Abstract: A switching power supply device has a boost power converter which converts a wide range of AC input voltages into a DC voltage larger than an amplitude of the AC input voltage to supply to a DC-DC converter. The switching power supply device includes a load detection circuit, an input voltage detection circuit, and a power conversion controller for the boost power converter. The power conversion controller corrects the determination reference value in accordance with the AC input voltage detected in the input voltage detection circuit. When a light load is detected based on a comparison between the corrected determination reference value and the detection value output from the load detection circuit, the controller disables the boost power converter.

Abstract: A converter coupled to a DC voltage input and connectable to a load, includes a signal responsive switch coupled between a first circuit point and a second circuit point. In lieu of burst mode operation during low load conditions, the peak switch current is varied directly with load condition and a switch deactivation interval is varied inversely with load condition. The switch deactivation level is within a maximum level to avoid audio frequency band interference, while maintaining high efficiency operation throughout the load range.

Abstract: A control unit performs the first-third controls. The first control controls a group of switch elements so that a step-up voltage is supplied to a voltage output terminal by a pumping action of a step-up voltage accumulating capacity element by applying the reference power source voltage to the reference power source voltage accumulating capacity element in an inverse direction, after execution of an electric charge accumulating action with the reference power source voltage in the reference power source voltage accumulating capacity element. The second control controls the group of switching elements so as to provide a dead-time period, during which the reference power source and the reference power source voltage accumulating element are disconnected, between a period of the electric charge accumulating action and a period of the pumping action and between the period of pumping action and the period of electric charge accumulating action.

Abstract: A generator comprises a first core (hollow cylindrical core) 1, a second core (cylindrical columnar core) 2, a plurality of extending core portions (radially extending core portions) 3 interposed between the cores and radially extending at predetermined spacing in the circumferential direction, slots 4 formed between adjacent ones of the radially extending core portions, and primary and secondary windings 5 and 6 wound around the extending core portions 3 between the slots. The plurality of radially extending core portions 3 with the primary and secondary windings being wound therearound are extending from the hollow cylindrical core 1 and integrated with the hollow cylindrical core 1, and the cylindrical columnar core 2 is attached into the hollow area of the hollow cylindrical core 1. This assembling structure and method can improve the workability when assembling the generator including the primary and secondary windings.

Abstract: A high voltage pulse generating circuit comprises an inductor, a first semiconductor switch and a second semiconductor switch connected in series between both ends of a direct current power supply, and a diode wherein a cathode terminal is connected to one end of the inductor whose other end is connected to an anode terminal of the first semiconductor switch, and an anode terminal is connected to a gate terminal of the first semiconductor switch. The inductor has a first coil and a second coil. A diode is connected in parallel to the first semiconductor switch, and a capacitor is connected in parallel to the first coil of the inductor.

Abstract: A DC-DC converter prevents through current from flowing in an output transistor. A first transistor receives an input voltage. A second transistor is connected to the first transistor. A comparator is connected to the second transistor. The comparator detects current flowing through a choke coil based on the potential difference between two terminals of the second transistor to generate a switching control signal for turning the second transistor on and off. The second transistor and the comparator form an ideal diode. A control circuit of the DC-DC converter generates an activation signal for turning the first transistor on and off based on a pulse signal to keep an output voltage constant. A through current prevention pulse generation circuit generates a pulse signal for turning off the second transistor from before the first transistor is turned on to after the first transistor is turned on.

Abstract: Embodiments disclosed herein include a power monitor and controller which are used to control the operation of a voltage regulator depending on an operating mode or state of a load device, such as a hard disk drive. By controlling the voltage regulator in this manner, voltage regulator efficiency may be improved for any load condition, thus reducing power losses in the system.

