Abstract: A stack package for a high density memory module includes at least one memory chip, an ASIC and an interposer, wherein the interposer comprises a first surface having contacts arranged in electrical communication with corresponding contacts on the ASIC and a second, substantially opposite surface including contacts arranged in electrical communication with corresponding contacts on a PCB. The at least one memory chip is dimensioned to fit within a cutout section in the interposer.

Abstract: An efficient chip stacking structure is described that includes a leadframe having two surfaces to each of which can be attached stacks of chips. A chip stack can be formed by placing a chip active surface on a back surface of another chip. Electrical connections between chips and leads on the leadframe are facilitated by bonding pads on chip active surfaces and by via that extend from the bonding pads through the chips to the back surfaces.

Abstract: A ball grid array (BGA) socket includes an insulative housing (11), a number of terminals (12) and a protecting device (114). The insulative housing includes a mating surface (111), a mounting surface (112) opposite to mating surface, a plurality of passageways (113) extending between the mating surface and the mounting surface and a plurality of electrical terminals (12) received in the passageways. Each of the terminals includes a body portion (121); a contacting portion (122) extending forwardly from the body portion and a soldering portion (123) extending downwardly from the body portion and extending beyond the mounting surface of the insulative housing. The protecting device is arranged on the mounting surface. In a perpendicular direction, a distance between a bottom surface of the protecting device and the mounting surface is longer or equal to another distance between soldering portion and the mounting surface.

Abstract: A structure provides for the control of bond wire impedance. In an example embodiment, there is an integrated circuit device comprising a semiconductor device die having a plurality of grounding pads, signal pads, and power pads and a package for mounting the integrated circuit and includes a conductive path having at least one reference trace that surrounds the integrated circuit. A grounding arch is disposed over the semiconductor device die.

Abstract: A semiconductor device is disclosed that includes a semiconductor element, a circuit board electrically connected to the semiconductor element, a heat dissipation member fixed to the first surface of the circuit board and thermally coupled to the semiconductor element, and an interposer provided to the second surface of the circuit board facing away from the heat dissipation member. The interposer is electrically connected to the circuit board. An opening is formed in the circuit board and the interposer so that the semiconductor element is thermally coupled directly to the heat dissipation member through the opening.

Abstract: In accordance with the present invention, during formation of the interconnection board, the interconnection board remains securely fixed to a high rigidity plate being higher in rigidity than the interconnection board for suppressing the interconnection board from being bent.

Abstract: In a process of making a container barrier upon a heat spreader, the heat spreader is augmented with a cold-formed o-ring, and thereafter, it is bonded to a die. A liquid solder is filled into the space created by the o-ring. The thermal interface material can also have one of several footprints to facilitate heat transfer.

Abstract: The present disclosure describes microfeature workpieces, microelectronic component packages, and methods of forming microelectronic components and microelectronic component packages. In one particular example, a microelectronic component package includes a substrate and a microelectronic component that has a first surface with a surface area greater than that of a second surface. A cementitious material, e.g., a die attach paste, may attach the second surface of the microelectronic component to a mounting surface of the substrate, with the cementitious material extending outwardly beyond a perimeter of the second surface and covering a surface area of the mounting surface that is no greater than the surface area of the first surface. Such a microelectronic component package may be formed with a smaller footprint or, alternatively, may include a microelectronic component having larger dimensions in a microelectronic component package of the same size.

Abstract: The present invention provides an electronic device comprising a base substrate to be surface-mounted on a circuit board, one or more electronic component elements mounted on a surface of the base substrate and/or therein, an external electrode provided on an end portion of the base substrate and in the form of a post perpendicular to a rear surface of the base substrate for connecting the one or more electronic component elements to the circuit board. Furthermore, the base substrate is provided on its end portion with a slope crossing a side surface and a rear surface of the base substrate. A surface of the external electrode is exposed on the slope.

Abstract: Methods for packaging microelectronic devices, microelectronic workpieces having packaged dies, and microelectronic devices. One aspect of the invention is directed toward a microelectronic workpiece comprising a substrate having a device side and a backside. In one embodiment, the microelectronic workpiece further includes a plurality of dies formed on the device side of the substrate, a dielectric layer over the dies, and a plurality of bond-pads on the dielectric layer. The dies have integrated circuitry and a plurality of bond-pads electrically coupled to the integrated circuitry. The ball-pads are arranged in ball-pad arrays over corresponding dies on the substrate. The ball-pads of one array, for example, are electrically coupled to the bond-pads of the corresponding die. The microelectronic workpiece of this embodiment further includes a protective film over the dielectric layer.

