Abstract: An electrostatic discharge protection structure of an electronic device is disclosed. The electronic device includes an electrically insulating panel and an electrically insulating operation member fitted with respect to an opening of the panel. The operation member includes an operation member main body, a flange extending from the operation member main body, and a groove formed along a peripheral surface of the operation member main body in a face of the flange opposing the panel. The panel includes an enclosing rib along the edge of the opening on a back face thereof. The operation member is configured such that the operation member main body is fitted with respect to the inner side of the enclosing rib of the panel, and the groove is fitted with respect to the enclosing rib of the panel.

Abstract: Semiconductor device having an amplifier. In one embodiment, the amplifier includes a first amplifier path including a first input and a second amplifier path including a second input. An inductance having a connectable node is connected between the first and second inputs, the connectable node being symmetrically connected between the first and second inputs. At least one ESD protection structure is connected to the connectable node. In one embodiment, the semiconductor device is used in a communications device.

Abstract: A coil load drive circuit drives an end of a coil load through an output terminal at the midpoint between a power supply side drive transistor and a ground side drive transistor provided in series between a power supply voltage and a ground potential, and turns off any of the drive transistors when an overcurrent flows therethrough. The coil load drive circuit includes an overcurrent detection transistor receiving a control voltage of the power supply side drive transistor or a control voltage of the ground side drive transistor, a constant current source supplying a constant current to the overcurrent detection transistor to generate a reference voltage, and an overcurrent detection comparator comparing a voltage of the output terminal with the reference voltage to detect an overcurrent.

Abstract: Certain exemplary embodiments comprise an electrical bypass conductor adapted for installation in a circuit breaker. The electrical bypass conductor can be adapted to be operatively electrically coupled to a load side of the circuit breaker. The electrical bypass conductor adapted to transfer electrical energy from a source of electrical power to the load side of the circuit breaker during a short circuit event.

Abstract: In a current limiter for limiting currents in case of a fault including an additional device comprising an additional electric valve connected in series and being conductive in the same direction as the associated main valve, two series-connected valve branches arranged in opposition bypass two series connected current limiting inductors and both additional valves are bypassed by a similar passively complex connection for limiting current in the case of a fault, wherein the current limiter is not noticeable during normal operation, but, in the event of a fault, effectively limits the short circuit to a predetermined extent.

Abstract: A protection device protecting a load circuit by shutting off a power thereof depending on an estimated present temperature of a wire provided in the load circuit to connect a load. The protection device has a first temperature estimation device estimating a rising temperature of a conductor including the wire based on both a current in the conductor and thermal properties of the conductor, a second temperature estimation device estimating a falling temperature of the conductor based on the thermal properties, a third temperature estimation device estimating an arc-induced rising temperature of the conductor when arcing occurs in the conductor, and a fourth temperature estimation device estimating the present temperature of the conductor deduced from the above estimated temperatures. If the estimated temperature exceeds a predetermined allowable temperature, the protection device shut off the power of the load circuit.

Abstract: The invention concerns a motor starter circuit for an induction motor, particularly a single-phase AC induction motor, with a main winding (4) and an auxiliary winding (5) supplied with current, particularly AC, via current supply connections (24, 25), and with a starter switch arrangement (15), which serves the purpose of interrupting the current flow through the auxiliary winding (5) after the start of the motor, the starter switch arrangement (15) interacting with a measuring arrangement serving the purpose of measuring the voltage across the auxiliary winding (5).

Abstract: A circuit device and method for protecting EMC components from fault conditions that may negatively affect the components, such as high power dissipation in EMC components when/if the boost stage stops working or malfunctions and preventing smoke and fire in case the boost stage switching device fails, shorts, or is defective. The device is designed so that the chopper stage (following the boost stage) is latched off if/whenever the boost stage stops working. According to the methods of the invention, whenever such a fault occurs at the boost stage, the circuit immediately disables the stage that provides power to the output load (i.e., load-power-supply stage). This disabling of the load-power-supply stage then prevents very high currents from flowing through the EMC components and thus protects the EMC components from overheating and/or causing a fire or smoke.

Abstract: An aircraft device power supply is capable of connecting to either an AC or a DC power bus provided on an aircraft. When connected to an aircraft's AC power bus, an AC power signal is EMI-filtered, stepped down in voltage to the same voltage as that of the DC power bus, and then rectified. When connected to an aircraft's DC power bus, a DC power signal is EMI-filtered before it is merged with the rectified AC power signal via an AC/DC switchover subcircuit. The output of the AC/DC switchover subcircuit is input to a power factor correction subcircuit which outputs a boosted DC voltage, regardless of which of the AC or DC aircraft power buses is connected to the power supply. A step down converter reduces the boosted DC voltage to a lower, system voltage which may then be further reduced or modified, as appropriate for device to be powered.

