Abstract: A semiconductor device includes a semiconductor chip, electrodes pads, first and second insulating layers, first and second conductive patterns and external terminals. The electrode pads are formed on a first area of a main surface of the semiconductor chip. The first insulating layer is formed on the first and second areas of the semiconductor chip and exposes the electrode pads. The first conductive pattern transfers a signal and is formed on the first insulating layer. A second insulating layer is formed on the first conductive pattern and the first insulating layer. The second conductive pattern is formed on the second insulating layer and provides a ground potential. The external terminals are formed on the first and second patterns at the second area.

Abstract: The present invention is a semiconductor device capable of relieving thermal stress without breaking wire. It comprises a semiconductor chip (12), a solder ball (20) for external connection, wiring (18) for electrically connecting the semiconductor chip (12) and the solder ball (20), a stress relieving layer (16) provided on the semiconductor chip (12), and a stress transmission portion (22) for transmitting stress from the solder ball (20) to the stress relieving layer (16) in a peripheral position of an electrical connection portion (24a) of the solder ball (20) and wiring (18).

Abstract: The present invention provides a system for 3D package stacking system, comprising providing a substrate, attaching a ball grid array package, in an inverted position, to the substrate, forming a lower package, the lower package having the ball grid array package and the substrate encapsulated by a molding compound and attaching a second integrated circuit package over the lower package.

Abstract: A semiconductor package may include a substrate. A conductive bump may be provided on a bottom surface of the substrate. A semiconductor chip may be provided on a top surface of the substrate. A sealing material may seal the semiconductor chip on the top of the substrate. A first conductive adhesive may be provided on a top surface of the sealing material. A second conductive adhesive may be provided on a side surface of the substrate and a side surface of the sealing material.

Abstract: An integrated circuit (IC) chip and related package are disclosed including a first interlevel dielectric (ILD) layer(s) including an ultra low dielectric constant (ULK) material, a second ILD layer(s) including a silicon dioxide (SiO2) based dielectric material above the first ILD layer(s), and a transitional ILD layer including an intermediate dielectric constant material. The transitional ILD layer is positioned directly below a lowermost one of the second ILD layer(s), excepting any isolation layer, which represents the layer most susceptible to failure. The intermediate dielectric constant material can have a dielectric constant and an elastic modulus greater than that of the ULK material and less than that of the SiO2 based dielectric material. Hence, the intermediate dielectric constant provides adequate electrical properties, but also absorbs more of the stress than the typical ULK material, which reduces the likelihood of failure. A method of forming the IC chip is also disclosed.

Abstract: A memory cell for use in integrated circuits comprises a chalcogenide feature and a transition metal oxide feature. Both the chalcogenide feature and transition metal oxide feature each have at least two stable electrical resistance states. At least two bits of data can be concurrently stored in the memory cell by placing the chalcogenide feature into one of its stable electrical resistance states and by placing the transition metal oxide feature into one of its stable electrical resistance states.

Abstract: A semiconductor apparatus is provided that includes a radiator for efficiently radiating heat generated in a wiring layer used in a surge current path of an electrostatic discharge protection circuit, and also for protecting the wiring layer itself used as the surge current path. The semiconductor apparatus includes an input protection circuit coupled to a wiring provided between an external terminal and an internal circuit, the input protection circuit includes a protection element for protecting the internal circuit from an excessive electrostatic surge input supplied to the external terminal. The semiconductor apparatus further includes a first metal wiring layer coupled to the input protection circuit and included in a current path for the surge electrostatic surge input, and a radiator including a sufficient thermal conductivity material coupled to the first metal wiring layer.

Abstract: Electronic apparatus and methods of forming the electronic apparatus include a HfSiON film on a substrate for use in a variety of electronic systems. The HfSiON film may be structured as one or more monolayers. The HfSiON film may be formed by atomic layer deposition. Electrodes to a dielectric containing a HfSiON may be structured as one or more monolayers of titanium nitride, tantalum, or combinations of titanium nitride and tantalum. The titanium nitride and the tantalum may be formed by atomic layer deposition.

