Abstract: This invention provides for the integration of metal-insulator-metal (MIM) capacitors with the damascene interconnect structure and process. The method includes forming a damascene interconnect structure and a MIM capacitor damascene structure wherein a diffusion barrier material forms the capacitor electrodes. The method includes forming a MIM capacitor damascene structure through an interlevel dielectric layer and terminating on a diffusion barrier material instead of a conventional dielectric etch stop layer. In alternative embodiments, the integrated damascene MIM capacitor makes up part of semiconductor device such as DRAM memory, CMOS, or a high frequency device.

Abstract: A memory circuit includes a first resistor composed of chalcogenide, a second resistor composed of chalcogenide, and electrically connected in series to the first resistor, and an inverter having an input terminal electrically connected to a node through which the first and second resistors are electrically connected to each other.

Abstract: Provided is a method of forming a contact hole. The method includes: depositing an interlayer insulating layer on a semiconductor substrate on which a dummy region and an active region are defined; coating a photoresist film on the interlayer insulating layer; patterning the photoresist film using a mask having a light transmission region, a partial light transmission region and a light shielding region; and etching the patterned photoresist film and the interlayer insulating layer to form a contact hole at the active region and a dummy contact hole at the dummy region.

Abstract: In a semiconductor device, a plurality of interconnections are formed in an interconnection formation insulating interlayer, and a plurality of reinforcing elements are substantially evenly formed in blank areas of the interconnection insulating interlayer in which no interconnection is formed. A wire-bonding electrode pad is provided above the interconnection formation insulating interlayer so that a pad area, on which the wire-bonding electrode pad is projected, is defined on the interconnection formation insulating interlayer. A part of the reinforcing elements included in the pad area features a larger size than that of the remaining reinforcing elements.

Abstract: The present invention generally relates to a method for fabricating a stackable packaged device and a method for producing a packaged device stack utilizing stackable packaged devices. The present invention further refers to a stackable packaged device and a packaged device stack.

Abstract: A memory card comprising a substrate, a memory die on top of the memory die, a controller die on top of the memory die; and a interposer surrounding the controller die and on top of the memory die wherein the interposer allows for wire bonding to the substrate to be minimized. A system and method in accordance with the present invention achieves the following objectives: (1) increase the density of the Flash card by reducing the number of wire bond pads on the substrate and enabling insertion of the largest die possible that can fit inside a given card interior boundary; (2) more efficiently stacks Flash memory dies when stacking is necessary, to increase density of the Flash card; (3) has only a few necessary signal I/O bonding wires to the substrate to improve production yield.

Abstract: A stacked die semiconductor package includes: a substrate, having a first surface and an opposite surface thereto; a plurality of dice, structured for being stacked one on top of the other on the first surface of the substrate, including at least a first die which is mounted closest to the first surface, a second die mounted thereupon and having a larger footprint area than the first die, and a top die having a smaller footprint area than the underlying die thereof, and each having a plurality of contact pads and a plurality of wires for electrically connecting the dice to the first surface of the substrate; at least one interposer between the plurality of dice; advantageously, said top die is electrically directly connected to one of the underlying dice. A method for the assembly of a stacked die semiconductor package is provided.

Abstract: A semiconductor die includes a plurality of drivers and a plurality of bonding pads. Each driver is formed by a plurality of interconnected modules and has an associated bonding pad to which at least one of the modules of the driver is electrically connected. The modules of some of the drivers are positioned outside of the associated bonding pad toward a periphery of the die. The bonding pads may be arranged, for example, in a double- or triple-staggered pattern around the periphery of the die.

Abstract: A double-sided or multilayer wiring board having high-density wiring is obtained by embedding a spherical semiconductor element in an electrically insulating substrate which composes the wiring board, and a thin electronic device can be provided using such a wiring board. Furthermore, a flexible double-sided or multilayer wiring board which is capable of being housed in a limited space while keeping a desired form can be provided by embedding the spherical semiconductor element, and a thin electronic device can be provided using a variety of such wiring boards by imparting different types of flexibility to desired parts of such a wiring board as required.