Abstract: The invention relates to an automatically quenching surge arrester arrangement with a surge arrester, which, on exceeding a given first voltage, transforms from a non-conducting into a conducting state and returns to the non-conducting state only when a much smaller second voltage is dropped below and with a switch mechanism reacting to current flow through the surge arrester, interrupting the current flow through the surge arrester and then automatically returning to the rest condition thereof. A simple, robust and compact assembly suitable for HF applications for such a surge arrester arrangement is achieved, whereby the switch mechanism reacts reversibly to the heat generated in the surge arrester by the current flow.

Abstract: In some embodiments, an apparatus includes a power supply to generate a supply current; at least one optoisolator coupled to the power supply and responsive to the supply current to generate a charging current; a capacitor, coupled to the at least one optoisolator, to build up a charge in response to the charging current; and an actuating switch, coupled to the capacitor, to release the charge from the capacitor to generate a relay actuating current.

Abstract: The invention provides an electrostatic chuck in which a workpiece-chucking surface is made flat.

Abstract: An electrostatic chuck comprises an insulating layer with an electrode embedded therein and having a surface to come in contact with a workpiece to be held. Formed on the insulating layer surface is a silicone rubber layer which is filled with reinforcing silica, but free of another filler having an average particle size of at least 0.5 ?m. The ESC allows for an intimate contact with a wafer and has an improved cooling capacity.

Abstract: A ceramic capacitor is disclosed. The capacitor comprises a plurality of base metal inner electrode layers, a plurality of ceramic dielectric layers between the inner electrode layers, and external electrodes in electrical conductivity with the inner electrode layers. At least one secondary component having an intentionally added chemistry is dispersed in the inner electrode layers and/or the dielectric layers. The chemistry evolves an oxidizing species in a controlled manner, such that it offsets localized highly reducing atmospheres that are present when the capacitor is fired in a reducing atmosphere, thereby promoting enhanced electrode connectivity in thin layer base metal multilayer capacitors.

Abstract: The present invention provides an electric double layer capacitor. An electric double layer capacitor element sandwiches a separator between a cathode and an anode, arranged inside a container comprising a concave shaped containing portion and lid. A first conductive layer on the inner bottom face of a containing portion is covered by an insulating layer, and opening portions formed on the insulating layer penetrate to the first conductive layer. A second conductive layer is formed on the insulating layer and inside the opening portions, and is connected to a cathode through a conductive adhesive. The first conductive layer penetrates through the side wall of the containing portion, and is connected to a connecting terminal. An anode is connected to a third conductive layer through a conductive adhesive, and a collector is connected to a connecting terminal by extending between the containing portion and the lid.

Abstract: An array capacitor is described for use with an integrated circuit (IC) mounted on an IC package. The array capacitor includes a number of first conductive layers interleaved with a number of second conductive layers and a number of dielectric layers separating adjacent conductive layers. The array capacitor further includes a number of first conductive vias to electrically connect the first conductive layers and a number of second conductive vias to electrically connect the second conductive layers. The array capacitor is provided with openings which are configured to enable pins from an IC package to pass through.

Abstract: An electronic component such as a capacitor includes a substrate having first and second principal surfaces, a dielectric layer overlaying the first principal surface of the substrate, a first electrode, and a second electrode. There is a passivation layer overlaying the first and second electrodes, a first opening being formed in the passivation layer over the first electrode and a second opening being formed in the passivation layer over the second electrode. A first bottom electrode termination is positioned in the first opening and a second bottom electrode termination is positioned in the second opening. The first bottom electrode termination is electrically connected to the first electrode and the second bottom electrode termination is electrically connected to the second electrode. A standoff is positioned between the first bottom electrode termination and the second bottom electrode termination and attached to the passivation layer to thereby provide support for the electronic component when mounted.

Abstract: The invention is to provide an electronic component which can obtain the capacitance value of a capacitor element highly precisely. An electronic component has a lower conductor (first conductor) which is formed on a planarized layer of a substrate, a dielectric film which is formed on the lower conductor, and an upper conductor (second conductor) which is formed on the dielectric film and thinner than the lower conductor. A capacitor element (capacitative element) is configured of the lower conductor, the dielectric film and the upper conductor.

Abstract: A barium calcium titanate of the present invention has a remarkable effect that a fine barium calcium titanate powder having excellent dispersibility, reduced impurities and high crystallinity and being solid-dissolved at an arbitrary ratio, and a production process thereof are provided. The barium calcium titanate represented by the compositional formula: (Ba(1-X)CaX)YTiO3 (wherein 0<X<0.2 and 0.98?Y?1.02), which contains 3 mol % or less (including 0 mol %) of an orthorhombic perovskite compound and in which the specific surface area D is from 1 to 100 m2/g.