Abstract: In a method for fabricating a semiconductor device, first, a first metal interconnect is formed in an interconnect formation region, and a second metal interconnect is formed in a seal ring region. Subsequently, by chemical mechanical polishing or etching, the upper portions of the first metal interconnect and the second metal interconnect are recessed to form recesses. A second insulating film filling the recesses is then formed above a substrate, and the upper portion of the second insulating film is planarized. Next, a hole and a trench are formed to extend halfway through the second insulating film, and ashing and polymer removal are performed. Subsequently to this, the hole and the trench are allowed to reach the first metal interconnect and the second metal interconnect.

Abstract: Disclosed is a method of fabricating a semiconductor memory device including the step of irradiating ultraviolet rays on a metal interconnection at a bonding pad part, so that the metal interconnection can be prevented from being corroded because of a corrodent element in the process of erasing charges stored in a charge storage part. An oxide coating film is formed on the surface of the metal interconnection at the bonding pad part, and ultraviolet rays are irradiated onto the oxide coating film for erasing of charges from the floating gate.

Abstract: There is provided a connection structure between a Si electrode (Si member) and an Al wire (Al member). Between the Si electrode and the Al wire, a first part and second parts are present in interposed relation. Each of the first and second parts is in contact with the Si electrode and with the Al wire. In the first part, a Si oxide layer and an Al oxide layer are present. The Si oxide layer is in contact with the Si electrode. The Al oxide layer is interposed between the Si oxide layer and the Al wire. In some of the second parts, Al is present. In the others of the second parts, a Si portion and an Al portion are present.

Abstract: A packaging box for accommodating an electronic device is provided. The packaging box includes an outer box, a first wavy plate and a second wavy plate. The first wavy plate is disposed on one side inside the outer box. The first wavy plate has at least an embedding portion for holding a portion of the electronic device. The second wavy plate is disposed on the other side inside the outer box for backing the surface of the electronic device.

Abstract: In a method and system for fabricating a semiconductor device (100) having a package-on-package structure, a bottom laminate substrate (BLS) (130) is formed to include interconnection patterns (IP) (170, 172) coupled to a plurality of conductive bumps (PCB) (130). A top substrate (TS) (140) is formed to mount a top package (110) by forming a polyimide tape (PT) (142) affixed to a metal layer (ML) (144), and a top die (136) attached to the ML (144) on an opposite side as the PT (142). A laminate window frame (LWF) (150), which may be a part of the BLS (130), is fabricated along a periphery of the BLS (130) to form a center cavity (160). The center cavity (160) enclosed by the BLS, the LWF and the TS houses the top die (136) affixed back-to-back to a bottom die (134) that is affixed to the BLS (130). The IP (170, 172) formed in the BLS and the LWS (150) provide the electrical coupling between the ML (144), the top and bottom dies (136, 134), and the PCB (130).

Abstract: A semiconductor structure is provided. In one embodiment, the structure comprises at least one active device located in a substrate and directly under a bond pad. A conductor is located between the bond pad and the substrate. The conductor has a plurality of gaps filled with insulating material. The insulating material is harder than the conductor.

Abstract: A mark-shaped pad. A bonding pad structure with at least one mark-shaped bonding pad comprises: a bottom metal layer disposed over the surface of a rectangular semiconductor substrate to connect the circuit electrically, an inter-metal dielectric layer disposed over the bottom metal layer, metal plugs formed in the inter-metal dielectric layer to connect with the bottom metal layer, a top metal layer disposed over the inter-metal dielectric layer connecting with the metal plugs, and a passivation layer disposed over the top metal layer with openings to expose the top metal layer portions as bonding pads, wherein at least one bonding pad is mark-shaped, e.g. , , or , to indicate the orientation of the bonding pads on the rectangular semiconductor substrate.

Abstract: An integrated circuit package system is provided forming an external interconnect from a padless lead frame, encapsulating a heat sink and the external interconnect, mounting an integrated circuit die on the heat sink, and encapsulating the integrated circuit die, the heat sink, and the external interconnect.

Abstract: A device comprising a planar integrated circuit that includes an array of electrodes and at least one nanostructure, having a major axis, in electrical contact with at least one electrode. The device forms an interface between an integrated circuit platform and electro-physiologically active cells and is used in manipulate the same.

