Abstract: The present invention provides alloys for forming sputtered under bump metallization seed layers and electroplated or otherwise deposited bump metallurgy. The alloys of the present invention are comprised of silver with gold or palladium, copper with gold, or gold with nickel or palladium which provide suitable sputtering and electrical characteristics and resistance to corrosion and tarnishing. The invention further provides for semiconductor devices made from metal alloys for UBM and bump metallurgy, and for a method of making such semiconductor devices.

Abstract: A method of packaging an integrated circuit die (12) includes the steps of loading an array of soft conductive balls into recesses formed in a platen and locating the platen in a first part of a mold cavity. A second part of the mold is pressed against the balls to flatten a surface of the balls. A first mold compound then is injected into the mold cavity such that the mold compound surrounds exposed portions of the balls. The balls are removed from the platen and a first side of an integrated circuit die is attached to the balls such that the die is surrounded by the balls. Die bonding pads on a second side of the die are electrically connected to respective ones of the balls surrounding the die, and then the die, the electrical connections, and a top portion of the conductive balls is encapsulated with a second mold compound. The result is an encapsulated IC having a bottom side with exposed balls.

Abstract: A power semiconductor circuit has a power semiconductor module (2) embodied as a flat assembly. A particularly compact and space-saving production of a power semiconductor circuit may be achieved with the possibilities provided by an embodiment of the power semiconductor module, whereby the power semiconductor module (2) is arranged directly on a top track (3) of a power supply and/or output tracking (11) and a cooling device (5) is integrated in the tracking (11).

Abstract: There is provided a semiconductor device with a configuration in which a dummy silicide area 11 is provided in the vicinity of a non-silicide area 2 to easily capture residual refractory metals, resulting in an improved yield by preventing the trapping of residual refractory metals into a non-silicide area and thereby reducing a junction leakage within the non-silicide area.

Abstract: Passivation integration schemes and pad structures to reduce the stress gradients and/or improve the contact surface existing between the Al in the pad and the gold wire bond. One of the pad structures provides a plurality of recessed pad areas which are formed in a single aluminum pad. An oxide mesa can be provided under the aluminum pad. Another pad structure provides a single recessed pad area which is formed in a single aluminum pad, and the aluminum pad is disposed above a copper pad and a plurality of trench/via pads. Still another pad structure provides a single recessed pad area which is formed in a single aluminum pad, and the aluminum pad is disposed above a portion of a copper pad, such that the aluminum pad and the copper pad are staggered relative to each other.

Abstract: A semiconductor device is equipped with a semiconductor chip which has at least one layer of first insulating film formed on a substrate, and a plurality of pads arranged on a layer higher than the first insulating film. The plurality of pads on the semiconductor chip are arranged parallel to a predetermined chip edge of the semiconductor chip. The first insulating film has a reinforcement pattern in a region underneath each of the plurality of pads. In the region underneath each pad, occupancy of the reinforcement pattern in the first insulating film is within a predetermined range permitted for the region underneath each pad and occupancy of the reinforcement pattern in a whole area of a row where the reinforcement pattern is arranged in a line in a direction perpendicular to the predetermined chip edge is higher than occupancy of the reinforcement pattern in a whole area of a row where the reinforcement pattern is arranged in a line in a direction parallel to the chip edge.

Abstract: The plasma display panel includes a first substrate and a second substrate that are disposed substantially in parallel with each other with a predetermined distance therebetween; a plurality of address electrodes disposed on the first substrate; a first dielectric layer disposed covering the address electrodes; a plurality of barrier ribs having a predetermined height from the first dielectric layer to provide a discharge cell; a phosphor layer disposed in the discharge cell; a plurality of display electrodes disposed on one side of the second substrate facing the first substrate in a direction crossing the address electrodes; a second dielectric layer disposed covering the discharge sustain electrodes; and a protective layer disposed to cover the second dielectric layer. The protective layer includes a first area having a predetermined thickness and a second area that is disposed corresponding to a display electrode area and is thicker than the first area.