Abstract: A DC converter with a halt mode setting is disclosed for preventing the occurrence of over-current while alleviating the increase in the size of circuits, along with a method for setting up such a halt mode. The DC converter includes a semiconductor switch, a clock generator for outputting a clock signal to a gate of the semiconductor switch to be utilized for controlling an on/off time of the semiconductor switch such that a predetermined power is output from the generator, and a drive circuit for switching the semiconductor switch to the continuous-on state according to a halt mode setting requirement regardless of the clock signal, when the semiconductor switch, normally repeating on/off operations responsive to the clock signal, is in its off-state.

Abstract: A DC-DC converter is disclosed that includes a constant voltage circuit outputting a first voltage, a charge pump circuit outputting a second voltage, a current detection circuit converting the output current of the constant voltage circuit into a third voltage and outputting the third voltage, a first detection circuit detecting the first voltage and outputting a first detection voltage proportional thereto, a first overcurrent protection circuit comparing the third voltage and the first detection voltage and reducing the output first voltage and current of the constant voltage circuit when the third voltage exceeds the first detection voltage, a second detection circuit detecting the second voltage and outputting a second detection voltage proportional thereto, and a second overcurrent protection circuit comparing the third voltage and the second detection voltage and reducing the output first voltage and current of the constant voltage circuit when the third voltage exceeds the second detection voltage.

Abstract: A switching regulator circuit including a high-side switch and a low-side switch; an inductor having a first terminal coupled to a common terminal between the high-side switch and the low-side switch, and a second terminal coupled to an output terminal of the switching regulator circuit; a low-pass filter coupled to the first terminal of the inductor, where the low-pass filter is operative for generating a ramp signal based on the voltage signal present at the first terminal of the inductor; and a hysteretic comparator coupled to the low pass filter, where the hysteretic comparator receives the ramp signal as an input signal, and generates an output signal which is operative for controlling the operation of the high-side switch and the low-side switch.

Abstract: A sensor for detecting mechanical perturbations represented by a change in an electrical signal includes a structure such as a cantilever, membrane, etc. and a field effect transistor such as a MOSFET embedded in the structure. The drain current of the embedded transistor changes with mechanical perturbations in the structure caused, for example, by a biochemical interaction being sensed. A scanning probe microscope utilizes the embedded MOSFET with a BiMOS actuator.

Abstract: A recording medium detecting system includes a magnetic field-generating unit that generates an alternating magnetic field in a predetermined particular region, a detecting unit provided close to the particular region, that detects a change in magnetic flux density not smaller than a predetermined magnetic-flux-density difference B2, and a recording medium, containing multiple magnetic wires made of a magnetic material and formed in a wire shape having a predetermined length, that causes a large Barkhausen effect when the alternating magnetic field is applied. A magnetic-flux-density difference B1 detected by the detecting unit at an installation position thereof when the recording medium is placed in the particular region is not smaller than the magnetic-flux-density difference B2.

Abstract: A detector circuit is to be used for measuring current by means of substantially identically wound ring core transformers, in which magnetomotive forces are induced by a main current. The magnetomotive forces are counteracted by magnetomotive forces induced by a compensating current. Two of the ring core transformers (2, 3) are magnetized in antiphase by means of a modulation signal. The detector circuit includes optionally a synchronous rectifier for providing an adjusting signal for the compensating current. According to the invention means are provided for compensating for possible differences between the two ring core transformers for the modulation signal. These means include a common winding surrounding the two ring cores (2, 3), said common winding detecting a possible error signal used in a negative feedback loop which automatically seeks to establish an equilibrium.

Abstract: An apparatus having a position sensor for determining a position of a moveable component is provided. The apparatus comprises a housing, a positioning member, a shaped magnetic pole, a magnet, and a hall effect sensor. The positioning member, the shaped magnetic pole, the magnet, and the hall effect sensor are each disposed within the housing. The positioning member is operably coupled to the moveable component and moveable relative to the housing. The magnet induces a magnetic flux in the shaped magnetic pole. One of the shaped magnetic pole and the magnet move in conjunction with the positioning member. The hall effect sensor is adapted to sense an intensity of the magnetic flux in the shaped magnetic pole and generate an output corresponding to the sensed intensity such that the position of the moveable component can be determined.

