Abstract: A back-surface-electrode type semiconductor laser of GaN-based compound has low electric resistance and high light emitting efficiency, and includes negative electrodes made of Al having a contact surface that contacts with the n-type GaN substrate. The back-surface-electrode type semiconductor laser has GaN-based compound layers laminated on an n-type GaN substrate with an area of reversal of polarity with low electric resistance and a negative electrode is disposed on the side opposite to the side of GaN-based compound layer of the GaN substrate so as to come in contact with the area of reversal of polarity.

Abstract: A light emitting device includes: a light emitting element; and a substantially rectangular package body in which the light emitting element is contained and a concave portion is formed. The concave portion has a bottom surface on which the light emitting element is disposed, and is filled with a transparent sealing resin for covering the light emitting element. Further, the sealing resin has a surface serving as an emitting surface, from which light is extracted. The package body includes: a reflection surface being an inclined plane provided along a short side of a depressed region toward the emitting surface, when seen from above the emitting surface; and a die bonding region and a wire bonding region on a bottom surface of the depressed region. Further, the depressed region has a depth being substantially equal to or less than a height of the active layer of the light emitting element.

Abstract: An LED is disclosed which comprises a nitride-made main semiconductor region formed on a substrate for generating light, and an electrode formed on the main semiconductor region to a thickness sufficiently small to transmit the light from the main semiconductor region. The electrode is made from a silver-base alloy, rather than from silver only, that contains an additive or additives selected to protect the electrode against oxidation and/or sulfurization and to enhance the chemical stability of the electrode without loss in contact ohmicity.

Abstract: Briefly, the present invention provides an electronic device, typically a transistor or a capacitor, comprising at least one electrically conductive electrode and, adjacent to the electrode, a dielectric layer; wherein the dielectric layer comprises a polymeric matrix and, dispersed in the polymeric matrix, metal oxide particles; wherein the metal oxide particles have organic functional groups covalently bound to their surface, and wherein the organic functional groups are not covalently bound to the polymeric matrix. In another aspect, the present invention provides a printable dispersion, typically a jet-printable dispersion, comprising: a) a curable composition and b) metal oxide particles; wherein the metal oxide particles have organic functional groups covalently bound to their surface, and wherein the organic functional groups are not covalently bound to any part of the curable composition.

Abstract: Programmable power management using a nanotube structure is disclosed. In one embodiment, a method includes coupling a nanotube structure of an integrated circuit to a conductive surface when a command is processed, and enabling a group of transistors of the integrated circuit based on the coupling the nanotube structure to the conductive surface. A current may be applied to the nanotube structure to couple the nanotube structure to the conductive surface. The nanotube structure may be formed from a material chosen from one or more of a polymer, carbon, and a composite material. The group of transistors may be enabled during an activation sequence of the integrated circuit. In addition, one or more transistors of the group of transistors may be disengaged from the one or more power sources (e.g., to minimize leakage) when the nanotube structure is decoupled from the conductive surface.

Abstract: A gallium nitride heterojunction bipolar transistor with a p-type strained InGaN base layer is provided. The gallium nitride heterojunction bipolar transistor includes a substrate, a highly doped collector contact layer located over the substrate, a low doped collector layer located over the collector contact layer, a p-type base layer located over the collector layer, a highly doped strained InGaN base layer located over the p-type base layer, a emitter layer located over the p-type strained InGaN base layer, a highly doped emitter contact layer located over the emitter layer, and an emitter metal electrode, a base metal electrode, and a collector metal electrode respectively located on the emitter contact layer, the p-type strained InGaN base layer, and the collector contact layer.

Abstract: A light-emitting device includes: a substrate; a plurality of light-emitting elements which is formed on the substrate and each of which has an anode partitioned by an insulating pixel partition wall, a cathode, and an organic light-emitting layer interposed therebetween and emits light by an electric field generated by the anode and the cathode; a first organic buffer layer that is formed by applying an organic compound and hardening the organic compound and covers a region larger than the region in which the plurality of light-emitting elements are formed; a second organic buffer layer that is that is formed by applying an organic compound and hardening the organic compound and is arranged above the substrate with the first organic buffer layer interposed therebetween so as to cover the plurality of light-emitting elements; and a gas barrier layer that is formed of an inorganic compound, covers a region larger than the region in which the first and second organic buffer layers are formed, and protects the p

Abstract: A radiation emitting electronic device (1) comprising a substrate (5), a radiation emitting functional area (10A, 10B, 15) on the substrate (5) and a radiation out-coupling material (20) comprising polysilsesquioxane (20D) and inorganic nanoparticles (20C) arranged in the optical path (100) of the radiation emitting functional area (10A, 10B, 15). Such a device has a higher luminance due to an increased fraction of out-coupled radiation in comparison to a device having no radiation out-coupling material.

