may be a peroxide, and the alkali earth metal stearate may be calcium stearate.Type: ApplicationFiled: July 5, 2005Publication date: January 11, 2007Applicant: Fina Technology, Inc.Inventors: Vincent Henri Barre, Son Nguyen, Cyril Chevillard, Gerhard Guenther
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Publication number: 20070007681Abstract: Improving polyethylene film properties may be accomplished by measuring the specific energy input (SEI) to the extruder and then adjusting a process parameter in response to a change in the SEI and/or by introducing both a free radical initiator and an alkali earth metal stearate into the polymerization. Alternatively or in addition thereto, selecting the optimum free radical initiator for a particular polyethylene resin polymerized in the presence of a selected catalyst between two resin properties may be accomplished by examining the ratio of: % ? ? ? variation ? ? ? in ? ? ? a ? ? ? first ? ? ? property % ? ? ? variation ? ? ? in ? ? ? a ? ? ? second ? ? ? property of polyethylene resins individually made with each free radical initiator under consideration. The free radical initiator may be oxygen, peroxides, peroxyketals, peroxyesters, and/or dialkyl peroxides.Type: ApplicationFiled: November 7, 2005Publication date: January 11, 2007Applicant: Fina Technology, Inc.Inventors: Cyril Chevillard, Son Nguyen, Gerhard Guenther, Vincent Barre
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Publication number: 20070007682Abstract: A low cost process of making modified cellulosic materials by melt blending with at least 30% recycled and commingled plastic waste stream at higher temperature and pressure where at least 70% of plastics melts and encapsulate the filler. The plastic encapsulated filler can be used as a feed stock for continuous or discontinuous process of compression, extrusion, coextrusion and injection molded structural (e.g. profiles, stake, panel) and non-structural (e.g. sheet, thin-board) articles by mixing with a thermoplastic (e.g. polyethylene, polypropylene, polyvinyl chloride, polystyrene) or a hybrid mixture of said thermoplastics, bonding agents, plastic processing additives, impact modifiers, colorant and with/without a lightner.Type: ApplicationFiled: June 27, 2006Publication date: January 11, 2007Inventors: Debesh Maldas, Timothy Morrison
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Publication number: 20070007683Abstract: A control system for an injection molding machine performs a molding cycle. The molding cycle includes a filling process for controlling an advancing motion of a screw of the injection molding machine, and a hold press process for controlling a pressure of a molten resin after the filling process. The control system includes retracting speed limit means for limiting a retracting speed of the screw to a predetermined retracting speed limit value after a pressure control in the hold press process begins.Type: ApplicationFiled: September 19, 2006Publication date: January 11, 2007Inventor: Mitsuaki Amano
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Publication number: 20070007684Abstract: A process and apparatus for insertion of a stuffer plug (18) within a hollow section of a automotive weatherseal extrudate (10) is provided which operates by insertion of a needlelike section (20) of a dispenser unit through a wall of the extrudate into the hollow section. A stuffer plug precursor is then injected or inserted into the hollow section and the needle-like section of the dispenser is removed. The stuffer plug precursor (22) then forms a stuffer plug (18) within the hollow section. Preferably, the stuffer plug is a two part polyurethane which reacts chemically to form a polyurethane foam stuffer plug (18) within the hollow section. An easier method for establishing a stuffer plug (18) within an extrudate (10) is provided.Type: ApplicationFiled: May 28, 2004Publication date: January 11, 2007Inventors: Yvan Santin, A. Siktabzadeh, Matthew Murray
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Publication number: 20070007685Abstract: Systems and methods are disclosed for making a moldable polymer mixture containing long reinforcing fibers that suffered no significant damage during plastication. The system and method produces a mixture in which the long fibers are longer and have encountered less damage than moldable mixtures made in previous plasticators. The plasticator system has a single screw, but with multiple zones for treating the materials differently. The long fibers, wet or dry, are fed into a downstream zone, distributed over a large port in a low density concentration, and heated and dispersed with low shear to separate the long fibers and surround them with polymer for protection before subjecting them to medium to high shear to finalize the dispersion of the long fibers.Type: ApplicationFiled: July 5, 2005Publication date: January 11, 2007Inventors: Klaus Gleich, Dale Armstrong, Thomas Derengowski, Thomas Hilborn
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Publication number: 20070007686Abstract: A preservative chemical to create a water-tolerant, full coverage, formaldehyde encasing, fire resistant preserved solid sawn wood products and composite boards as well as methods of manufacturing same.Type: ApplicationFiled: July 5, 2006Publication date: January 11, 2007Inventor: Josh Reid
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METHOD FOR ELIMINATING A WELDING LINE OF AN UPPER CASE OF A KEYBOARD AND AN UPPER CASE OF A KEYBOARD