Abstract: To provide a magnetic line-type position-angle detecting device capable of detecting an absolute position on a non-contact basis and with high resolution and inexpensive construction, the magnetic line-type position-angle detecting device includes a magnetic line sensor 1 having a plurality of magnetic sensor elements 1a arranged in line, and a magnetic generating element 2 confronting the magnetic line sensor and movable in a direction conforming to the line of the magnetic sensor elements 1a. The magnetic sensor elements 1a of the magnetic line sensor 1 are sequentially selected by a scanning circuit 3, a signal from the selected sensor element 1a is processed into a digital signal through an amplifier 4, and an analog-to-digital converting circuit 5. By a calculation processing circuit 6, a distribution of magnetic fields applied to the magnetic line sensor 1 are measured to calculate the position and/or angle of the magnetic generating element 2.

Abstract: A magnetic head and disk tester comprises a base, a spindle for rotationally supporting a magnetic disk, a carriage for supporting a magnetic head support which carries a magnetic head with a magnetic read/write element, and a dual-stage positioning system that moves the carriage in two perpendicular directions X and Y. The magnetic head support, the magnetic head and the magnetic read/write element have a conmmon longitudinal axis Z. The head support is positioned such that the longitudinal axis Z forms a predetermined angle between 0° and 90° with respect to the Y direction. Preferably the predetermined angle is about 45 degrees. When the head is driven from one point of an inner track to a point of an outer track, the displacement of the head along X axis is relatively large and the displacement of the head along Y axis is relatively small.

Abstract: A sensor component used to measure a magnetic field strength is disclosed. In one embodiment, the sensor component contains a plurality of leads and a sensor semiconductor chip, which measures the magnetic field strength. The sensor semiconductor chip has pads on its active upper side. These pads are connected electrically to the leads. The sensor component also contains a magnet, which is attached to the leads. The sensor semiconductor chip is arranged on an upper side of the magnet. The sensor component also has a first mold compound which shares a common boundary with the sensor semiconductor chip and surrounds the sensor semiconductor chip, the magnet and parts of the lead.

Abstract: Systems and methods are disclosed herein for the non-intrusive inspection and/or verification of cargo. In an exemplary embodiment, an elemental signature is determined at a first point in a supply chain and transmitted to a second point in the supply chain. When the goods arrive at the second point, the elemental signature of the goods may be measured and verified against the original elemental signature. In another embodiment, an elemental signature may be measured to verify the origin or identity of the goods. In some embodiments such elemental signatures are inherent to the shipped goods and/or their packaging. In other embodiments, elemental signatures are applied to the shipment as tag materials.

Abstract: The present invention is directed to perform T2 weighting and suppression of a signal from a specific component in short preparation pulse application time. A first 90° pulse in DE pulses is a pulse which is selectively valid for water and makes the longitudinal magnetization of water turn by 90° about the x axis as a rotation axis. A 180° pulse is a pulse which is valid for water and fat and makes the longitudinal magnetization of water and fat turn by 180° about the x axis as a rotation axis. A second 90° pulse is a pulse which is valid for water and fat and makes the longitudinal magnetization of water and fat turn by 90° about the x axis as a rotation axis. By the DE pulses, the longitudinal magnetization of water is rotated by 360°, and the effect of T2 weighting is obtained in a manner similar to the conventional DE pulses. The longitudinal magnetization of fat is rotated by 270° and does not return to the original longitudinal magnetization so that the effect of suppressing a signal is obtained.

Abstract: In a method for adjustment of the field strength of radio-frequency pulses as well as a magnetic resonance measurement system, radio-frequency pulses are emitted by a radio-frequency antenna of a magnetic resonance measurement system in a magnetic resonance measurement A test volume slice is initially excited by emission of radio-frequency pulses with a defined pulse amplitude by the appertaining radio-frequency antenna and one-dimensional, spatially-resolved characteristic values are determined along an extent direction of the test volume slice. The one-dimensional, spatially-resolved characteristic values respectively represent a local field strength of the B1 field in strips of the test volume slice running perpendicular to the extent direction. An average value of the determined characteristic values is then formed over at least over one determined segment along the extent direction of the test volume slice.