Abstract: A light-emitting device includes: a plurality of light-emitting elements each of which has an anode, a thin organic light-emitting layer, and a cathode sequentially stacked on a substrate and emits light by excitation due to an electric field, the anode being separated from another anode by an insulating pixel partition wall; an organic buffer layer that is formed of an organic compound, covers an area larger than a region where the plurality of light-emitting elements are formed, has a step difference smaller than that of an upper surface of the cathode on the substrate, and is approximately flat; and first and second gas barrier layers that are formed of an inorganic compound, are disposed on an outer surface of the organic buffer layer, and protect the plurality of light-emitting elements against air.

Abstract: An organic light-emitting diode display which can display independent images on both sides is described. This display can be driven with passive matrix or active matrix schemes. The invention combines a unique stacked organic diode structure and special driving schemes involving time-sequential reversed fields.

Abstract: In an EL element including a light emitting layer sandwiched between upper and lower electrodes, of light emitted therefrom, light totally reflected at a light emitting layer interface is not taken out, so there is a problem in that light emission efficiency reduces. Therefore, a light scattering layer in which metal particles are dispersed is provided between an electrode and the light emitting layer. According to such a structure, the light from the light emitting layer can be scattered by the metal particles and taken out, thereby improving the light emission efficiency. When plasmon is excited in the metal particles, light confined in the light emitting layer or each layer adjacent thereto can be used, thereby improving light use efficiency.

Abstract: According to an embodiment of the present invention, a manufacturing method of a display device includes forming a plurality of gate wires comprising a gate electrode on an insulating substrate, forming an electrode layer comprising a source electrode and a drain electrode spaced apart from each other to define a channel region on the gate electrode interposed therebetween, forming a first barrier wall having a first opening for exposing the channel region, a portion of the source electrode, and a portion of the drain electrode on the electrode layer where the first barrier wall has a surface, forming a shielding film to cover the channel region inside the first opening, treating the surface of the first barrier wall, removing the shielding film, and forming an organic semiconductor layer inside the first opening.

Abstract: Embodiments of a display device comprises an insulating substrate; a source electrode and a drain electrode on the insulating substrate and separated from one another to define a channel region; a wall having one or more openings to expose the channel region, at least a portion of the source electrode, and at least a portion of the drain electrode; and an organic semiconductor layer formed in the one or more openings, the one or more openings comprising a channel part exposing the channel region and an ink guide part extending outward from the channel part. The ink-jet printing process for the display device has an improved processing margin.

Abstract: Light-emitting devices capable of preventing separation or alteration of a first electrode to obtain high performance, methods of manufacturing the light-emitting device, and display units are provided. A first electrode as an anode, an insulating film, an organic layer including a light-emitting layer, and a second electrode as a cathode are laminated in this order on a substrate with a planarizing layer as a base layer in between. The first electrode has a structure in which an adhesive layer, a reflective layer and a barrier layer is laminated in this order from the substrate. Alteration of the reflective layer can be prevented by the barrier layer, and the reflective layer can be prevented from being separated from the planarizing layer by the adhesive layer. The first electrode is formed through forming the adhesive layer, the reflective layer and the barrier layer on the planarizing layer, and then patterning them in order from the barrier layer.

Abstract: In the present invention, a light-emitting element operating at low driving voltage, consuming low power, emitting light with good color purity and manufactured in high yields can be obtained. A light-emitting element is disclosed with a configuration composed of a fist layer containing a light-emitting material, a second layer, a third layer are formed sequentially over an anode to be interposed between the anode and a cathode in such a way that the third layer is formed to be in contact with the cathode. The second layer is made from n-type semiconductor, a mixture including that, or a mixture of an organic compound having a carrier transporting property and a material having a high electron donor property. The third layer is made from p-type semiconductor, a mixture including that, or a mixture of an organic compound having a carrier transporting property and a material having a high electron acceptor property.

Abstract: A rectifying contact to an n-type oxide material and/or a substantially insulating oxide material includes a p-type oxide material. The p-type oxide material includes a copper species and a metal species, each of which are present in an amount ranging from about 10 atomic % to about 90 atomic % of total metal in the p-type oxide material. The metal species is selected from tin, zinc, and combinations thereof.