Publication number: 20070007687Abstract: A method for eliminating welding line of an upper case of a keyboard and an upper case of a keyboard are provided. The upper case of a keyboard includes an opening. The opening defines a rim. In accordance with the method, a mold is filled with plastic substance using the opening as the melt entrance. Then the mold is released to get the semi-finished upper case. Finally a movable housing is affixed on the rim of the opening to finish the upper case.Type: ApplicationFiled: September 19, 2006Publication date: January 11, 2007Applicant: DARFON ELECTRONICS CORP.Inventors: Shih-Hung Chao, Yu-Hong Liu -
Publication number: 20070007688Abstract: The present invention provides polymer gel-processing techniques and polymer articles of high modulus.Type: ApplicationFiled: February 25, 2004Publication date: January 11, 2007Inventors: Magnus Kristiansen, Theo Tervoort, Paul Smith
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Publication number: 20070007689Abstract: A riser for an archery bow is formed from a fibrous composite material, the matrix of which may be a high heat distortion thermoplastic polymer, a very high heat distortion thermoplastic polymer, or a combination thereof. The riser may incorporate a spine formed from a different polymer or composite than the rest of the riser, or from metal. A method for producing a riser for an archery bow includes the steps of introducing a polymeric composite into a mold from a first end of said mold to facilitate a particular orientation of components of said polymeric composite, molding the polymeric composite to produce a billet that approximates a net shape of the riser, and then machining the billet to the final shape of the riser.Type: ApplicationFiled: September 12, 2006Publication date: January 11, 2007Inventor: Edward Pilpel
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Publication number: 20070007690Abstract: A foil-decorating injection molding apparatus 1 comprises a male mold 20 and a female mold 2, a transport chuck 30 for feeding a decorative sheet S between the male mold 20 and the female mold 2, and a damper 10 for pressing and fastening the decorative sheet S onto a parting surface 2a of the female mold 2. The transport chuck 30 consists of two clamping devices 31 each clamping the side edge on either side of the decorative sheet S. The damper 10 consists of a pressing frame 11 and a connecting member 12 and is formed in a shape such that, even when the pressing frame 11 is in abutment with the female mold 2, there is established a space between the connecting member 12 and the female mold 2 in which the clamping devices 31 can pass through. After the decorative sheet S is fed by the clamping chuck 30, the sheet S can be fastened by the damper 10 without having to wait until the chuck 30 is brought back to an initial standby position, thereby reducing the manufacturing time.Type: ApplicationFiled: August 26, 2004Publication date: January 11, 2007Inventor: Hiroyuki Atake
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Publication number: 20070007691Abstract: A method, apparatus and system are provided for producing a molded part having a visually exposed surface comprising at least one side surface, the or each side surface being joined to a base surface at a corresponding substantially rectilinear edge. According to one aspect of the invention, the method includes the steps of: providing a mold comprising a mold surface complementary to said visually exposed surface; providing a film comprising a first face and a second face, and inserting said film into said mold such that said first face is facing said mold surface; closing the mold and injecting a molten material into the mold in a manner to urge said first face of said film into abutting contact with said mold surface and such that at least a layer of said molten material is formed in overlying relationship with said second face of said film; and allowing the molten material to solidify and possess said film.Type: ApplicationFiled: May 31, 2006Publication date: January 11, 2007Inventors: Sami Sagol, Alexander Shusier
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Publication number: 20070007692Abstract: Curable compositions, such as benzoxazine-based ones, are useful in applications within the aerospace industry, such as for example as a heat curable composition for use as a matrix resin in advanced processes, such as resin transfer molding, vacuum assisted transfer molding and resin film infusion, and their use in such advanced processes form the basis of the present invention.Type: ApplicationFiled: August 5, 2004Publication date: January 11, 2007Inventors: Stanley Lehmann, Wei Li, Raymond Wong
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Publication number: 20070007693Abstract: A pill delivery and packing apparatus having a feeder tube for delivering pills is provided. The feeder tube has a helical delivery chute that extends between an inlet side and an exit side of the tube. The delivery chute has a helical inner contour and a rectangular cross section that corresponds to the shape of the pills. The helical delivery chute is configured such that each of the pills rotates while proceeding through the delivery chute, whereby such rotation of the pills prevents jamming of the pills in the delivery chute. Independently extendable pins are used to alternately block and open the delivery chute, thus providing an escapement mechanism for dispensing pills. The tube also has an outer surface defining a helical outer contour that guides a rotatable tray on which pills are disposed. Associated apparatuses and methods are also provided.Type: ApplicationFiled: September 14, 2006Publication date: January 11, 2007Inventor: John Aylward