Abstract: The present invention aims to receive a signal of tissue long in T2 at a relatively high level and suppress artifacts. When a magnetic resonance frequency of a component intended for measurement is assumed to be ? and the frequency corresponding to a repetition time TR is assumed to be ?o, an RF pulse obtained by modulating a chemical shift SAT pulse for reducing a signal of a frequency ? with cos (?o·t) is applied as a leading pulse Po and thereafter a pulse sequence of Balanced SSFP is applied. Since a signal leading to the occurrence of artifacts is reduced owing to the effect of the leading pulse, the artifacts can be suppressed. Since a transient state is long in the same manner as conventional, such a signal of tissue long in T2 can be received at the relatively high level and contrast can be kept high by executing data acquisition in the transient state.

Abstract: A plurality of global receive coils (24a, 24b, 24c) are stationarily positioned around a fixed field of view (FOV) of a magnetic resonance diagnostic imaging device (10). Each global receive coil receives undersampled phase and frequency encoded data from the stationary field of view. A subject is imaged as it moves continuously through the fixed field of view such that data is collected over a virtual field of view (vFOV) of the subject which is longer than the field of view in a longitudinal direction of subject motion. Centrally encoded k-space data, acquired from each of the global receive coils, is used to generate coil sensitivity patterns (42) which are mapped (44) from the stationary field of view to the virtual field of view.

Abstract: A magnetic resonance imaging system performing various types of imaging that involves movement of a patient's couch. The system has a patient's couch having a tabletop movable in a predetermined direction passing through a static magnetic field as well as reception multiple RF coils consisting of for example a plurality of coil groups. The tabletop is automatically moved in its longitudinal direction in accordance with a length of each coil group in the predetermined direction. At each moved position, scanning is performed on a given pulse sequence. An echo signal is received through the multiple RF coils, then switched over by an input switchover unit to be sent to a receiving-system circuit. The echo signal is subjected to given processing in this circuit so that it is converted to echo data. The echo data are produced into an MR image by a host computer.

Abstract: Magnetic resonance device comprises a patient support table and a main field magnet. The main field magnet is supported so that it can be rotated around at least one axis. The patient support table is able to be rotated around an axis essentially perpendicular in respect of its table surface.

Abstract: A multi-component field source for surveying subsea formations includes at least two electrodes having a direction of motion, wherein the at least two electrodes are configured to produce an electric dipole in an orientation that is not parallel to both the direction of motion of the electrodes and the seafloor. A method for logging subsea formations includes transmitting electromagnetic energy into the subsea formations with at least two electrodes having a direction of motion and configured to produce an electric dipole in an orientation that is not parallel to both the direction of motion of the electrodes and the seafloor; and receiving signals that comprise electromagnetic energy that has traversed the subsea formations.

Abstract: A semiconductor leakage current detector of the present invention includes a first analog switch which causes a current to be measured to flow or to be cut off, a second analog switch which causes a reference current to flow or to be cut off, an integral capacitance element which is connected by the first analog switch and the second analog switch and is charged with the current to be measured or the reference current, a discharge unit which discharges the integral capacitor, and a comparison unit which compares the reference voltage with each of an integral voltage generated in the integral capacitor by a reference current after the discharge of the integral capacitor and an integral voltage generated in the integral capacitance element by the current to be measured after the discharge of the integral capacitor

Abstract: A rail break or vehicle detection system includes a plurality of voltage sources, each coupled to one of the plurality of zones. A plurality of resistors are provided, each coupled in series with one of the plurality of voltage sources. A plurality of current sensors are provided, each coupled to one of the plurality of resistors and adapted to measure a first set of values and second set of values indicative of current flowing through the resistor. At least one control unit is adapted to receive input from the plurality of current sensors and to compare a difference between the second set of values and the first set of values to a predetermined threshold limit to detect presence of a rail vehicle on the block. The control unit is further adapted to switch a polarity of each voltage source.