Abstract: Test circuits located on semiconductor die enable a tester to test a plurality of die/ICs in parallel by inputting both stimulus and response patterns to the plurality of die/ICs. The response patterns from the tester are input to the test circuits along with the output response of the die/IC to be compared. Also disclosed is the use of a response signal encoding scheme whereby the tester transmits response test commands to the test circuits, using a single signal per test circuit, to perform: (1) a compare die/IC output against an expected logic high, (2) a compare die/IC output against an expected logic low, and (3) a mask compare operation. The use of the signal encoding scheme allows functional testing of die and ICs since all response test commands (i.e. 1-3 above) required at each die/IC output can be transmitted to each die/IC output using only a single tester signal connection per die/IC output. In addition to functional testing, scan testing of die and ICs is also possible.

Abstract: In view of the problem that a reduced thickness of an EL film causes a short circuit between an anode and a cathode and malfunction of a transistor, the invention provides a display device that has a light emitting element including an electrode and an electroluminescent layer, a wire electrically connected to the electrode of the light emitting element, a transistor provided with an active layer including a source, a drain and a channel forming region, and a power supply line electrically connected to one of the source and the drain of the transistor, wherein the wire is electrically connected to the other of the source and the drain of the transistor, and the width of a part of the electrode in the vicinity of a portion where the electrode is electrically connected to the wire is smaller than that of the electrode in the other portion.

Abstract: A wire for a liquid crystal display has a dual-layered structure comprising a first layer made of molybdenum or molybdenum alloy, and a second layer made of molybdenum nitride or molybdenum alloy nitride. To manufacture the wire, a layer made of either a molybdenum or a molybdenum alloy, and another layer one of either a molybdenum nitride or molybdenum alloy nitride by using reactive sputtering method are deposited in sequence, and then patterned simultaneously. The target for reactive sputtering is made of either molybdenum or molybdenum alloy, and the molybdenum alloy comprises one selected from the group consisting of tungsten, chromium, zirconium, and nickel of the content ratio of 0.1 to less than 20 atm % of. The reactive gas mixture for reactive sputtering includes an argon gas and inflow amount of the nitrogen gas is at least 50% of argon gas, to minimize the etch rate of the molybdenum nitride layer or the molybdenum alloy nitride layer for ITO etchant.

Abstract: To provide a semiconductor display device capable of displaying an image having clarity and a desired color, even when the speed of deterioration of an EL layer is influenced by its environment. Display pixels and sensor pixels of an EL display each have an EL element, and the sensor pixels each have a diode. The luminance of the EL elements of each in the display pixels is controlled in accordance with the amount of electric current flowing in each of the diodes.

Abstract: A thin film transistor (TFT) is provided. The thin film transistor (TFT) comprises a substrate, a gate, an inter-gate dielectric layer, a channel layer and source/drain regions. A gate is formed over the substrate. An inter-gate dielectric layer is formed over the substrate covering the gate. A doped amorphous silicon layer is formed over a portion of the inter-gate dielectric layer at least covering the gate to serve as channel layer. Source/drain regions are formed over the channel layer.

Abstract: A polycrystalline silicon thin film to be used in display devices, the thin film having adjacent primary grain boundaries that are not parallel to each other, wherein an area surrounded by the primary grain boundaries is larger than 1 ?m2, a fabrication method of the polycrystalline silicon thin film, and a thin film transistor fabricated using the method.

Abstract: A thin film transistor includes a channel layer of a specific shape, a thermal gradient inducer body, a gate insulating film, a gate electrode and an interlayer insulating film, a source electrode and a drain electrode. The channel layer is formed on a substrate. The channel layer has a nucleation region and a crystal end. The thermal gradient inducer body partially circumscribes the channel layer. The gate insulating film is formed on the substrate, and the channel layer is at least partially covered with the gate insulating film. The gate electrode is formed on the gate insulating film. The interlayer insulating film is formed on the gate insulating film, and the gate electrode is at least partially covered with the interlayer insulating film. The source electrode and the drain electrode are formed on the interlayer insulating film, passed through the gate insulating film and the interlayer insulating film, and electrically connected to the channel layer.

Abstract: A front substrate for a plasma display panel (PDP) and an associated fabrication method are provided. An upper dielectric layer of the front substrate includes a colorant, which causes the dielectric layer to also act as a color filter. The resulting front substrate enhances at least one of color temperature, color purity, and/or contrast without increasing complexity or cost.