Abstract: This invention relates to a corrosion-resistant aluminum conductive material comprising an aluminum material consisting of aluminum or an aluminum alloy and a conductive film formed on the surface of said aluminum material wherein defects in the conductive film are substantially sealed off by a hot water treatment or a steam treatment and to a process for producing a corrosion-resistant aluminum conductive material which comprises forming a conductive film on the surface of an aluminum material and subjecting to a hot water treatment or a steam treatment thereby substantially sealing off defects in the conductive film. This invention makes it possible to substantially seal off the defects unavoidably developed on the surface of the conductive film without harming the excellent properties of the aluminum material and provide excellent corrosion resistance even when the thickness of the conductive film is small.

Abstract: An interconnect structure is described, disposed on a substrate with a conductive part thereon and including a dielectric layer, a composite plug and a conductive line. The dielectric layer is disposed on the substrate covering the conductive part. The composite plug is disposed in the dielectric layer electrically connecting with the conductive part, and includes a first plug and a second plug on the first plug, wherein the material or the critical dimension of the second plug is different from that of the first plug. The conductive line is disposed on the dielectric layer electrically connecting with the composite plug.

Abstract: The miniaturization of the system in package which laminates a plurality of semiconductor chips on a wiring substrate via a die attach film is promoted. In the system in package (SiP) which laminates memory chips and microcomputer chip via die attach film on wiring substrate, by forming metal plate in the chip mounting region of wiring substrate, and mounting memory chip of an undermost layer on this metal plate, the flatness of the chip mounting region of wiring substrate is secured, and die attach film which intervenes between metal plate and memory chip of an undermost layer is made the same quality as die attach film which intervenes between chips (between memory chips and between memory chip and microcomputer chips), and the same thickness.

Abstract: In a wiring substrate of the present invention in which a bump of an electronic parts is bonded to a connection pad of a wiring pattern provided on an insulating film by an ultrasonic flip-chip packaging, a via hole into which a via post acting as a strut to support the connection pad upon the ultrasonic flip-chip packaging is filled is arranged in the insulating film under the connection pad.

Abstract: Disclosed herein is a solder pad interface for a solder joint on a substrate. The solder pad interface includes a soldermask defined (SMD) interface between a solder pad (202) and the substrate, and a non-soldermask defined (NSMD) interface between the solder pad and the solder joint. The SMD interface can include a layer of insulating material (208) configured as an overlaid stencil with apertures through which the NSMD interface of the solder pad is substantially accessible. The SMD interface can include a soldermask (210) configured to cover an outer portion (212) of the solder pad. The NSMD interface includes a raised central portion (214) of the solder pad having a top. The layer of insulating material can be substantially flush with the top of the raised central portion. The raised central portion can provide the NSMD interface between the solder pad and the solder joint.

Abstract: An integrated circuit (IC) package includes a substrate and an IC die mounted on a first side of the substrate. The IC package also includes a plurality of capacitors mounted on a second side of the substrate. The second side is opposite to the first side. The IC package further includes a plurality of conductive contact pads formed on the second side of the substrate and interspersed among the capacitors. Other embodiments are described and claimed.

Abstract: In one embodiment, a semiconductor package is formed by adding a layer of particles to desired portions of a packing substrate. The layer of particles forms a matrix of crevices that provides a micro-lock feature for mechanically locking or engaging encapsulating materials.

Abstract: A semiconductor package may include a heat sink. The heat sink may be disposed above and spaced apart from a substrate, which may support a semiconductor chip. The heat sink may have a hole. A liquid molding compound may be provided through the hole of the heat sink to form an encapsulant. The encapsulant may seal the semiconductor chip, leaving an upper portion of the heat sink exposed. A tape supporting the heat sink may be provided on the substrate. The tape may be removed after the encapsulant is provided.

Abstract: The present invention relates to alignment marks for use on substrates, the alignment marks consisting of periodic 2-dimensional arrays of structures, the spacing of the structures being smaller than an alignment beam but larger than an exposure beam and the width of the structures varying sinusoidally from one end of an array to the other.

Abstract: A multi-terminal electromechanical nanoscopic switching device which may be used as a memory device, a pass gate, a transmission gate, or a multiplexer, among other things.

Abstract: A carburettor is connected into the inlet duct (48) of an internal combustion engine. The inlet duct is divided by a dividing wall (64) into a rich passage (42) and a lean passage (44). The carburettor includes a fuel chamber (4) and defines a flow duct divided by a planar partition (66) into a rich duct (30) and a lean duct (32) which communicate with the rich and lean passages, respectively. The partition (66) defines an aperture (40) in which a planar butterfly valve (20) is pivotably mounted. A number of fuel supply orifices (61, 62) communicate with the fuel chamber (4) and with the duct (30) at a position opposite to the aperture (40).