Abstract: Crystal growth performed in situ facilitates interconnection of prefabricated nano-structures. The nano-structures are immersed in a growth solution having a controllable saturation condition. Changing the saturation condition of the solution modifies a size of the immersed nanowires. The solution includes a solute of a nano-structure precursor material. The saturation condition is changed to one or both etch material from a surface of the nano-structures and initiate crystal growth on the nano-structure surface. A nano-structure interconnection system includes the growth solution and equipment to deposit the prefabricated nano-structures on a substrate. An interconnected structure includes a plurality of nano-structures disposed on a substrate in a cluster and a liquid phase-grown crystal lattice on surfaces of the nano-structures to form physical interconnections between the plurality. An ink formulation includes the plurality of nano-structures suspended in the growth solution.

Abstract: In a semiconductor device, rewirings 3 for connecting a semiconductor chip 1a, a semiconductor chip 1b and external connecting terminals 4 with each other are formed on the semiconductor chip 1a. An insulating resin 6 having opening portions in regions for forming the external connecting terminals 4 at peripheral portion of the semiconductor chip 1a and another opening portions in another region for mounting the semiconductor chip 1b at the central of the semiconductor chip 1a is overlaid on the rewirings 3. The external connecting terminals 4 consisting of BGA are formed in the opening portions of the regions for forming the external connecting terminals 4 through lands 5. The semiconductor chip 1b is connected to another opening portions of another region for mounting the semiconductor chip 1b by flip-chip structure through electrodes 11 and bumps 8. A junction surface of the bumps 8 is sealed by a sealing resin 7.

Abstract: A multi-chip stack package mainly includes a substrate, a first chip, a redistribution structure and at least one second chip. The first chip is disposed on the substrate with an active surface facing upwards. The redistribution structure includes a plurality of first intermediate pads, a plurality of second intermediate pads and a plurality of external pads. The first intermediate pads, the second intermediate pads, and the external pads are formed on the first active surface of the first chip, wherein the first intermediate pads and the second intermediate pads are electrically connected with each other. The second chip is disposed on the redistribution structure, and electrically connected to the first intermediate pads. The second intermediate pads are electrically connected to the substrate through a plurality of bonding wires, so that the second chip and the substrate are electrically conducted, and the connection length of the bonding wires is reduced.

Abstract: An electronic structure includes an electronic device coupled to a substrate by conductive bumps and ball limiting metallurgy (BLM). Underfill material having filler particles is disposed in a space between the electronic device and the substrate. A weight percentage of the filler particles is at least about 60%. A particle size of at least 90 wt % of the filler particles is less than about 2 ?m and/or the filler particles are coated by an organic coupling agent. Once the underfill material is fully cured, its coefficient of thermal expansion is no more than 30 PPM/° C., and its glass transition temperature is at least 100° C., and its adhesion to a passivation layer of the electronic device, to the substrate and to the electronic device at its edges is such that the electronic structure passes standardized reliability tests without delamination of the ball limiting metallurgy.

Abstract: A semiconductor device includes: a semiconductor substrate in which an integrated circuit is formed; an interconnect layer which includes a linear section and a land section connected with the linear section; and an underlayer disposed under the interconnect layer, and the land section includes a first section which is in contact with the underlayer, and a second section which is not in contact with the underlayer.

Abstract: A breathing system includes a container to store a gas under pressure, wherein the gas includes air or oxygen. The container includes an outlet through which the gas exits the container. The breathing system further includes a generator system including a generator in operative connection with the container outlet such that energy is supplied to the generator by the pressurized gas. The generator converts the energy supplied by the pressurized gas to electrical energy. The system further includes a fluid path in connection with the generator through which pressurized gas passes after providing energy to the generator and a respiration facepiece in fluid connection with the fluid path.

Abstract: The present invention relates to a start-stop “mild hybrid” vehicle with a starting system which utilizes traditional engine and transmission architecture. The present invention separates the pinion actuator solenoid from the starter motor power switching circuit. A power relay is provided to switch the starter motor. The pinion gear in the present invention is pre-shuttled to, and held in mesh with, the flywheel ring gear during engine stop conditions. A “prime current” is then applied to the power relay just below that which is required to energize the power relay. Upon request for an engine start, the current will increase to energize the relay and allow the starter motor to spin. A significant amount of time lag is thusly removed from the starting system permitting an expedient restart and launch. The pinion actuator solenoid in this invention may also have two coils which may be selectively energized.