Abstract: The invention provides, in one aspect, a semiconductor device that comprises an interconnect layer located over a semiconductor substrate. A passivation layer is located over the interconnect layer and having a solder bump support opening formed therein. Support pillars that comprise a conductive material are located within the solder bump support opening.

Abstract: The present invention relates to an image sensor module including a flexible printed circuit board (FPCB) having a window; and an image sensor that is formed to have the same size as the width of the FPCB and is attached on one surface of the FPCB, the image sensor including a light receiving section, which receives light passing through the window, and a signal processing section which processes signals generated by the light receiving section.

Abstract: Example embodiments relate to a semiconductor package, a method of manufacturing the semiconductor package, a stacked semiconductor package including the semiconductor package, and a method of manufacturing the stacked semiconductor package. Other example embodiments relate to a semiconductor package having a structure that allows at least two packages to be stacked, a method of manufacturing the semiconductor package, a stacked semiconductor package including the semiconductor package, and a method of manufacturing the stacked semiconductor package.

Abstract: A coil comprises a layer of permeable material (4) deposited in a chip (CH) of an integrated circuit (IC) in a plane substantially parallel to a surface (A) of a substrate (1) of the chip (CH). A first conductor element (6a, 6b; BW10, BWI 1; 60a, 60b) is arranged at a first side of the permeable material (4) facing away from the substrate (1). A second conductor element (2a, 2b; T1, T2) is arranged at a second side of the permeable material (4) opposite to the first side. An interconnection (8a, 8b; P2, P4) interconnects a first end of the first conductor element (6a, 6b; BW10, BWI 1; 60a, 60b) and a first end of the second conductor element (2a, 2b; T1, T2). The interconnection (8a, 8b; P2, P4), the first conductor element (6a, 6b; BW10, BW11; 60a, 60b) and the second conductor element (2a, 2b; T1, T2) are arranged to form a winding around the permeable material (4).

Abstract: An overlay metrology mark for determining the relative position between two or more layers of an integrated circuit structure comprising a first mark portion associated with and in particular developed on a first layer and a second mark portion associated with and in particular developed on the surface of a second layer, wherein each mark portion comprises a single two dimensional generally orthogonal array of individual test structures. A method of marking and a method of determining overlay error are also described.

Abstract: An overlay mark is provided. A first material layer is formed on a substrate, and then a first trench serving as a trench type outer mark is formed in the first material layer. The first trench is partially filled with the first deposition layer. A second material is formed over the first trench and the first deposition layer. A second trench is formed exposing the first deposition layer within the first trench. The second trench is partially filled with a second deposition layer forming a third trench. A third material layer is formed on the substrate to cover the second deposition layer and the second material layer. A step height is formed on the third deposition layer between the edge of the first trench and the center of the first trench. A raised feature serving as an inner mark is formed on the third deposition layer.

Abstract: An alignment mark including a first mark usable for both coarse alignment measurement in a first direction and fine alignment measurement in the first direction, and a second mark usable for coarse alignment measurement in a second direction different from the first direction.

Abstract: There is provided a semiconductor device, in which characteristics of the semiconductor device are improved by thinning a gate insulating film and a leak current can be reduced, and a manufacturing method thereof. An aluminum film which is a metal film is formed over a polycrystalline semiconductor film, and plasma oxidizing treatment is performed to the aluminum film, whereby an aluminum oxide film is formed by oxidizing the aluminum film, and a silicon oxide film is formed between the polycrystalline semiconductor film and the aluminum oxide film.

Abstract: A lateral phase change cell may be formed over a semiconductor substrate. The lateral cell, in some embodiments, may be exposed to light so that the same cell may be addressed by both optical and electrical signals.

Abstract: A compact, improved injector-mixer for injecting and thoroughly mixing fine bubbles of air into a contaminated water stream from a fish tank is disclosed. Water is pumped down through an injection section of the present invention where air is injected into the stream by an improved Venturi construction. The mixture then flows into an improved mixing section, vertically disposed within a protein skimmer chamber, where it is thoroughly mixed such that the plethora of small air bubbles have a greater chance to bond with the contaminants of the water, the contaminants becoming buoyant as a result. Upon introduction of the mixture into the protein skimmer chamber, the bubbles of air and contaminants attached thereto rise to the top of the protein skimmer column to be contained, while the filtered and oxygenated water is returned to the tank through a base of the protein skimmer chamber.