Abstract: A method and corresponding apparatus for an oval carbonator employ an oblong housing to provide an improved gas/water interaction area within the confines of the carbonator. The increased cross sectional area provides a larger water surface area, whereby an increased amount of the pressurized gas is exposed to the increased surface area. Further advantages of the oval carbonator include a simplification of the tubing bundles that are cast into the cold plate. The oval carbonator consolidates the volumes previously used by the carbonator, thereby allowing the tubing bundles to be consolidated. Consolidation of this type translates into reduced manufacturing time and increased savings due to the simplified design.

Abstract: An apparatus for supplying water containing dissolved gas comprising a flowmeter for measuring a flowrate of pure or ultra-pure water and a mechanism for controlling a flowrate, a means for adjusting an amount of water which adjusts an amount of the pure or ultra-pure water supplied to the apparatus for dissolving a gas, a tank which receives the water containing dissolved gas in an excessive amount which is not used at a point of use, a piping system through which the water containing dissolved gas glows from the tank towards the point of use and the water containing dissolved gas in an excessive amount returns to the tank, a piping system for supplying the water containing dissolved gas to the tank, and a controlling means for adjusting an amount of water based on a water level in the tank.

Abstract: A submerged gas processor in the form of an evaporator or a submerged gas reactor includes a vessel, a gas delivery tube partially disposed within the vessel to deliver a gas into the vessel and a process fluid inlet that provides a process fluid to the vessel at a rate sufficient to maintain a controlled constant level of fluid within the vessel. A weir is disposed within the vessel adjacent the gas delivery tube to form a first fluid circulation path between a first weir end and a wall of the vessel and a second fluid circulation path between a second weir end and an upper end of the vessel. During operation, gas introduced through the tube mixes with the process fluid and the combined gas and fluid flow at a high rate with a high degree of turbulence along the first and second circulation paths defined around the weir, thereby promoting vigorous mixing and intimate contact between the gas and the process fluid.

Abstract: The present invention provides an optical waveguide manufacturing method. A polymer resin with different refractive index from the polymer film is applied to a polymer film and is cured, so that a double-layered polymer film, which has a cladding layer and a core layer with higher refractive index than the cladding layer, is manufactured. The core layer is cut by the dicing saw having a blade for enabling cutting of a resin layer, so as to be processed into core portions of the optical waveguide. Cut concave portions of the core layer are filled with polymer resin having the same refractive index with the cladding layer. The core portions are further covered with the polymer resin, and the polymer resin is cured so that a cladding resin layer is formed.

Abstract: In a first aspect, the present invention provides an apparatus and method including a servo driven lens release head for releasing a cured lens in the dry state from the mold section in which it is adhered following mold release. The servo load parameters may be changed according to the lens type being processed. In a second aspect of the invention, the present invention provides an apparatus and method for retrieving the loosened lens from the mold section and transferring the lens to a lens inspection apparatus followed by either a lens rejection or transferring the passed lens to a receptacle for subsequent lens processing and packaging. The three substations of lens release, lens inspection and lens deposit are annularly spaced 120° from each other and three lenses may therefore be simultaneously processed through 120° incremental movement of three pick and place heads.

Abstract: The present invention is directed towards a method and a system of expelling a gas positioned between a substrate and a mold, the substrate and the mold further having a liquid positioned therebetween.

Abstract: Constraint fixture for processing annular preforms. The constraint fixture is made up of a lower plate, a top plate, a ring for the outside diameter of an annular preform being treated within the constraint fixture, and a ring for the inside diameter of the annular preform. The outside diameter and inside diameter rings are made of thin flexible sheet metal strips or thin flexible carbon-carbon composite strip material. The thin flexible strips are joined together by deformable joints, so that the flexible constraint system retains pitch within the fibrous matrix of the preform. The outside diameter strips may be joined together by expandable joints and the inside diameter strips may be joined together by collapsible joints. Also, a method of avoiding damage to an annular fibrous preform, e.g., an aircraft brake disc preform, during a carbonization procedure. This method involves carbonizing the annular fibrous preform in the constraint fixture of the invention.