Abstract: A semiconductor device that uses a high reliability TFT structure is provided. The gate electrode of an n-channel type TFT is formed by a first gate electrode and a second gate electrode that covers the first gate electrode. LDD regions have portions that overlap the second gate electrode through a gate insulating film, and portions that do not overlap. As a result, the TFT can be prevented from degradation in an ON state, and it is possible to reduce the leak current in an OFF state.

Abstract: An inventive semiconductor device for emitting light when applying a voltage comprises: a first semiconductor region (3) whose conductivity is based on charge carriers of a first type of conductivity, e.g. electrons; a second semiconductor region (5) whose conductivity is based on charge carriers of a second type of conductivity, e.g. holes, which have a charge opposite that of the charge carriers of the first type of conductivity and; an active semiconductor region (7A 7C), which is situated between the first semiconductor region (3) and the second semiconductor region (5) and in which the emission of light occurs, these regions being embedded in the quantum structures (13, 15) of a semiconductor material having a direct band gap in at least two different intercoupled configurations.

Abstract: A semiconductor light-emitting device includes: a first semiconductor layer; a light-emitting layer being disposed on the first semiconductor layer; a second semiconductor layer being disposed on the light-emitting layer, and metal electrodes connected to the first semiconductor layer and the second semiconductor layer. The light-emitting layer is lower in refractive index than the first semiconductor layer. The second semiconductor layer is lower in refractive index than the light-emitting layer. The metal electrodes supply a current to the light-emitting layer.

Abstract: Disclosed herein is a nitride semiconductor light emitting device, which comprises plural active layers emitting light of different wavelengths. The device comprises p-type and n-type nitride layers, and a plurality of active layers sequentially stacked between the p-type and n-type nitride layers to emit light having different wavelengths. The active layers comprise at least a first active layer to emit a first wavelength light, and a second active layer to emit a second wavelength light, of which wavelength is longer than that of the first wavelength light. Both the first and second active layers are composed of at least one quantum well layer and a quantum barrier layer alternately arranged, and the first active layer is disposed closer to the p-type nitride layer than the second active layer. The number of quantum well layers of the first active layer is less than that of the second active layer.

Abstract: An electronic device includes a conductive n-type substrate, a Group III nitride active region, an n-type Group III-nitride layer in vertical relationship to the substrate and the active layer, at least one p-type layer, and means for providing a non-rectifying conductive path between the p-type layer and the n-type layer or the substrate. The non-rectifying conduction means may include a degenerate junction structure or a patterned metal layer.

Abstract: A light emitting device having a plastic substrate is capable of preventing the substrate from deterioration with the transmission of oxygen or moisture content can be obtained. The light emitting device has light emitting elements formed between a lamination layer and an inorganic compound layer that transmits visual light, where the lamination layer is constructed of one unit or two or more units, and each unit is a laminated structure of a metal layer and an organic compound layer. Alternatively, the light emitting device has light emitting elements formed between a lamination layer and an inorganic compound layer that transmits visual light, where the lamination layer is constructed of one unit or two or more units, and each unit is a laminated structure of a metal layer and an organic compound layer, wherein the inorganic compound layer is formed so as to cover the end face of the lamination layer.

Abstract: An integrated circuit with a number of optical waveguides that are formed in high aspect ratio holes. The high aspect ratio holes extend through a semiconductor wafer. The optical waveguides include a highly reflective material that is deposited so as to line an inner surface of the high aspect ratio holes which may be filled with air or a material with an index of refraction that is greater than 1. These metal confined waveguides are used to transmit signals between functional circuits on the semiconductor wafer and functional circuits on the back of the wafer or beneath the wafer.

Abstract: An object of the present invention is to provide a light emitting element or a light emitting device that can be formed without any regard for a work function of an electrode. Another object of the invention is to provide a light emitting element or a light emitting device in that the range of choice for a material of an electrode can be widened. In an aspect of the invention, a light emitting device includes first, second and third layers between mutually-facing first and second electrodes. The first layer has a donor level. The second layer is a single layer or a laminated body containing a light emitting substance. The third layer has an acceptor level. When a potential of the second electrode is set higher than that of the first electrode, holes generated in the second layer are injected in the third layer.

Abstract: A vertical GaN-based LED includes: an n-type bonding pad; an n-electrode formed under the n-type bonding pad; an n-type transparent electrode formed under the n-electrode; an n-type GaN layer formed under the n-type transparent electrode; an active layer formed under the n-type GaN layer; a p-type GaN layer formed under the active layer; a current blocking layer formed under a predetermined portion of the p-type GaN layer corresponding to a region where the n-electrode is formed, the current blocking layer being formed of distributed Bragg reflector (DBR); a p-electrode formed under the resulting structure where the current blocking layer is formed; and a support layer formed under the p-electrode.