Abstract: A high-reliability power composite integrated semiconductor device uses thick copper electrodes as current collecting electrodes of a power device portion to resist wire resistance needed for reducing ON-resistance. Furthermore, wire bonding connection of the copper electrodes is secured, and also the time-lapse degradation under high temperature which causes diffusion of copper and corrosion- of copper is suppressed. Still furthermore, direct bonding connection can be established to current collecting electrodes in the power device portion, and also established to a bonding pad formed on the control circuit portion in the control circuit portion. A pad area at the device peripheral portion which has been hitherto needed is reduced, so that the area of the device is saved, and the manufacturing cost is reduced.

Abstract: Provided is a printed circuit. The printed circuit includes a base layer, a plurality of bonding pads formed on the base layer, and an insulation barrier formed between the bonding pads. The insulation barrier prevents a short circuit caused by whisker growth on solder portions electrically connecting the bonding pads to bonding portions of an electronic element.

Abstract: Semiconductor devices that provide improved wire-bonding reliability are provided. A semiconductor device includes a substrate, an insulating film, a lower protective film, a plurality of bonding pads, and an upper protective film. The insulating film is formed on the substrate and includes a multilayer wiring structure embedded therein. The lower protective film is formed on the insulating film and has a plurality of lower bonding pad openings that are aligned with an uppermost wiring layer of the multilayer wiring structure and are spaced apart from each other in a first direction. The lower protective film has trenches defined therein between adjacent pairs of the lower bonding pad openings. The plurality of bonding pads are in the lower bonding pad openings, are spaced apart from each other in the first direction, and are connected to the uppermost wiring layer of the multilayer wiring structure.

Abstract: The present invention provides systems and methods for assembling an electronic assembly using an anisotropic conducting membrane (ACM) as a component interconnect and a substrate embossed with placement cavities or a positional fixture to facilitate component placement on the substrate in the electronic assembly. The fixture may comprise multiple layers of interconnects to improve routing density for the electronic assembly enclosed in a housing. An alignment chain may be used to monitor positional and contact integrity of the ACM interfaced components in a complex assembly. The systems and methods allow components to be detached for reuse. Interconnection elements or conduction pathways at the components can be used to interconnect a plurality of neighboring substrates over the ACM layers into a stacked electronic assembly.

Abstract: A semiconductor die having an integrated circuit region formed in a substrate comprises at least one die-corner-circuit-forbidden (DCCF) region disposed in the substrate, proximate to the integrated circuit region; and at least one registration feature formed within the at least one DCCF region. The at least one registration feature comprises a structure selected from the group consisting of a laser fuse mark, an alignment mark, and a monitor mark.

Abstract: A mask for forming polysilicon has a first slit region where a plurality of horizontal slit patterns are arranged in the vertical direction while bearing the same width, a second slit region where a plurality of horizontal slit patterns are arranged in the vertical direction while baring the same width, a third slit region where a plurality of horizontal slit patterns are arranged in the vertical direction while bearing the same width, and a fourth slit region where a plurality of horizontal slit patterns are arranged in the vertical direction while bearing the same width. The slit patterns arranged at the first to fourth slit regions are sequentially enlarged in width in the horizontal direction in multiple proportion to the width d of the slit pattern at the first slit region. The centers of the slit patterns arranged at the first to fourth slit regions in the horizontal direction are placed at the same line.

Abstract: A process is described for preparing aryllithium compounds by reaction of metallic lithium in an ether-containing solvent with an aryl halide, wherein prior to or at the beginning of the reaction a catalyst is added, the catalyst containing a halogen-free, polynuclear aromatic (aryl catalyst) or consisting of such a compound.

Abstract: An improved venturi apparatus for facilitating the mixture of fluid substances. The apparatus preferably comprises a first funnel section operative to receive a fluid and channel the same through a first cylindrical section or passageway. The first cylindrical section is fluidly connected to an intermediate passageway having a diameter larger than the first cylindrical section. At least one sidearm passageway is fluidly connected to the intermediate passageway into which at least one second fluid is introduced. The at least one sidearm passageway is preferably configured to fluidly interconnect with the intermediate passageway at approximately the medial portion of the intermediate passageway. Fluidly connected to the intermediate passageway is a second cylindrical section that is operative to direct the flow of the intermixed fluids to a second exit funnel section.