Abstract: A composite solid tire, including a worn solid rubber tire having a remaining rubber layer, and a thermo-setting polyurethane elastomer layer which is provided on an outer circumferential surface of the rubber layer.

Abstract: Installation of a flexible cured in place liner by inverting the liner with air and curing the liner with steam introduced through a perforated lay flat hose without deflating the liner between the inversion and cure. The installation is performed with an apparatus having two independently operable glands with at least one fluid inlet port installed on the line downstream of the second gland liner. As the liner reaches the distal end of the conduit to be lined, it enters a sample and porting pipe with an exhaust pipe gland and exhaust pipe and it is pierced by a rigid porting tool. Steam is then introduced into the lay flat hose to cure the resin and is exhausted through an exhaust hose connected to a controllable exhaust pipe. After curing steam is replaced with air to cool the liner, the ends are cut to restore service through the host pipe.

Abstract: An apparatus and method are provided for molding sterile parts. The apparatus has a first mold portion and a second mold portion. At least one of the first and second mold portions defines a mold cavity configured to receive a molten plastic and form therefrom at least one molded part At least one of the first and second mold portions is movable relative to the other between (i) a closed position for sealing the mold cavity or cavities and molding at least one part therein, and (ii) an open position defining a fluid passageway between the first and second mold portions and permitting the passage of a fluid sterilant therein.

Abstract: The aspects of the present invention provides for an apparatus for conveying air into foam so that the flow of air within the foam may be monitored to determine one or more characteristics of the foam. The apparatus includes a nozzle and an adjustable member having a substantially planar surface. The nozzle is configured for operative connection to an air flow meter. The nozzle includes a tube sized and dimensioned to be inserted easily into the foam. The tube has a wall and an aperture formed in the wall. The aperture is sized and dimensioned to allow air to flow through the aperture and into the foam, and the aperture extends partially about the circumference of the tube. The adjustable member is operatively connected to the nozzle. The member adjusts axially to control the depth of insertion into the foam.

Abstract: The aspects of the present invention provide for an apparatus for conveying air into foam so that the flow of air within the foam may be monitored to determine one or more characteristics of the foam. The apparatus includes a nozzle and a member having a substantially planar surface. The nozzle includes a tube sized and dimensioned to be inserted easily into the foam. The tube has a wall and an aperture formed in the wall. The aperture is sized and dimensioned to allow air to flow through the aperture and into the foam, and the aperture extends partially about the circumference of the tube. The member is mounted to the nozzle and is also connected to an air flow meter.

Abstract: Disclosed herein is a method comprising inspecting a mold for a defect; determining a type of defect present on the mold; sorting the mold by type of defect present; treating the mold with a cleaning process that is suitable to remove the defect; and pressing the mold against a polymeric film to produce a series of defect free light management films; wherein the yield of light management films manufactured from the mold is higher than the yield of light management films that are produced from a comparative mold that has not been treated with the cleaning process.

Abstract: Expansion process for at least one blank of a toroid ring (2) formed of an elastomeric material, comprising a stage of partial cross-linking, the said toroid ring being designed, when fully cross-linked and expanded, to constitute at least in part a safety support with a closed-cell alveolar structure, the said support being designed to be fitted on a wheel rim inside a tire, in which on completion of the partial cross-linking phase the toroid ring (2) is placed in an oven (1) to undergo an expansion phase therein, characterised in that during the expansion phase the toroid ring (2) is rotated in a vertical plane by a horizontal rotating spindle (3) which supports the said toroid ring along its inner circumference.

Abstract: An installation and a method of preparing a continuous strand mat, the strands coming from at least one roving thrown onto a conveyor belt. In the method at least one roving package supported on a spindle is paid out via the outside, a rate of the pay-out imposed by a motor acting directly on the roving package so that linear speed of the paid-out roving is constant; then the roving passes through a nozzle, by passing through an entry and then an exit of the nozzle, the nozzle also provided with a transverse injection of at least one fluid mainly directed toward the exit of the nozzle, inducing a tension toward the bottom of the roving, the fluid also dividing the roving; and then the strands forming the roving are thrown in an oscillatory movement onto the conveyor belt.