Abstract: A system and method for testing devices. The system includes a plurality of pads and a decoder coupled to a plurality of devices. The decoder is configured to receive a plurality of selection signals from the plurality of pads and select a device from the plurality of devices based on at least information associated with the plurality of selection signals. Additionally, the system includes one or more pads connected to the selected device. At least one of the one or more pads is not connected to any of the plurality of devices other than the selected device. The one or more pads are used for testing the selected device.

Abstract: Soil moisture sensor systems and methods are disclosed. An exemplary soil moisture sensor system comprises a sensor configured to receive soil between parallel plates. A capacitive measurement circuit is operatively associated with the parallel sensor. A processor receives input from the capacitive measurement circuit. The processor determines moisture content of the soil between the parallel plates of the sensor based on the flowing relationship: C = LH d ? ? 0 ? ? r where L is the length of the sensor, H is the height of the sensor, and d is the separation between the parallel plates of the sensor.

Abstract: The present invention is generally directed toward sensors and associated methods, including surface condition sensors. For example, in certain embodiments sensor can be configured to sense the surface conditions on a road surface and/or an airport surface. One aspect of the invention is directed wet/dry sensors. Other aspects of the invention are directed toward conductivity sensors. Still other aspects of the invention are directed toward sensor packages that include a combination of active and passive sensor technology. Yet other aspects of the invention are directed toward communication systems and methods associated with various sensors.

Abstract: The method is for powering an integrated circuit, said integrated circuit comprising a chip within a package assembly, said chip comprising a plurality of logic circuits each having at least one power input which should not receive a power voltage exceeding a predetermined maximum operating voltage. The method comprises the steps of:—measuring (in step 98) the power voltage supplied to the integrated circuit directly within the chip at the power input of at least one logic circuit, and—regulating (in step 96) this power voltage such that the voltage supplied to the power input of at least one logic circuit of the chip is equal to the predetermined maximum operating voltage of this logic circuit.

Abstract: A test probe for executing high-frequency measurements comprises: a coaxial high-frequency wave guide containing an inner conductor and an outer conductor for delivering a primary electrical potential and a secondary electrical potential, respectively, a supporting structure conductively connected to at least the outer conductor and to at least two contact elements for creating a contact with an electronic circuit to be tested. The support structure is provided with conductive paths for the transmission respectively of a high-frequency signal from the inner conductor and a high-frequency ground potential from the outer conductor to at least one contact element and each conductive path is conductively connected to the inner or outer conductor. The support structure has at least one U-shaped cut-out with a width essentially equivalent to an outer diameter of the wave guide and sides of the U-shaped cut-out are connected to the outer conductor.

Abstract: A probe card assembly has a probe contractor substrate having a plurality of probe contractor tips thereon and a probe card wiring board with an interposer disposed between the two. Support posts contacting the probe contractor substrate are vertically adjustable until secured by a locking mechanism which is coupled to the probe card wiring board. When the posts are secured in a fixed position, the position is one in which the plane of the plurality of probe contractor substrates is substantially parallel to a predetermined reference plane.

Abstract: In high current integrated circuit wafer test applications, a high capacitance density capacitor may be formed in association with a probe card at a position closer to a wafer under test. This reduces the power path impedance, improving transient power delivery of a probe card. That is because now the capacitance is positioned more closely to the wafer under test, reducing path impedance. The capacitance density may be at higher, improving transient power delivery.

Abstract: An insulative block has a first face adapted to oppose a board on which an inspection circuit is arranged and a second face adapted to oppose a device to be inspected. The insulative block is formed with first through holes each of which communicates the first face and the second face. A conductive first plating layer is formed on the first face, the second face, and an inner face of at least one of the first through holes. Each of contact probes includes a conductive tubular body held in an associated one of the first through holes and a plunger which is retractably projected from one end of the tubular body and is adapted to come in contact with a terminal of the device.