Abstract: Provided is an exhaust gas treating tower in which exhaust gas flow velocity is increased more than a prior art case so that exhaust gas treating efficiency can be enhanced or the exhaust gas treating tower can be made compact if equivalent performance is to be maintained. Also, an exhaust gas treating tower ensuring a liquid recovery is provided. In an exhaust gas treating tower 10A, liquid columns C are generated and also a liquid drop generating member 20 is provided to thereby generate liquid drops M therearound to be floated. Also, liquid is spouted from spray nozzles to thereby generate liquid films F in area different from the liquid columns C. In an exhaust gas treating tower 110, a liquid drop eliminator 120 is provided upstream of a mist eliminator 118. Interval P1 of collecting plates 121 of the liquid drop eliminator 120 is made larger than interval P2 of collecting plates 119 of the mist eliminator 118.

Abstract: A system and method for providing a vapor are described. In one variation, liquid is placed in a containment vessel, and a pressure in the containment vessel is reduced below atmospheric pressure. The pressure in the vessel is monitored and the liquid is heated in response to the sensed pressure falling below a desired level. When needed, the vapor is delivered from the liquid containment vessel to the external system.

Abstract: A mechanical draft cooling tower includes an air inlet and an air outlet. A liquid spray assembly is provided below the air outlet. A fill shell assembly is provided below the liquid spray assembly such that liquid can be sprayed onto the fill sheet assembly. An indirect heat exchange assembly is mounted beneath the fill sheet assembly. The indirect assembly usually comprises a series of coils through which a fluid to be cooled is circulated. A first air inlet is provided beneath the fill sheet assembly and includes a closing assembly. A second air inlet is provided beneath a top surface of the indirect assembly and includes a closing assembly.

Abstract: The transreflectors may comprise two or more transparent substrates of different indices of refraction bonded together, with a pattern of optical deformities in the mating side of one of the substrates and an inverse pattern of optical deformities in the mating side of an other substrate in mating engagement with each other. The transreflectors are used in a transreflector system or display to transmit more of the light emitted by a backlight or other light source incident on one side of the transreflectors and reflect more of the light incident on the opposite side of the transreflectors.

Abstract: Trace collection system including a conveyer appended to the entrance of the device, protected by a hood, and/or enclosed in a tunnel. The conveyor can perform preliminary checks on the inspected items, and gather information such as weight, dimension, and temperature, that can serve as parameters to a subsequent trace collection process.

Abstract: Improved deep well grounding systems of the kind used for cathodic protection of ground installations according to the invention employ a combination of materials for the casing of the central metallic anode and the backfill in the well which exhibit a degree of permeability sufficient to allow by-product gases develop in ordinary use of this system to escape, avoiding unwanted cavitation, while minimizing the migration of ground water and the attendant undesirable environmental pollution.

Abstract: Techniques for generating a stable, force-resisting positive or negative representation of a shape. A state-changeable mixture includes uniform, generally ordered, closely-spaced solid bodies and a liquid carrier medium, with the liquid filling any voids or interstices between the bodies and excluding air or gas bubbles from the mixture. Within the mixture, the solid bodies can be caused to transition from a near-liquid or fluent condition of mobility to a stable, force-resisting condition. To create mobility, a small excess quantity or transition liquid is introduced to create a fluent condition by providing a slight clearance between the bodies which permits the gently-forced introduction of at least two simultaneous slip planes between ordered bulk masses of the bodies at any point in the mixture. Transition to the stable condition is caused by extraction of the transition liquid, removing the clearance between bodies and causing them to make stable, consolidated contact.

Abstract: A multi-layered blown film forming apparatus contains an adapter provided to supply a multiple types of resins, a forming die provided on a downstream side in an axial direction of the adapter, and a temperature controller mechanism. Molten resins of multiple types are individually fed to the forming die through the adapter. The forming die contains a main body, a multi-layer structure of a plurality of single-layer thin film dies disposed in an inner portion of the main body in an axial direction to produce a plurality of resin thin films corresponding to the molten resins of the multiple types, and a first annular path formed between main body and the multi-layer structure. A multi-layered thin film in which the plurality of resin thin films are overlaid is passed through the first annular path and is outputted as a multi-layered thin annular film. The temperature controller mechanism controls individual temperatures of the plurality of single-layer thin film forming dies independently.