Abstract: An imprinting apparatus, for transferring a microstructure of a mold onto a forming material by pressing and mold-releasing, includes a plurality of driving devices which relatively move the mold the forming material to each other along an axis of a pressing direction, wherein the plurality of driving devices make different relative moving speeds of the mold and the forming material during the relative motion.

Abstract: A molding apparatus is configured with article molding regions that receive a direct flow of a molding material feed such that external flow channels are not needed. The article molding regions are formed into front sides of opposed “A” and “B” surface mold tools that, when moved into a mating relationship with one another, form closed molding cavities within which molded articles are generated from molding material feed. The article molding regions each generally have a body bounded by a perimeter that establishes an outer edge for an article molded in the one of the closed molding cavities. With at least the “A” surface mold tool, a port is coupled with the body of each article molding region to establish a direct pathway is through which the molding material feed flows to enter the article molding regions, and thus the closed molding cavity, without having to flow along the tool front sides outside of the article molding regions.

Abstract: A molding apparatus is configured with a distribution channel configured to deliver a blended feed composition directly into an article molding region such that a molded article is formed with gating on the bottom surface of the article. The article molding regions are formed into front sides of opposed “A” and “B” surface mold tools that, when moved into a mating relationship with one another, form closed molding cavities within which molded articles are generated from molding material feed. The article molding regions each generally have a body bounded by a perimeter that establishes an outer edge for an article molded in the one of the closed molding cavities. Additionally, the body of each article molding region of the “A” surface mold tool is adapted for molding a bottom surface for the composite article, and the body of the article molding region of the “B” surface mold tool is adapted for molding a top surface for the composite article.

Abstract: An exemplary mold for molding optical elements includes a mold core and a gas blowing device. The mold core includes a molding surface, at least one gas inlet, a plurality of gas outlets located around the molding surface, a plurality of gas channels defined therein for connecting the at least one gas inlet and the gas outlets, and a plurality of switch elements configured around the molding surface to open and close the gas outlets. The gas blowing device has an output end communicated with the at least one gas inlet configured for blowing gas into the gas channels. A mold releasing method using the mold is also provided.

Abstract: A method and system for manufacturing a mask for plugging cells in a honeycomb substrate includes capturing an image of the substrate's end through an end-adhered transparent or translucent film using a camera, forming openings using a laser, wherein a working distance, WDC, of the camera while capturing the image is substantially the same as a working distance, WDL, of the laser while forming the openings. Also disclosed is an apparatus for manufacturing a mask on a honeycomb substrate, having a laser to form openings in a film applied to the substrate's end; and an optical system, wherein either the optical system or the substrate is moveable between first and second operating positions. In a first embodiment, the camera moves whereas in the second, the substrate moves. In each embodiment, the image is obtained without obstructing the path of the laser.

Abstract: Methods and apparatuses for manufacturing medical devices.

Abstract: The present invention relates to methods for making oxidation resistant medical devices that comprise polymeric materials, for example, ultra-high molecular weight polyethylene (UHMWPE). The invention also provides methods of making antioxidant-doped medical implants, for example, doping of medical devices containing cross-linked UHMWPE with vitamin E by diffusion and materials used therein.

Abstract: Disclosed are a method and a device for blow forming containers (2). A parison (1) is stretched by means of a stretching rod (11) within a blow mold and molded into the container (2) by applying blow pressure following thermal conditioning. Pressurized gas is introduced into the container (2) through the stretching rod (11). The pressurized gas is laterally introduced from a pressure chamber into an interior space of the stretching rod (11). The stretching rod comprises at least one passage opening (53) between a tip (51) facing the blow mold and an end (52) of the stretching rod, which faces away from the blow mold. Said passage opening (53) extends into the interior space of the rod so as to deliver the pressurized gas.

Abstract: A method for the treatment of micro pores (24) within a mica paper (20) that includes obtaining a silane with a molecular weight of between approximately 15 and 300, and adding the silane to the mica paper (20). Then reacting the silane with the inner surface of the micro pores within the mica paper. After this, a resin is impregnated into the mica paper, and the resin binds to the inner surfaces of the micro pores (24) with the mica paper through the silane.