Abstract: An insulative block has a first face adapted to oppose a board on which an inspection circuit is arranged and a second face adapted to oppose a device to be inspected. The insulative block is formed with through holes each of which communicates the first face and the second face. A conductive plating layer is formed on the first face, the second face, and an inner face of at least one of the through holes. Each of contact probes includes a conductive tubular body held in an associated one of the through holes and a plunger which is retractably projected from one end of the tubular body and is adapted to come in contact with a terminal of the device. The contact probes includes a first group of contact probes adapted to come in contact with terminals of a first circuit in the device, and a second group of contact probes adapted to come in contact with terminals of a second circuit in the device.

Abstract: When a convex jig pushes up a bottom face of an adhesive sheet where a target semiconductor device is located, a non-target semiconductor device located near the target semiconductor device is lower in position than the target semiconductor device. Thus, the non-target semiconductor device is prevented from coming into contact with an impedance adjusting element and a coaxial connector each provided for high-frequency measurement near a socket.

Abstract: A chip burning system includes a burning device (10) with a plurality of burning files stored therein, a transforming circuit (30) for connecting to chips via serial interfaces, a control unit (20) interconnecting the burning device and the transforming circuit via parallel interfaces, and two chips (40,50) for burning. The transforming circuit includes a parallel-to-serial conversion module (301). The control unit includes a terminal (28) configured to output a chip choosing signal to the transforming circuit for choosing one chip from the two chips. The burning device transmits a parallel type burning file to the transforming circuit via the control unit. The transforming circuit transforms the burning file into serial type with the parallel-to-serial conversion module, and the transformed burning file is burned into the chosen chip.

Abstract: A socket electrically coupled to a BGA unit includes a plurality of ball contacts including a housing wherein a through-hole having a larger diameter than that of the ball contact is formed in a surface of the housing, which faces the BGA unit, in order to the through-hole corresponds the plurality of ball contacts and a pin contact provided in a plurality of through-holes and contacting a corresponding side part of the ball contact. More desirably, the plurality of pin contacts is provided in order that each extending directions of the pin contacts are opposite to one another.

Abstract: Described herein is an optical probe (120) for use in characterizing surface defects in wafers, such as semiconductor wafers. The optical probe (120) detects laser light reflected from the surface (124) of the wafer (106) within various ranges of angles. Characteristics of defects in the surface (124) of the wafer (106) are determined based on the amount of reflected laser light detected in each of the ranges of angles. Additionally, a wafer characterization system (100) is described that includes the described optical probe (120).

Abstract: A circuit board damping assembly provides a damping node for a circuit board coupled in spaced relationship to another circuit board or chassis. The circuit board damping assembly includes a chassis or circuit board forming a base member; a circuit board coupled in spaced relationship to the base member; a first attachment member coupled to the base member; a second attachment member coupled to the circuit board; and a connector coupled between the first and second attachment members. The connector may be a wire coupled to the first and second attachment members.

Abstract: Testing of die on wafer is achieved by; (1) providing a tester with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, (2) providing die on wafer with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, and (3) providing a connectivity mechanism between the bidirectional transceiver circuitry's of the tester and a selected group or all of the die on wafer for communication of the JTAG signals.

Abstract: A method and apparatus for testing and characterizing features formed on a substrate. In one embodiment, a test structure is provided that includes a test element having a first side and an opposing second side. A first set of one or more structures defining a first region having a first local density are disposed adjacent the first side of the test element. A second set of one or more structures defining a second region having a second local density are disposed adjacent the second side of the test element. A third set of one or more structures defining a third region having a first global density are disposed adjacent the first region. A fourth set of one or more structures defining a fourth region having a second global density are disposed adjacent the second region.