Abstract: The present invention relates to methods of making and using composites and scaffolds as implantable devices useful for tissue repair, guided tissue regeneration, and tissue engineering. In particular, the present invention relates to methods of making and using compression molded resorbable thermoplastic polymer composites which can be subsequently processed with non-organic solvents to create porous, resorbable thermoplastic polymer scaffolds or composite scaffold with interconnected porosity. Furthermore, these composites or scaffolds can be coated with an organic and/or inorganic material.

Abstract: A method is described, according to which open-pored components may be produced having a defined pore size, a defined external skin thickness, and a low density. A fine carrier material, is shaped with the aid of a binder into balls (1) which are as uniform as possible according to a shaping method, the prefinished balls (1) are wetted or coated using the same or also a different binding medium and poured in this way into the desired external mold and caused to stick and/or form binder bridges (2) at the contact points by a curing method. The balls (1) connected to one another are removed from their mold and placed into the desired mold, after which the cavities (3) between the balls (1) are filled with metal, plastic, or ceramic. After solidification, all of the ball material may be removed and/or washed out by vibration and/or by washing using water.

Abstract: A foaming molten resin containing reinforcement fibers and super critical fluid is injected into a cavity with a short shot (a), the foaming molten resin is made self-foam and flow in the cavity (b), and a volume of the cavity is increased by expanding molds so as to expand the foaming molten resin in the cavity (c). During the expansion step (c), the expansion of the foaming molten resin is assisted by gas vent, vacuum suction, partial pressure adding with gas or resin, or a spring back force of the reinforcement fiber in the foaming molten resin. Accordingly, there can be provided a resin foam molded article that has no improperly large air voids therein, a sufficient volume expansion thereof, and a superior transferability function.

Abstract: Strands of molten polyethylene terephthalate (PET) from a PET polycondensation reactor are solidified, pelletized, and cooled only to a temperature in the range of 50° C. to a temperature near the polymer Tg by contact with water. The still hot pellets are conveyed, optionally followed by drying to remove water, to a PET crystallizer. By avoiding cooling the amorphous pellets to room temperature with water and cool air, significant savings of energy are realized.

Abstract: A method of making a barbed suture by varying the blade geometry and/or the movement of the blade when cutting a suture is disclosed. The method can also be accomplished with a cutting device to create a plurality of barbs on the exterior of surgical suture. The barbs produced using the method with the cutting device can be the same or random configurations.

Abstract: The present invention provides for concentrated aqueous silk fibroin solutions and an all-aqueous mode for preparation of concentrated aqueous fibroin solutions that avoids the use of organic solvents, direct additives, or harsh chemicals. The invention further provides for the use of these solutions in production of materials, e.g., fibers, films, foams, meshes, scaffolds and hydrogels.

Abstract: An ultra-wide, anti-slippery rubber sheet used for vehicle flooring, and a method of fabricating and shaping the same. A mixed material made of a rubber raw material is extruded and roll pressed with a predetermined width and thickness. The extruded and shaped material is then mold pressed by a pattern mold and vulcanized. A molding machine having a screw extruder, a rolling pressing machine, and vulcanizer is used for manufacturing the ultra-side rubber sheet.

Abstract: The present invention provides a method for manufacturing a mold to be used in creating cast polymer products such as cultured marble and cultured granite, particularly used as walls surrounding bathroom showers and bathtubs, but applicable to many other industries as well, using original natural stone materials to make the mold. The method of manufacturing the hardened mold resembling the appearance of natural stonework for use in constructing panels of molded cast polymer is comprised of arranging natural stonework material in a predetermined pattern and securing the natural stonework material to a backing to hold the stonework material in the predetermined pattern and applying material between a plurality of edges of the natural stonework material to simulate a texture to a plurality of stone gaps surrounding the natural stonework material. The method may additionally include the application of various layers of sealant, gel-coat, skim-coat, fiberglass, and resin.

Abstract: The invention relates to a method for the production of individual components made from materials which change state from a liquid to solid or a particulate to bonded state during the method. A mold and elastic balloons, which may be placed in the mold under pressure, are used for the method. Either gas or liquid or the liquid material of the component for production, which may later be hardened, are filled in the balloons.