Abstract: A diffuser-augmented wind-turbine assembly in which the diffuser has a cylindrical central section rotatably supporting a rotor drum which in turn supports turbine blades without requiring a central support shaft. Wind energy drives the turbine blades and rotor drum, which in turn drive a generator of electrical power.

Abstract: An emergency pitch drive power supply is provided, the emergency pitch drive power supply comprising an auxiliary generator for producing electric power, wherein the auxiliary generator is a permanently excited multi-pole generator adapted to generate sufficient power for a pitch drive of a wind turbine when driven with wind rotor speed, and wherein the auxiliary generator is connected to at least one pitch drive motor of the wind turbine.

Abstract: A wind powered electrical generation assembly having a portable wind powered generator tower for supporting a wind powered generator allowing the wind powered generator to be raised, lowered, and removed from the tower. The wind powered electrical generation assembly also includes a vertical elevator on the tower configured to vertically lift the wind powered generator with a carriage to position the wind powered generator at a top of the tower. The wind powered electrical generation assembly further includes a wind powered generator is having at least spars and at least six airfoils with mating cams to rotate the airfoils relative to the spars as the airfoils move along the spars towards an end of the spars as wind passes the airfoils.

Abstract: Systems and methods of the present invention are directed to wind energy. Wind rotors (1) drive at least two generators (2) which each have a corresponding rectifier unit (3). The rectifier unit (3) being an active rectifier having drivable power semiconductor components. An energy storage circuit (4) is associated with each rectifier unit (3) and is connected in parallel to a first busbar system (7). Each energy storage circuit (4) having at least one DC voltage capacitance, and the first busbar system (7) having a first protection switch (5) in at least one connection.

Abstract: To the end of providing a constant AC voltage to a variable load (1) which is arranged remote of a voltage source (3), a voltage drop over an electrical supply line (2) which connects the load to the voltage source (3) is compensated for by a compensation AC voltage which, if added to the constant AC voltage, results into the output AC voltage Ufull of the voltage source (3) and the value of which is varied depending on the absolute value of the alternating current (I) conducted to the load (1) and on the phase angle phi between the output AC voltage Ufull of the voltage source (3) and the alternating current (I).

Abstract: A device for generating an intense radio frequency pulse through use of a helical Magneto-Cumulative Generator (MCG). The MCG provides a chemical explosion and acts as a converter to transform the chemical/mechanical energy into an electrical energy impulse. Due to the detonation/combustion process, a vortex wake is produced which assumes the role of a quarter-wave trap/antenna. If the MCG is in high velocity flight, a bow-shaped shockwave, followed by a second shock front, is established around the head of the MCG, becoming a second antenna. Without flight, two MCG's are placed head-to-head so that the vortex wakes emit in opposite directions. Since the explosion destroys the MCG, a model is created to perform multiple tests of the ability of an MCG to act as an RF device.

Abstract: A system and method are disclosed for controlling an integrated rotary-linear actuator system that may be coupled to a network via a network interface. The integrated rotary-linear actuator system includes a control system and a rotary-linear actuator having a moveable plunger and associated coils. The coils may be energized to interact with associated magnets to effect corresponding movement of the plunger, which may include rotation and/or linear movement. The network interface facilitates receipt of control information at the control system of the integrated rotary-linear actuator system from the network. The control system may control an amplifier to energize the coils based on the control information.

Abstract: An actuator includes a casing, a stationary member having a coil member and mounted in the casing and a movable member having a moving element and supported by the casing. The moving element has a shaft and is supported by the casing so as to be moved in an axial direction of the shaft and in a rotational direction having the axial direction of the shaft as its rotational axis and the moving element is moved in the axial direction and in the rotational direction by causing electric current to flow through the coil member. The stationary member includes a first stationary member for imparting to the movable member a force oriented in the axial direction and a second stationary member for imparting to the movable member a force oriented in the rotational direction, while the coil member includes a first coil member for exciting a first magnetic path passing through the first stationary member and a second coil member for exciting a second magnetic path passing through the second stationary member.