Abstract: An anion purifier is disclosed. The purifier comprises a body, a water storage container for storing water and an oscillator for generating vapor, characterized in that the body has a front edge with a recessed space for holding the water storage container and the top section of the body is provided with a high concentration anion generating device such that after the anions blown out and mixed within the water storage container are mixed naturally with atomized vapor from the oscillator, forming into high oxygen content negative ions being blown out.

Abstract: The invention relates to a fluid distributor for a material and heat exchange column, comprising a series of adjacent parallel vertical walls (11) which define alternate gas and liquid volumes, whereby some of the vertical walls are separated by horizontal bottom walls, provided with a line of holes and at least one section of each vertical wall is provided with a line of openings (12, 12A), formed in the upper part of the vertical wall and whereby first openings (12) have a first length towards the horizontal wall and second openings (12A) have a second length towards the horizontal wall, the second length being greater than the first.

Abstract: A tool for transferring controlled amounts of fluid into and from a fluid flow circuit is disclosed herein. The tool includes a substantially closed tube having a first end, a second end, and a chamber therein; an elongate plunger having a fore end extending inside the chamber and toward the second end of the tube, an aft end extending outside the chamber and from the first end of the tube, a piston-like structure on the fore end, and a manipulable structure on the aft end; a fluid inlet duct mounted on the tube; a first coupler mounted on the fluid inlet duct for connecting the duct with the fluid flow circuit; a fluid outlet duct mounted on the second end of the tube; a second coupler mounted on the fluid outlet duct for connecting the duct with the fluid flow circuit; and a fluid transfer duct mounted on the tube.

Abstract: A carrier device used for carrying an optical disk in a manufacturing process is provided. The carrier device includes a base, a first supporting piece and a second supporting piece. The base includes a carrying area whose size is equal to that of the optical disk. The first supporting piece is protruded from the base and located at the center of the carrying area. The second supporting piece is disposed on the base and located in the carrying area. The second supporting piece is separated from the edge of the carrying area at a distance of more than or equal to one fourth of the radius of the carrying area.

Abstract: The present invention relates to a method and apparatus for forming agarose or cored agarose beads. The process involves dissolving/gelation the agarose in a suitable liquid, mixing it with a hydrophobic liquid to form an emulsion and maintaining that emulsion at a temperature equal to or greater than the gelation point of the agarose, passing it through a static mixer to create agarose droplets and solidifying the agarose droplets in a second bath of hydrophobic liquid. The beads can then be washed and used or further processed to crosslink the agarose and/ or add various functionalities on to the agarose. Another method for solidifying the agarose droplets is by using a heat exchanger to cool the stream continuously after it exits the static mixer. A similar process is used for the “cored” beads except cores, preferably in bead form, are introduced to the agarose before it enters the first hydrophobic liquid so that the agarose forms a coating on the cores.

Abstract: A gas injecting device for an injection molding machine is equipped at one side of a cylinder of the injection molding machine, and includes a pin inserted into a gas injection hole of the gas injecting device. The pin has flat sections formed around an outer lower portion of the pin to define gaps between the flat sections and an inner surface of the gas injection hole, such that a gas is injected uniformly through the gaps, thereby allowing the gas and a resin to be easily mixed while preventing the resin from flowing backwards through the gas injecting device. An amount of gas injected to a barrel of the injection molding machine is accurately controlled according to a pressure difference between a gas line and the barrel, and time data, allowing an article to be injection molded according to a kind of resin or characteristics of the article.