Abstract: A process for the production of a crank lever for a bicycle is provided. The process includes providing moulding equipment including two mobile half-moulds which move between an open position and a closed position. The moulding equipment when in the closed position defines a moulding cavity having a shape corresponding to that of the crank lever to be produced. The process further includes providing, inside said moulding cavity, at least one insert and introducing into the moulding equipment, when in the open position, a pre-set quantity of fibre-reinforced mouldable thermosetting material in a plastic state. The process also includes closing the moulding equipment and applying to the thermosetting material a pressure via the surfaces of said moulding cavity so as to cause the material in the plastic state to flow into the moulding cavity around, and at least partially covering the at least one insert, filling the moulding cavity and heating the thermosetting material up to a thermosetting temperature.

Abstract: A bicycle wheel rim and a method of making a bicycle wheel rim are provided. The rim provided is made of a single part using structural fiber based material, preferably carbon fiber material, with two circumferential wings for anchoring the tire, which extend radially outwards from the two sides of the outer peripheral wall of the rim.

Abstract: A pasting method and a pasting apparatus hold a thin plate 1 and a planar member 2 in high flatness respectively on a first holding member 44 and a second holding member 44, a main controller 40a controls a moving mechanism 45 and a parallelism adjusting mechanism 52 on the basis of information provided by position recognizing mechanisms 33 and 34 to align the thin plate 1 and the carrying member 2 with each other in a predetermined positional relation. The main controller 40a controls a moving mechanism 45 so as to move the thin plate 1 and the carrying member 2 relative to each other in a state where a liquid-phase liquid crystal wax heated by a heater 49 is held between the thin plate 1 and the carrying member 2 to spread the liquid-phase liquid crystal wax over the entire surfaces of the thin plate 1 and the carrying member 2.

Abstract: A sensor assembly includes a Hall-effect sensor and an integrated circuit that are encapsulated with an encapsulating material. The Hall-effect sensor and integrated circuit are held in place during filling of the cavity by a retractable slide. Once the cavity is filled such that the encapsulating material can support the internal components in a desired position, the retractable slide is removed from the cavity.

Abstract: A multiple line embossing apparatus that is configured to emboss characters on a document, for example a card, on a line-by-line basis. The embossing apparatus uses guides that guide the card, and a tab belt that indexes the card along a card path. A second tab on the belt is provided to move the card in a reverse direction to start a new line of embossing. The guides and the tab belt move are able to move perpendicular to the card path to move the card to a new line of embossing.

Abstract: An object is to provide a mold-supporting apparatus whose mold-mounting surface does not deform, irrespective of whether a mold is large or small, so that a uniform surface pressure is produced, and which can be readily produced by means of casting. The mold-supporting apparatus includes a mold-mounting portion having a mold-mounting surface to which a mold is mounted; and a rear surface portion having reaction-force-receiving portions at corners thereof, the reaction-force-receiving portions receiving reaction force from a reaction force applying member, wherein a central region of the mold-mounting portion and a central region of the rear surface portion are connected together by means of a central connection member, and an outer peripheral portion of the mold-mounting portion and an outer peripheral portion of the rear surface portion are connected together by means of an outer peripheral portion connection member.

Abstract: In a method of compression molding thermoplastic material, a compression gap is set between half-molds of a mold having fixed and movable platens for respective attachment of the half-molds. After setting the compression gap, the mold is closed and the platens are locked by moving locking elements into respective receiving elements. Injection of plasticized material then commences into a cavity formed between the half-molds when the mold is closed. The mold then opens as a result of pressure generated by the injected plasticized material until a distance between the half-molds corresponds to the compression gap. Subsequently, the mold undergoes a closing movement through application of a clamping force, thereby compressing the plasticized material.

Abstract: A method of manufacturing and installing cement-based concrete tiles, composed of portland cement, polymer-modified cement admixtures, sand, additional ingredients and color pigments integrated with reinforcement mesh for support and strength. The cement-based concrete mix may be dispersed and formed into a single layer cement-based concrete slab configuration with the reinforcement mesh completely embedded within. The cement-based concrete mix is distributed to achieve the desired texture, thickness and finish to form the cement-based concrete slab. After curing, any desired custom designs, engravings, additional colorations and wearing surface sealers are added to render the designs an embodiment of the cement-based concrete slab and thus an embodiment of the cement-based concrete tiles. The concrete slab is then cut into concrete tiles of custom dimensions. The cement-based concrete tiles are identified in sequential order to establish correct placement during the installation process.