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Publication number: 20070007694Abstract: When compression molding is performed continuously, lumps of molten synthetic resin (drops), which are supplied by extrusion, are continuously, accurately, and rapidly inserted into plurality of compression molding dies which are rotatingly movable. A method and device for continuously supplying drops into female moldings which are rotatingly movable for manufacturing moldings, wherein synthetic resin in molten condition extruded from an extrusion opening is cut by a cutter attached to a holding mechanism to form the molten resin into drops in a determined quantity, the drops are held and conveyed by the holding mechanism, and the drops are forcibly inserted and supplied into the concaves of the female moldings.Type: ApplicationFiled: July 13, 2004Publication date: January 11, 2007Applicant: TOYO SEIKAN KAISHA, LTD.Inventors: Satoru Nemoto, Yoshihiko Kimura, Ken Itou, Shoichiro Takano, Hiroyuki Hashimoto, Masayuki Sasaki
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Publication number: 20070007695Abstract: A method for producing three-dimensional parts made of fiber material using a mold, comprising a bottom mold, the inner side of which determines the contour of the bottom side of the molded part and a top mold whose inner side determines the contour of the top side of the molded part. The bottom mold and/or the top mold have holes enabling the passage of air. Fibers are blown into the interior of the closed mold with the aid of an air current and are deposited in the inner sides of the bottom mold and the top mold, whereby a blank of fiber material is formed, the fibers bound together by a bonding agent, whereupon the blank is hardened into a molded part. A device for the production of three-dimensional molded parts comprises a mold having at least one inlet hole for blowing in the fiber material. The molded part has areas with different thickness.Type: ApplicationFiled: April 2, 2004Publication date: January 11, 2007Applicant: Fiber Engineering GmbHInventor: Egon Forster
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Publication number: 20070007696Abstract: A hardware configuration and related method for straight injection molding of ophthalmic lenses using thermal control fluid circulating within a closed channel located interior of the insert. The channel is closed by a no-leak valve. The adjusting body is equipped with a mating no leak valve. The valves seal over an operational distance L before the valves are opened to admit the thermal circulating fluid into the insert. The insert can be easily changed or shimmed without leaking and without having to change the insert configuration.Type: ApplicationFiled: July 8, 2005Publication date: January 11, 2007Inventor: Russell Weymouth
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Publication number: 20070007697Abstract: A Production method of tone wheel made of elastic material to be fixed to a rotating member in which a magnetic encoder is assembled in combination of the tone wheel and a magnetic sensor provided at a fixed member. The tone wheel is produced by using newly designed an assembled molding die which comprises one die blocks and the other die blocks which are detachably engaged each other, and which has a flash groove at matching surface where the distal of the one die blocks and that of the other die blocks are matched. The one die blocks have an annular molding surface formed on the magnetic die member side of the assembled die, and the other die blocks have an annular molding receiving surface part which is formed with an annular molding surface.Type: ApplicationFiled: June 28, 2006Publication date: January 11, 2007Applicant: Uchiyama Manufacturing Corp.Inventors: Hideo Mizuta, Manabu Ono
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Publication number: 20070007698Abstract: The present invention relates to a process for producing a three-dimensional model in which a binder has good discharge properties and curability. The process for producing a three-dimensional model is a process for producing a three-dimensional model that includes a step (layer formation step) of forming above a support a layer of a powder material, the layer having a predetermined thickness, a step (cross-sectional shape formation step) of imagewise bonding the powder material layer by a binder according to sliced cross-sectional data of a modeled object so as to give a cross-sectional shape, and sequentially repeating the above steps, the binder having a viscosity at 25° C. of 5 to 100 mPa·s.Type: ApplicationFiled: August 17, 2004Publication date: January 11, 2007Inventor: Shojiro Sano
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Publication number: 20070007699Abstract: The invention utilizes a layered manufacturing process to produce an article (2) having at least one small-width fluid conduction vent (6) produced during the layered manufacturing process. Such small-width fluid conduction vents (6) may have any desirable cross-sectional shape, orientation, and curvature. The invention also includes articles (2) containing at least one small-width fluid conduction vent (6) wherein the article (2) and the small-width vent or vents (6) are simultaneously produced by a layered manufacturing process.Type: ApplicationFiled: September 9, 2004Publication date: January 11, 2007Applicants: Extrude Hone Corporation, General Motors CorporationInventors: Michael Rynerson, James Hetzner, Judith Fisher, Daniel Maas, Donald Nelson, Lawrence Voss