Abstract: Light-emitting devices, and related components, systems and methods are disclosed.

Abstract: A sealing structure includes a lead frame having a light transmitting section, an optical element having an optical surface which is directed to the light transmitting section and is mounted on the lead frame in such a state that the optical element blocks the light transmitting section at its one end portion in an axis direction, and a sealing body that is formed in a region excluding an optical path and seals the optical element. By forming the sealing body in the region excluding the optical path, the light usage efficiency can be prevented from decreasing even when a material that can increase the environmental resistance is added to the sealing body. Further, since the optical element is mounted on the lead frame with its face down, the sealing structure can be easily formed even when the optical element is small-sized.

Abstract: Disclosed are phosphor compositions having the formulas Ca1?a?bCeaEubAl1+aSi1?aN3, where 0<a?0.2, 0?b?0.2; Ca1?c?dCecEudAl1?c(Mg,Zn)cSiN3, where 0c?0.2, 0?d?0.2; Ca1?2e?fCee(Li,Na)eEufAlSiN3, where 0?e?0.2, 0?f?0.2, g+h>0; and Ca1?g?h?iCeg(Li,Na)hEuiAl1+g?hSi1?g+hN3 where 0?g?0.2, 0<h?0.4, 0?i?0.2,g+i>0. When combined with radiation from a blue or UV light source, these phosphors can provide light sources with good color quality having high CRI over a large color temperature range. Also disclosed are blends of the above phosphors and additional phosphors.

Abstract: A light-emitting diode (20) includes a base (22), an LED chip (24) and a single-piece enclosure (26). The LED chip is electrically mounted on the base configured for emitting light beams. The single-piece enclosure attaches to the base and encloses the LED chip therein. The enclosure includes a central convergent lens portion (260) configured for converging the light beams from the LED chip. A peripheral portion (262) surrounds and extends from the central convergent lens portion to the base. The central convergent lens portion has an outer aspheric surface (264) and is aligned with the LED chip.

Abstract: A semiconductor light emitting device has a transparent layer having a first main surface and a second main surface at a side opposite to the first main surface, a plurality of light emitting sections arranged in at least one line on the first main surface of the transparent layer, each of the plurality of light emitting sections having an active layer and a tapered section, the tapered section reflecting light emitted from the active layer to the direction of the transparent layer, each of the plurality of light emitting sections having a central portion and a peripheral portion and having light intensity distribution on a second main surface of the transparent layer, on the second main surface of the transparent layer, light intensity at a region opposite to the peripheral portion being equal to or more than light intensity at a region opposite to the central portion, and a plurality of contact sections arranged opposite to the central portion on the second main surface of the transparent layer, each of the

Abstract: A white LED illumination device can include a white LED that has unevenness in tone and is used as a light source. The white LED illumination device can emit white light with high color rendering properties without unevenness in tone and can include the above noted white LED located adjacent an optical lens. The white LED and optical lens can be arranged so that the optical axes of both are substantially aligned with each other. The white LED can include an LED chip which emits light having a peak wavelength in the blue wavelength range and a fluorescent material which can be excited by the light emitted from the LED chip to emit yellow or yellowish green fluorescence (i.e., complementary colors to blue) by use of wavelength conversion. The optical lens can have a recessed light incident surface having an opening, a light emitting surface, and a totally reflective surface positioned between the light incident surface and the light emitting surface.

Abstract: A vertical GaN-based LED includes: an n-electrode; a light-emitting structure in which an n-type GaN layer, an active layer, and a p-type GaN layer are sequentially formed under the n-electrode; a p-electrode formed under the light-emitting structure; a passivation layer formed to cover the side and bottom surfaces of the light-emitting structure and expose a predetermined portion of the p-electrode, the passivation layer being formed of a distributed Bragg reflector (DBR); a plating seed layer formed under the passivation layer and the p-electrode; and a support layer formed under the plating seed layer.

Abstract: An optical module including: a housing formed of ceramics and having a base portion and a frame portion provided on the base portion; an optical element provided inside the frame portion; a cover member for the housing, the cover member being formed of a transparent substrate; and a connector with a lens provided so that the lens is disposed above the housing. The optical module may include a sealing member for bonding the housing and the cover member.