Abstract: A linear reluctance motor including a stator with a set of spaced blades each extending in the direction of the actuation axis, each blade including a plurality of alternating low permeability and high permeability teeth. A shuttle also includes a set of spaced blades each extending in the direction of the actuation axis interleaved with the blades of the stator, each blade of the shuttle also including a plurality of alternating low permeability and high permeability teeth. An active component is associated with either the stator, the shuttle, or both. The active component is divided into at least N phases, each phase including a set of blades, a flux return portion, and a coil wound to produce flux through the sets of interleaved blades in a direction substantially transverse to the actuation axis.

Abstract: Outflow of heat generated by a linear motor to the outside is suppressed. A linear motor according to the present invention is a linear motor used in a vacuum atmosphere, including a stator, a movable element movable relative to the stator, and a metal film formed on the surface of at least one of the stator and the movable element. This decreases the emissivity and reduces the outflow of heat by radiation from the linear motor.

Abstract: An induction motor comprises a stator (10) and a rotor (20), which includes material essentially blocking magnetic flux at high frequencies. A difference in number of stator slots and rotor slots is chosen so that the inductance of a winding provided in a stator slot is different from the inductance of a winding provided in another stator slot. A sense means, such as stator winding or separate sense winding, is provided in at least one of the stator slots and the sense means is arranged to allow measuring of the inductance thereof. The sense means constitutes an integrated sensor, which is both inexpensive and reliable. A method of sensing the rotor position and/or speed of an induction motor is also described.

Abstract: A linear actuator for displacing a member or a set of movable members, having an electric stepping motor (7) with a rotor having a portion in the form of a nut (9), and a linear-movement screw (12) engaging the nut portion of the rotor. The screw has a coupling portion (19) disposed at an extremity and intended to engage a coupling portion (5) of the movable member to be displaced.

Abstract: The spindle motor includes a rotational shaft 30 which has a conical portion 34, whose outer surface gradually widens toward a thrust dynamic pressure bearing 70, and a straight portion 33 with a fixed outer diameter. Radial dynamic pressure bearing 60 supports the radial load of the rotating shaft 30. The radial bearing has a conical bearing surface 64 and a straight bearing surface 63 corresponding to the conical portion 34 and the straight portion 33 of the rotating shaft 30, respectively. Rotating shaft 30 is supported and aligned during rotation by fluid dynamic forces generated by the conical portion 34.

Abstract: A rotational magnetic electrical generating device produces an alternating electrical current generated by a central rotational magnetic cylinder with an inner cavity having an central fixed coil operated by a DC current providing a driving rotational force upon a plurality of embedded neodymium magnets within the inner cavity of the central rotational magnetic cylinder, the central rotational magnetic cylinder having an upper outer margin with an upper magnetic ring and a lower outer margin having a lower magnetic ring, the two magnetic rings suspending the central rotational magnetic cylinder between two fixed magnetic fields supported by a frame member, the central rotational magnetic cylinder further having an outer perimeter surface embedded with a plurality of neodymium alloy magnets equally sized and spaced apart, a lower surface embedded with a plurality of neodymium alloy magnets equally sized and spaced apart, and an upper surface embedded with a plurality of neodymium alloy magnets equally sized an

Abstract: The objective of this invention is to provide a motor which can reduce occurrence of a torque reduction in the overload, and also lower the temperature of a motor main body immediately even in the case of a temperature rise in the motor main body.

Abstract: A DC motor includes a rotor which is mounted in a housing so that it can rotate about an axis. The rotor includes at least one winding to which direct current is applied from the outside in alternating directions via a commutator, which is arranged on the rotor. Brushes are seated on the commutator and are mounted whereupon they can move relative to the commutator while being pushed by spring pressure onto the commutator.

Abstract: A brush holder assembly that cannot be assembled incorrectly includes a brush inserted into a brush holder, a block attached to the top of the brush, a spring engaging the block that applies radial pressure to the block and brush, and a hook pin that holds the spring onto the block. The block includes a semicircular indentation that cradles a coiled portion of the spring and includes a slotted hole for receiving a portion of the hook pin as the block is glued to the top of the brush. The hook pin is a loop terminating at a first end that is a straight pin and terminating at a second end that is a hook-shaped loop in which the straight pin end is inserted. Alternatively, a U-shaped spool assembly can be used to engage the coiled portion of the spring to lock it in the indentation in the block.