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Publication number: 20070007700Abstract: It is an object of the present invention to provide a method for preparing a dielectric paste for a multi-layered ceramic electronic component that enables preparation of a dielectric paste in which a dielectric material is dispersed with a high dispersibility while controlling the concentration of the dielectric material in a desired manner. The method for preparing a dielectric paste for a multi-layered ceramic electronic component includes a kneading step of kneading a dielectric powder, a binder and a solvent to form a clay-like mixture and a slurrying step of adding the same solvent as that used at the kneading step to the mixture obtained by the kneading step to lower the viscosity of the mixture, thereby slurrying the mixture.Type: ApplicationFiled: September 28, 2004Publication date: January 11, 2007Applicant: TDK CorporationInventors: Shigeki Satou, Akira Yamaguchi
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Publication number: 20070007701Abstract: A shock absorber to absorb the shocks caused when a transport motor vehicle, a truck or the like approaches the vertical wall of a loading platform or to absorb changes of distance between the vehicle and the wall of the loading platform upon loading/unloading, including at least one support or contact member (1) which is connected to a fixed member (6) by mechanical connecting means (10) of dampening material which allows said support member to shift axially by changing its distance with respect to said fixed (6) member of the shock absorber.Type: ApplicationFiled: February 13, 2004Publication date: January 11, 2007Inventors: Pasquale Lorusso, Giuseppe Lorusso
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Publication number: 20070007702Abstract: The invention relates to a device for fixing a workpiece, the device comprising at least two arms (13, 15) having at least one clamping axis running between the at least two arms for clamping a workpiece and at least one connecting element (17) holding the at least two arms (13, 15) spaced apart from each other. According to the invention, at least one adjusting device (21, 42, 44, 62, 66) is provided for changing or adjusting the position of a workpiece to be clamped at least perpendicularly to the at least one clamping axis, or for changing or adjusting the position of the at least one clamping axis at least perpendicularly to a workpiece to be clamped.Type: ApplicationFiled: June 8, 2006Publication date: January 11, 2007Inventor: Bernhard Brandl
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Publication number: 20070007703Abstract: A lockable mount (10) constructed in accordance with the principles of a preferred embodiment of the present invention and configured for mounting a jewelry crafting attachment (12) to a workbench (B). The illustrated lockable mount (10) broadly includes a mount plate (14) configured to be coupled to the support (B) to receive the attachment (12) and a locking assembly (16) associated with the mount plate (14) for selectively preventing the attachment (12) from moving relative to the mount plate (14). The illustrated mount plate (14) is configured to provide a universal mount wherein several attachments can be quickly and readily interchanged for secure support thereon and comprises a six sided body presenting a generally trapezoidal configuration. The illustrated locking assembly (16) includes a flexible locking plate (36), an entrapped pin (38), and an actuating screw (40). The flexible locking plate (36) is shiftable between a flush position and a locking position.Type: ApplicationFiled: August 14, 2006Publication date: January 11, 2007Applicant: GLENDO CORPORATIONInventors: Donald Glaser, Lon Tidwell
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Publication number: 20070007704Abstract: The present invention comprises various embodiments of a power vise in which a supplementary power source is used to open and close the jaws. All embodiments may be actuated by a remote control, so the operator may have both hands free to hold the workpiece as it is placed in or removed from the vise. All embodiments may also include means for regulating the pressure developed between the jaws. A first embodiment is an electrically operated vise. The output shaft of an electric motor is connected to the advance screw of the vise to turn the screw and close or open the jaws. A second embodiment includes a hydraulic ram, with a first jaw affixed to the hydraulic cylinder and a second jaw affixed to the piston rod of the hydraulic device. Hydraulic pressure is used to retract and extend the piston rod, thereby closing and opening the jaws.Type: ApplicationFiled: June 5, 2006Publication date: January 11, 2007Inventor: Ronald Hooper
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Publication number: 20070007705Abstract: A chopping block includes a board. A connection member is defined along the middle of the board, whereby the board can be folded. The user can cut food on the board, and then fold the board to concentrate the food along an area surrounding the connection member and then tilt the board so that the movement of the food is easily controlled. When the chopping block is not being used, the board can be folded to save storage space.Type: ApplicationFiled: July 5, 2005Publication date: January 11, 2007Inventor: Kuo-Chang Chen