Abstract: A method for manufacturing foam pads includes a first step of preparing a proper amount of PVC power, DOP curing agent, light calcium carbonate, kaolin, foaming agent and pigment and pouring them into a blending device to be blended and form a liquid starchy material. Next, the liquid starchy material is conveyed into an intermediate material barrel and kept stationary for pre-foaming at normal temperature for about 8 hours and then coated on a conveyer pelt to form a starchy material layer. Subsequently, the starchy material layer is kept stationary and heated at 80-90° C. for about 3-10 minutes and then continuously heated at 185-200° C. for about 20-30 minutes to form an integral-sheeted foam pad. After cooled, the integral-sheeted foam pad is thermo-compressed and cut into various foam pad products.

Abstract: A periodically shieldable solar structure (10) comprises a cavity formed between a pair of light transmitting members (12). A foam insulation/shading system (14) is provided for periodically filling the cavity with degradable foam. The foam insulation/shading system (14) comprises a series of foam generators (28) mounted within the cavity and distributed therealong to provide multiple foam generating points therewithin. The foam generators (28) are operatively coupled to a source of pressurized air and a source of foaming solution.

Abstract: Disclosed is a closed-cell polyisocyanurate foam composition capable of high compressive strength at temperatures up to 200° C. The new composition further exhibits no loss or degradation in conventional mechanical properties—less than that which impacts the intended use. The formulation of the present invention is based on the reaction product of a isocyanate and an epoxide resin catalyzed by a mixture of a tertiary amine and a cyclic amine. Compressive strength is augmented by incorporating a large fraction of a non-reactive bulk filler into the precursor polymer gel.

Abstract: A method for making bicycle frames includes a step of preparing a seat tube and a head tube and both of which are then put in concavities of two first movable mold parts on a base board. A top tube and a down tube are prepared by carbon-fiber sheets and connected between the seat tube and the head tube. Two connection ends made by carbon-fiber sheets are connected to the seat tube. Two second movable mold parts are mounted to the first movable mold parts and air is then blown into the top tube, down tube and the two connection ends to inflate the carbon-fiber sheets to contact against inner peripheries of the concavities under high temperature and pressure to let the carbon-fiber sheets be solidified.

Abstract: A press assembly is shown having a plurality of aligned press modules having a lower platen and an oppositely-disposed upper platen, the press modules defining a channel through the press assembly. A resinous wood fiber mat is fed into the channel. The upper and lower platens are driven along synchronized circular paths of travel such that the mat is compressed between the platens and is propelled by the platens through the channel. The platens are connected to eccentric shaft drive assemblies that move the platens along the desired circular path. The action of the eccentric shafts of each module are interconnected and coordinated by gear box units, and the gear box units are interconnected by intermediate gear boxes to synchronize the press assembly. A plurality of motors drives the eccentric shafts, and the supplied power may be distributed by the gear boxes.

Abstract: A method for granulating a flexible polyolefin resin including steps of melting a flexible polyolefin resin, and melt-kneading the resin while cooling the resin to a temperature of the melting point (Tm-D) of the resin or less.

Abstract: The invention relates to the film products and methods of their preparation that demonstrate a non-self-aggregating uniform heterogeneity. Desirably the films disintegrate in water and may be formed by a controlled drying process, or other process that maintains the required uniformity of the film.

Abstract: Apparatus for the creation of a sculpture, the apparatus including a base member (2) which may resemble a human skull, the skull having integral guide means including pegs (6) protruding from the skull and holes (4) in the outer surface of the skull for receiving further pegs. The dimensions of the pegs which can be inserted into the holes can be selected with reference to a set of instructions. The prefabricated pegs and inserted pegs guide the apparatus of a modeling medium such as plasticine to create the sculpture.

Abstract: This invention relates to an object having a functional element embedded in its top surface and processes for its manufacturing. The object is in general formed by molding, stamping, lamination or a combination thereof. The functional element is includes any electrical or mechanical elements that are capable of performing a function.

Abstract: A method of thermoforming an inflatable structure of dissimilar materials includes the steps of providing a first sheet formed of a first material and a second sheet formed of a second material different than the first material, the second sheet being spaced from the first sheet, and a valve being positioned between the first and second sheets; heating the first and second sheets to a temperature above their glass transition temperature and below their melting point; bonding the first and second sheets together in a mold having an opposed pair of cavities to form an inflatable structure having a seal around a periphery thereof, the valve extending through the seal and being in fluid communication with an interior and exterior of the inflatable structure; and trimming excess material from the periphery of the inflatable structure.