Abstract: An integrated circuit (42) provides drive signals to a piezo element (48) of a milli-actuator device (20) in a mass data storage device (10). The integrated circuit (42) includes a circuit (61) for selectively operating the integrated circuit (42) in either a voltage or a charge mode of operation. A first amplifier circuit (44) can be compensated for a variable number of piezo elements in the charge mode of operation by adjustable output impedance adjusting elements (124, 126, 138-141) that are switchably connectable into the amplifier circuit (44).

Abstract: An oscillating apparatus includes a driver generating a waveform signal based on a stored data for specifying a waveform so as to output the waveform signal to a transducer. A detector detects a phase difference between electric voltage and current supplied to the transducer. A memory unit holds gain data reflecting a characteristic of the transducer. The gain data specify gains corresponding to respective phase differences. An arithmetic unit calculates the frequency of the waveform based on the phase difference detected at the detector and a gain included in the gain data. The oscillating apparatus enables determination of a gain suitable to the transducer in view of the characteristic of the transducer. The frequency of the waveform signal is allowed to follow the change in the resonant frequency in a shorter period. The oscillation can thus be kept well.

Abstract: The invention relates to a method for operating a piezoelectric motor having a stator in the form of a hollow-cylindrical oscillator, the at least one front side of which has frictional contact with a rotor and which comprises standing wave generators. According to the invention the hollow cylinder is set into a coupled tangential-axial oscillation mode so that the cylinder mainly has tangential and axial oscillatory components. The oscillatory speed maximums of the tangential components are formed on the front sides of the hollow cylinder and those of the axial components directly underneath thereof, wherein the components decrease towards the center of the cylinder height and, in the center of the cylinder height, substantially parallel to the front sides, a nodal line is formed on which the axial oscillatory component adopts the value zero and the tangential components adopt a minimum.

Abstract: A micro position-control system capable of more precisely controlling three degree-of-freedom motions, namely, a Z-direction motion and X-axis and Y-axis rotations. The micro position-control system includes a base including a plurality of base units disposed at equal angles from the center of a motion stage, holding piezo actuators parallel to a direction of the disposition of the base units, a plurality of bridge units disposed to face the base units, converting a displacement in a length direction of the piezo actuators into a displacement that is vertical with respect to a bottom surface of the base, the motion stage making at least one of a translation motion in the vertical direction, a rotation about a first axis perpendicular to the vertical direction, and a rotation about a second axis perpendicular to both the vertical direction and the first axis, and a control unit controlling the piezo actuators.

Abstract: An acoustic driver assembly for use with any of a variety of cavitation chamber configurations, including spherical and cylindrical chambers as well as chambers that include at least one flat coupling surface. The acoustic driver assembly includes at least one transducer, a head mass and a tail mass. The end surface of the head mass is shaped to limit the contact area between the head mass of the driver assembly and the cavitation chamber to which the driver is attached, the contact area being limited to a centrally located contact region. The area of contact is controlled by limiting its size and/or shaping its surface.

Abstract: An acoustic driver assembly for use with any of a variety of cavitation chamber configurations, including spherical and cylindrical chambers as well as chambers that include at least one flat coupling surface. The acoustic driver assembly includes at least one transducer, a head mass and a tail mass. The end surface of the head mass is shaped to limit the contact area between the head mass of the driver assembly and the cavitation chamber to which the driver is attached, the contact area being limited to a centrally located contact region. The area of contact is controlled by limiting its size and/or shaping its surface.

Abstract: A micro-positioning device adapted for displacement in a direction of travel. The device has a frame, an actuator attached to the frame, and a hydraulic booster attached to the frame and operably connected to the actuator. The actuator is adapted for activation and de-activation in sequence to achieve a displacement in the direction of travel. The hydraulic booster is adapted for amplifying or de-amplifying displacement in the direction of travel. The hydraulic booster converts mechanical energy into hydraulic energy and converts hydraulic energy into mechanical energy to modify the displacement.

Abstract: The invention provides a piezoelectric oscillator that allows for fine adjustment of the frequency after resin molding, a manufacturing method therefor, and a mobile phone and an electronic apparatus using the piezoelectric oscillator. The piezoelectric oscillator can include a resonator package, in which a piezoelectric resonator element is housed, and a semiconductor device, in which an oscillation circuit that is electrically connected to the resonator package is incorporated. The resonator package and the semiconductor device can be fixed to corresponding different surfaces of an island portion of a lead frame, and resin molding is performed so that a transparent lid of the resonator package is exposed to the outside.