Abstract: A power line control circuit of a semiconductor device in which a width of a power line can be selectively controlled. The power line control circuit of the semiconductor device according to the present invention can selectively control the width of the power line employing the dummy power line. It is therefore possible to easily change the width of the power lines and to reduce the manufacturing cost and the manufacturing time depending on the formation of the power lines. Furthermore, the power line control circuit of the semiconductor device according to the present invention can selectively control the width of the power lines, if appropriate. Accordingly, mesh of optimized power lines can be provided. Furthermore, more stabilized product characteristics can be secured and the yield of semiconductor memory devices can be enhanced.

Abstract: A light emitting element includes: A light emitting element, includes: at least one LED chip provided on an installation surface of a substrate; a metallic reflecting plate, provided upright in a light projecting direction of the LED chip on the installation surface so as to surround an entire periphery of the LED chip, the metallic reflecting plate reflecting light projected from the LED chip to guide the light to a light projecting surface provided in the light projecting direction; and a first metallic portion and a second metallic portion, respectively connected to the LED chip as electrode terminals for supplying a driving current to the LED chip, each being formed in an area surrounded by the metallic reflecting plate on the installation surface, wherein an insulating section is formed surrounding the second metallic portion, to electrically insulate the second metallic portion from other portion in the area, and the first metallic portion is formed outside the insulating section in the area as an insta

Abstract: A semiconductor apparatus includes a substrate having at least one terminal, a thin semiconductor film including at least one semiconductor device, the thin semiconductor film being disposed and bonded on the substrate; and an individual interconnecting line formed as a thin conductive film extending from the semiconductor device in the thin semiconductor film to the terminal in the substrate, electrically connecting the semiconductor device to the terminal. Compared with conventional semiconductor apparatus, the invented apparatus is smaller and has a reduced material cost.

Abstract: A light emitting diode (10) has a backside and a front-side with at least one n-type electrode (14) and at least one p-type electrode (12) disposed thereon defining a minimum electrodes separation (delectrodes). A bonding pad layer (50) includes at least one n-type bonding pad (64) and at least one p-type bonding pad (62) defining a minimum bonding pads separation (dpads) that is larger than the minimum electrodes separation (delectrodes). At least one fanning layer (30) interposed between the front-side of the light emitting diode (10) and the bonding pad layer (50) includes a plurality of electrically conductive paths passing through vias (34, 54) of a dielectric layer (32, 52) to provide electrical communication between the at least one n-type electrode (14) and the at least one n-type bonding pad (64) and between the at least one p-type electrode (12) and the at least one p-type bonding pad (62).

Abstract: An LED module to realize light source performance as desire is comprised of multiple LEDs, a light-emitting chip of each LED being disposed in a carrier on a substrate; conduction circuits with different polarities being provided perimeter to the carrier on the substrate; golden plate wire connecting the chip and circuits; carrier being filled with fluorescent material before encapsulation; a slope being formed on the inner wall of the carrier; and the light-emitting angles varying depending on inclination carrier or the encapsulating height.

Abstract: A light emitting diode device capable of shielding or filtering the light in a manner to provide high-gradient edges or regions within the beam pattern. The LED device is also capable of providing selective coloring, thereby cost effectively improving the adaptability and number of applications which can utilize the LED device. The LED device includes an optical layer is positioned in front of a LED chip that includes a material having light transmission properties which change in response to electricity being supplied to the optical layer. The optical layer can thus transmit or absorb light from the LED chip, thus shielding or filtering light from the LED chip.

Abstract: The present invention discloses a semiconductor, includes one or more luminescent layers; and one or more electron gas layers with two-dimensional electron gases that are distributed parallel to the luminescent layers.

Abstract: Phosphor compositions having the formula (Sr,Ca,Ba)1?xEuxAl2?yMzO4?3/2yFz, where M is Mg and/or Zn; 0.001<x<0.15, 0?y?0.3, and 0<z?0.2; and light emitting devices including a light source and the above phosphor. Also disclosed are blends of (Sr,Ca,Ba)1?xEuxAl2?yMzO4?3/2yFz and one or more additional phosphors and light emitting devices incorporating the same.

Abstract: There is provided yellow and red illumination systems, including a semiconductor light emitter, and a luminescent material. The systems have an emission falling within the respective ITE red and yellow color bins having specified color coordinates on the CIE chromaticity diagram. The luminescent material may include one or more phosphors. The illumination systems may be used as the red and yellow lights of a traffic light or an automotive display.