Abstract: Generally speaking, a system with a metallic component and a thermoplastic component is disclosed. The metallic component may include a metallic outer surface and the thermoplastic component may be formed around the metallic outer surface to create a seal between the thermoplastic housing and the metallic component. In some embodiments, the thermoplastic component may include an inner surface and an outer surface where the inner surface is formed adjacent to an in contact with the metallic outer surface. Embodiments may also include a sealing ring positioned on the outer surface of the thermoplastic housing to provide a compressive spring force to the thermoplastic housing, where the force applied to the thermoplastic housing improves the seal between the thermoplastic component and the metallic component. In a further embodiment, the metallic component is a metallic cold plate and the thermoplastic component is a thermoplastic pump housing. Other embodiments are disclosed and claimed.

Abstract: A mold for resin-seal-molding an electronic component is constituted by a first mold and a second mold. A molding face (PL) of the molds has a substrate supply-set surface, which has a flat shape without a step. A pot block is joined with and separated from a side position of the mold perpendicular to the mold face (PL). In a state where the mold face and the pot block are joined, a molten resin material in the pot block is injected into a cavity. Further, a mold-opening is performed where the second mold is separated away from the one mold in a state where the resin-seal-molded substrate is fixed to a mold surface of the one mold. According to the present method, the overall structure of the mold for resin-seal-molding an electronic component can be simplified.

Abstract: A mold for resin-seal-molding an electronic component is constituted by a first mold and a second mold. A plurality of mold structure units are arranged as stacked, wherein a substrate supplying portion for supplying a single before-resin-seal-molding substrate having an electronic component mounted thereon is provided at a mold face (PL) of the molds. Further, a clamp mechanism for simultaneously applying clamping pressure to each of the plurality of mold structure units arranged as stacked. With this structure, the overall structure of the mold for resin-seal-molding an electronic component mounted on the substrate can be simplified. Additionally, resin flash formation on the substrate surface due to variation in the thicknesses of the substrates when resin-seal-molding the electronic component is prevented.

Abstract: A method of manufacturing waterproof, highly absorbent, and highly flexible fabric comprises drying TPU material or thermoplastic elastomer at about 50° C. to 150° C. for about predetermined hours, adding a bridge agent in the dried TPU material or thermoplastic elastomer for mixing and heating at about 60° C. to 280° C. for about 30 seconds to 5 minutes for melting, pouring the melted material into an endless shallow mold to form a continuous film, contracting a fabric material at about 50° C. to 180° C. for about 1 second to 5 minutes, placing the fabric material onto top and bottom surfaces of the film and pressing same at about 50° C. to 250° C. to form a composite fabric, cooling and shaping the composite fabric at about 5° C. to 60° C., and drawing the shaped composite fabric around a roll to produce the finished composite fabric.

Abstract: A molding assembly and related process are described that eliminate or significantly reduce cosmetic defects otherwise occurring in golf balls. The assembly includes molds with particular runner configurations, gate configurations, and venting characteristics. The assemblies and processes described herein are particularly well suited for reaction injection molding of golf balls.

Abstract: An apparatus for injection molding comprises an injection unit comprising a plunger, the plunger being translated with accumulation of plasticized material in preparation for injection and being advanced to inject the accumulated plasticized material into mold cavities. At least one electric motor is engaged with the plunger to resist translation as melt is accumulated and to inject plasticized material into the mold cavities. At least one hydraulic actuator selectably operates the plunger during a pack and hold interval to supply supplemental force when force supplied by the electric motors is limited to maintain the operation of the motors within the applicable continuous duty rating thereof. The electric motors are advantageously selectably operatively engaged with the plunger to inject plasticized material into the mold cavities and the hydraulic actuators are operated to inject plasticized material into the mold cavities when the motors are not engaged therefore.