Abstract: A method is described for improving the long-term stability of a piezoelectric actuator encased in a potting compound containing or forming hydrogen atoms. Oxygen is contained in the piezoelectric actuator's piezoelectric ceramic. Appropriate means are employed so that unsaturated bonds of the hydrogen in the potting compound will release less oxygen from the piezoelectric ceramic. One means consists in reducing the concentration of hydrogen in the potting compound, with appropriate thermal processes as a result of which the concentration of hydrogen will be reduced to below a predefined threshold being applied after the piezoelectric actuator has been encased in the potting compound. Means that form bonds with the hydrogen in the potting compound or duct oxygen thereto are provided in further embodiments.

Abstract: A surface acoustic wave element includes: metal patterns that include interdigital transducers, each of the metal patterns being formed with a first alloy or multi-layer film of metals having different standard electrode potentials; and metal films each formed with a second alloy or multi-layer film containing metals having different standard electrode potentials from the standard electrode potentials of the metals forming the first alloy or multi-layer film, the metal films being formed at least on a part of the regions other than the regions corresponding to the electrode fingers of the interdigital transducers of all the metal patterns that are electrically independent of one another.

Abstract: A surface acoustic wave device includes a piezoelectric substrate and interdigital electrodes disposed on the piezoelectric substrate, wherein each of the interdigital electrodes includes a main electrode layer made of Cu or an alloy that has Cu as its main component. The surface acoustic wave device also includes a tightly adhering layer which is disposed between the main electrode layer and the piezoelectric substrate and whose main component is NiCr, or a tightly adhering layer whose main component is Ti and whose film thickness is within a range of about 18 nm to about 60 nm.

Abstract: A handheld stylus having an elongated housing, a writing and drawing implement disposed within the housing and including a tip extending through an opening at an end of the housing where ultrasonic waves radiate therefrom and are used for determining a position of the stylus; and at least one ultrasonic transducer disposed within the housing. The transducer may be a cylindrical piezoelectric transducer having a holder and a cylindrical piezoelectric film spanning between at least two spaced apart cylindrical surfaces of the holder, or a flat transducer having a diaphragm, and a piezoelectric material disposed on a surface of the diaphragm.

Abstract: A light emitting device has a plurality of conductive members with good heat conductivity provided in a base member, the conductive members are isolated by insulating members provided between the conductive members. A light emitting element device is mounted on the base member. An light emitting diode is provided in the light emitting device and mounted on conductive member. A projection is outwardly projected from the heat conductive member for cooling the LED.

Abstract: Provided is a plasma display panel (PDP) including a rear substrate and a front substrate, which are spaced a predetermined distance apart from each other to face each other and between which a plurality of discharge cells are formed. A heating portion is disposed in the rear of the rear substrate to heat the rear substrate and the front substrate.

Abstract: Disclosed is a plasma display panel. The plasma display panel comprises a lower substrate and an upper substrate, which are spaced apart by a predetermined distance from each other to define a plurality of discharge cells therebetween; a plurality of barrier ribs disposed between the lower substrate and the upper substrate; a plurality of address electrodes formed in parallel with one another on an upper surface of the lower substrate; a plurality of discharge electrodes formed in a direction crossing the address electrodes on a lower surface of the upper substrate; and a fluorescent layer formed on an inner wall of the discharge cells, wherein the upper substrate comprises a plurality of light guides, which are formed in parallel with the plurality of address electrodes to focus and output visible light generated from the discharge cells by a discharge, the light guides having a light incident surface.

Abstract: Disclosed is a front filter attached to a front surface of a plasma display panel, the front filter comprising: an antireflection coating for preventing reflection of incident light from outside; an optical characteristic film for improving optical characteristics of incident light from the panel, by decreasing brightnesses of red (R) and green (G) rays and by increasing brightness of blue (B) rays; an EMI shielding film for shielding emission of electromagnetic wave; and an NIR blocking film for blocking near infrared rays emitted from the panel, wherein, transmittance of emitted light from the plasma display panel when the emitted light transmits the antireflection coating, the optical characteristic film, the EMI shielding film, and the NIR blocking film is determined in dependence of wavelength of the emitted light, and wherein transmittance of B rays at a wavelength of 454 nm is 50–80%, transmittance of G rays at a wavelength of 525 nm is 40–80%, transmittance of orange rays at a wavelength of 580–592 nm