Abstract: A process for making a ceramic body that includes the following steps: providing a starting powder mixture, the starting powder mixture comprises between about 15 volume percent and about 35 volume percent boron carbide powder and at least about 50 volume percent alumina powder and no more than about 5 volume percent of a sintering aid; and consolidating the powder mixture at a temperature equal to between about 1400 degrees Centigrade and 1850 degrees Centigrade to achieve a ceramic with a density equal to greater than 99 percent of theoretical density.

Abstract: A piston assembly used in forming a gas spring assembly includes a first piston member and a second piston member telescopically engaging one another and capable of axial displacement relative to one another between collapsed and extended conditions. The first piston member includes a mounting end and the second piston member includes a flexible wall-engaging end. The first and second piston members arranged such that in the collapsed condition the mounting and flexible wall-engaging ends are disposed a first distance from one another and in the extended condition the mounting and flexible wall-engaging ends are disposed at a second distance from one another with the second distance being greater than the first distance. A gas spring assembly and suspension system utilizing such a piston assembly as well as a method are also included.

Abstract: A wire rope vibration isolator is adapted to separate vibrations, mitigate impacts and reduce structural noises and includes a first fixed seat, a second fixed seat and a plurality of wire ropes. The wire ropes are separated from each other and respectively disposed between the first fixed seat and the second fixed seat. Moreover, the wire rope vibration isolator has a good damping effect in three-D directions to increase reliability and stability for precision machinery or products in working or moving processes, and the wire rope vibration isolator can reduce high-frequency noises. Hence, the wire rope vibration is safe and reliable, when it bears great impacts. Furthermore, the wire rope vibration isolator is easily assembled and used.

Abstract: A clamp is adapted to be secured to a second substantially identical clamp in order to accommodate a larger workpiece than can be held by a single clamp. The clamp includes a first jaw that is secured to an intermediate member, such as a bar or pipe, and a second jaw that is removeably securable to the intermediate member so as to selectively oppose the first jaw. The second jaw includes a surface thereon that is configured to interlock with a complimentarily-shaped surface on a second jaw of the second clamp.

Abstract: An installation apparatus is comprised of a pair of grasping brackets and an installation jig. The installation apparatus is employed to install a cockpit module in a vehicle body in a manner that the grasping brackets is detachably attached respectively to both end portions of a steering member of the cockpit module and that the installation jig grasps the grasping brackets and conveys the cockpit module to the vehicle body.

Abstract: In an installation and a method for the lifting of folded printed products (1) from a conveyor, wherein the printed products (1) are transported straddled across a saddle (2), the saddle (2) comprises a counter tool (4) for a processing of printed products (1) straddled across the saddle (2). Therein a means of lifting (5) extends alongside and parallel to the saddle (2) and is staggered at right angles to a support shoulder (3) of the saddle (2) as well as to the counter tool. As the means of lifting, the support shoulder (3) and in particular the counter tools are not situated in line but staggered, an unrestricted positioning of binding points along the support shoulder (3) is possible. There is no need to consider the position of lifting tappets or levers for the lifting of the printed products in the support shoulder (3).

Abstract: An apparatus for feeding porous sheets of media from a stack of such sheets includes a support structure for supporting the stack. A gas conduit is mounted on the support structure and has an outlet that is oriented so that, when the stack is positioned on the support structure, the outlet is directed towards a first sheet of the stack. The gas conduit is in fluid communication with a gas supply so that a stream of gas can be directed onto the first sheet to penetrate the first sheet and generate a cushion of gas between the first sheet and a second sheet to separate the first and second sheets. A sheet feed mechanism feeds the first sheet from the stack once the first and second sheets are separated.

Abstract: An arrangement is provided such that a pad pressing means for pressing a separation pad against a pick roller is formed in a reverse U-shape, and a pressing spring for pressing the pad pressing means to press the separation pad against the pick roller is provided on a central portion of the pad pressing means. The pad pressing means is structured so as to have a rotating fulcrum to be rotatable back and forth with respect to a rotating direction of the pick roller about a connecting portion of the pad pressing means for connection to the pressing spring. To ensure that a large load will not be applied to the entire pad pressing means when thick paper or the like is fed, a rotating arm may be provided so that the entire pressing means including the pad pressing means is rotatable about a predetermined position set at the rotating fulcrum which is the connecting portion for connection to the pressing spring.