Abstract: The objects of the present invention are to provide a magnetic field molding device capable of improving yield in a production and stabilizing product quality, and a method for producing a ferrite magnet. In molding in a magnetic field, the mortar-shaped die 19 provided with a plurality of the cavities 13 is heated by the heater member 20, provided in the heater block located under the mortar-shape die 19, under control of a controller at varying temperature depending on the position of the mortar-shape die 19, to keep uniform temperature of the slurry in the cavities 13. This assures good and stable slurry dehydration properties and improves product yield.

Abstract: A method for controlling pore size of a membrane that includes providing a porous magnetic architecture and magnetizing the porous magnetic architecture. The porous magnetic architecture changes pore size when magnetized. A method for inhibiting the mobility of a solute through a membrane includes magnetizing a porous magnetic architecture in a flow stream that includes a solute. A membrane system for a solute includes a porous magnetic architecture disposed within a flow stream that also includes a solute, and a magnetic source disposed such that the nonuniform porous magnetic architecture is selectively magnetized.

Abstract: An apparatus, method, in-line press, and cassette for conditioning a substrate for subsequent processing, the apparatus comprising: an ultrasonic energy device with an ultrasonic horn having a contact surface; a rotatable cylinder having a raised profile with a linear or curvilinear pattern, the rotatable cylinder disposed adjacent the horn, but on an opposite side from the substrate; wherein the substrate is squeezed between the contact surface of the ultrasonic horn and the pattern on the rotatable cylinder to thereby apply heat and pressure during operation of the ultrasonic energy device to create a linear or curvilinear indentation in a surface of the substrate.

Abstract: A system and method for patterning a master disk or “stamper” to be used for nanoimprinting magnetic recording disks uses an air-bearing slider that supports an aperture structure within the optical near-field of a resist layer on a rotating master disk substrate. Laser pulses directed to the input side of the aperture are output to the resist layer. The aperture structure includes a metal film reflective to the laser radiation with the aperture formed in it. The aperture has a size less than the wavelength of the incident laser radiation and is maintained by the air-bearing slider near the resist layer to within the radiation wavelength. The timing of the laser pulses is controlled to form a pattern of exposed regions in the resist layer, with this pattern ultimately resulting in the desired pattern of data islands and nondata islands in the magnetic recording disks when they are nanoimprinted by the master disk.

Abstract: Methods and systems for relaxing stresses in polymeric articles by application of laser energy are disclosed.

Abstract: A method is provided of manufacturing a bumper cover for a motor vehicle. The bumper cover includes at least one vehicle-specific deformation. The method includes the steps of injection molding a bumper cover blank using a single injection mold tool, and forming the at least one vehicle-specific deformation in the bumper cover blank to form the bumper cover.

Abstract: A platen (1) which can be quickly evacuated and used in product encapsulation and like processes is provided where the platen (1) is configured to be gaseously evacuated. The platen (1) comprises a base plate (2), at least one gas evacuation conduit (11) configured to communicate through the base plate (2), and a support plate (3) spaced apart from the base plate (2) to create a plenum chamber (9) between the base plate (2) and the support plate (3) where each gas evacuation conduit (11) is in communication with the plenum chamber (9). The platen (1) further comprises a first array of channels (14) formed in the surface of the support plate (3) remote from the plenum chamber (9) wherein a plurality of mesas (15) are defined in those areas of the support plate surface intermediate the channels and a plurality of apertures (19) located in the channels (14) and each passing through the support plate (3), the apertures (19) extending between the support plate (3) and the plenum chamber (9).

Abstract: Versatile vacuum furnace (also having high internal pressure capability) designed for facilitating directed gas flow has a treating chamber including a long, low profile work zone configuration, and powerful gas recirculation equipment with unique structure supporting gas flow patterns that facilitate high velocity gas flow into and through the chamber. The furnace can be used for single or multiple step metal treatment processes. An entire multi step process, for example, carburizing, including gas quenching, is accomplished relatively quickly in a single self-contained chamber of the furnace.

Abstract: A vibration damping device including: at least one elastic plate member adapted to be superposed against a surface of a vibrating member to be damped, and having a natural frequency tuned to a frequency band to be damped in the vibrating member; and a positioning member for positioning the elastic plate member with respect to the surface of the vibrating member.