Abstract: An apparatus and method to test components in a semiconductor test structure. On a semiconductor wafer, a test module implemented in one or more scribe lines between a plurality of semiconductor dies is used to test components in the semiconductor test structure. The test module may, for example, test electrical characteristics of chains of vias, transistors, and functional devices, such as oscillators. The test module contains a scan chain control coupled through a plurality of pass gates to each component to be tested. The scan chain control sequentially closes the pass gates to separately test the components in the semiconductor test structure. The test module further interfaces with an external testing device and the results of each test are compared with the expected results to identify faulty components.

Abstract: Output data of a device under test (DUT) is obtained at timing of both rising and falling edges of a clock output from the DUT, and output data of a DDR type device is fetched in synchronization with the clock. A semiconductor test apparatus comprises a clock side time interpolator 20 which obtains clocks input from a DUT 1 by a plurality of strobes of constant timing intervals and which outputs the clocks as time-sequential level data, a data side time interpolator 20 which obtains output data input from the DUT 1 by a plurality of strobes of constant timing intervals and which outputs the output data as time-sequential level data, and an edge selector 30 which switches the time-sequential level data obtained by the time interpolators 20 and selectively outputs level data indicating rising and/or falling edges of the level data.

Abstract: An on-chip circuit for defect testing with the ability to maintain a substrate voltage at a level more positive or more negative than a normal negative operating voltage level of the substrate. This is accomplished with a chain of MOSFETs that are configured to operate as a chain of resistive elements or diodes wherein each element in the chain may drop a portion of a supply voltage coupled to a first end the chain. The substrate is coupled to a second end of the chain. The substrate voltage level is essentially equivalent to the supply voltage level less the voltage drops across the elements in the diode chain. A charge pump maintains the substrate voltage level set by the chain. Performing chip testing with the substrate voltage level more negative than the normal negative voltage level facilitates detection of devices that will tend to fail only at cold temperatures.

Abstract: A display device has a display panel, which includes a plurality of IC pads, a plurality of data lines, a selector, a plurality of switches and a test pad. The IC pads are connected to the data lines through the selector. The data lines are electrically connected to a corresponding pixel circuit. The IC pads are connected to the test pad via the corresponding switch. The switches are sequentially turned on to sequentially transmit a voltage to the corresponding pixel circuit through the test pad.

Abstract: Provided are a detection element Em used for controlling a value of a drive voltage for each light emitting element constituting a display pixel, and a leakage detection circuit 4 which separates the detection element Em from a current source I1 when this detection element Em is in a leakage state. Further provided are a pseudo leakage setup means 5 with which a potential of an anode terminal in the above-mentioned detection element can be set as a pseudo leakage potential which is a potential when the detection element is in the leakage state, and an operation detection means 6 to verify that the leakage detection circuit 4 operates normally when operating the above-mentioned pseudo leakage setup means 5.

Abstract: An on-die termination circuit for semiconductor memory apparatus includes an ODT (On Die Termination) input driving unit that divides an input voltage on the basis of a resistance ratio according to a first code Pcode<0:N> having at least two bits and outputs a first line voltage, a first ODT control unit that counts the first code or resets the first code to a first set value according to whether or not the first line voltage and a reference voltage match with each other, an ODT output driving unit that divides an input voltage on the basis of the resistance ratio according to the first code and a resistance ratio according to a second code having at least two bits and outputs a second line voltage, and a second ODT control unit that counts the second code or resets the second code to a second set value according to whether or not the second line voltage and the reference voltage are consistent with each other.

Abstract: Processing components to manufacture information handling systems have build-to-order integrated circuits with plural selectively-enabled features set at the information handling system manufacture location. For instance, fuses integrated in the integrated circuits are selectively blown at the information handling system manufacture location to permanently disable features so that the processing components have a desired configuration. As another example, feature enable or disable states are programmed in flash incorporated in the integrated circuit, with the flash programmability subsequently disabled to permanently set the features so that the processing components have a desired configuration. Features are set with keys provided by the processing component manufacturer to track the information handling system manufacturer's use of the features.