Abstract: A capacitor device has a plurality of capacitors, each comprising a capacitor element having a positive electrode and a negative electrode in a confronting arrangement through a separator, and a metal case encasing the capacitor element and an electrolyte. The plurality of capacitors comprise a plurality of first capacitors, each using the metal case as a negative electrode, and a plurality of second capacitors, each using the metal case as a positive electrode. The capacitor device is characterized by a structure that a pair of the first capacitor and the second capacitor form a capacitor unit by having their metal cases coupled with a metal plate, a plurality of capacitor units form a subunit by being connected in series or parallel, and a plurality of subunits form a main unit by being connected in series or parallel. The invention helps facilitate connections when coupling the plurality of capacitor units, and substantially reduces a space required for the connections.

Abstract: An integrated capacitor assembly that offers improved performance characteristics in a convenient and space-saving package is provided. More specifically, the capacitor assembly contains a first solid electrolytic capacitor element and second solid electrolytic capacitor element positioned adjacent to the first solid electrolytic capacitor element. The first and second solid electrolytic capacitor elements each contain an anode formed from a valve metal composition having a specific charge of about 70,000 ?F*V/g or more, the anode having a thickness of from about 0.1 to about 4 millimeters. A thermally conductive material is positioned between the first and second solid electrolytic capacitor elements and electrically connected thereto. The thermally conductive material has a coefficient of thermal conductivity of about 100 W/m-K or more at a temperature of 20° C. A case encapsulates the first and second solid electrolytic capacitor elements.

Abstract: According to one embodiment, a printed circuit board includes an insulating substrate, a plurality of lands formed on the insulating substrate, a conductive wiring pattern coupled to the lands, a protective film covering the insulating substrate and having an opening larger than the outer profile of each of the lands, a plurality of bumps bonded to the lands and a circuit component electrically connected to the lands via the bumps. Each land has a land body having a gap along an opening rim of the opening, and an extension part extending from a part of the land body to the opening rim of the opening.

Abstract: An electronics system for furniture includes at least one accessory module. A hand control module is operable to receive a plurality of face plates. Each of the plurality of face plates includes at least one interface device that controls the at least one accessory module. The hand control module outputs a control signal based in part on which of the plurality of face plates is connected to the hand control module. A control module is operable to connect to a plurality of accessory modules, receives the control signal, and outputs an accessory control signal to the at least one accessory module based on the control signal and based on which of the plurality of accessory modules is connected to the control module.

Abstract: A mounting apparatus includes a bezel, a first fixing bracket mounted to the bezel for fixing a side of an LCD panel, a second fixing bracket mounted to the bezel, a pair of sliding members slidable with respect to the second fixing bracket for fixing an opposite side of the LCD panel, and a cover mounted to the bezel for enclosing the LCD panel.

Abstract: A panel display includes a display panel, a T-shaped structure, and a base. The display panel is supported by the T-shaped structure, and the T-shaped structure is borne onto the base. The T-shaped structure includes a holding portion, an arm portion, and a slab portion. The holding portion, located on the arm portion, is used for holding the display panel. The slab portion is located below the arm portion. The base is formed with a guiding chute for receiving a portion of the arm portion and the slab portion to permit sliding of the T-shaped structure along a longitudinal direction of the guiding chute for changing the distance between the display panel and the base.

Abstract: The present invention relates to a computer device, allowing different direct current output power sources from the computer power supplies to be connected to a computer panel, housing or hard disk rack so as to provide or make use of power for external computer peripherals.

Abstract: A computer system may include a keyboard housing that is capable of being moved at least partially into or out of a chassis. The chassis is associated with a transducer and an air chamber. Movement of the keyboard housing may cause size of the air chamber to be adjusted. When the size of the air chamber is increased, the transducer becomes more sensitive to sound in lower frequency ranges.

Abstract: A host unit case with foldable front and rear walls and lower cover for a computer includes a front wall, a rear wall, an upper cover and a lower cover. The lower end of the front wall connects with the front end of the lower cover. The lower end of rear wall pivotally connects with the rear end of the lower cover. Hence, the lower cover, the front wall and the rear wall are unfolded to allow the lower cover engaging with upper end of the front wall and upper end of the rear wall for the host unit case being set up as a complete form quickly and being folded parts thereof to reduce the volume thereof conveniently.

Abstract: A host unit case for a computer with foldable holding posts at front and rear walls thereof provides an upper cover and a lower cover to pivotally connect with a front wall, a rear wall, first holding posts, second holding posts, third holding posts and fourth holding posts respectively as a main structure. The main structure is extended to form a firm structure such that the host unit case is capable of being set up conveniently and quickly and is folded conveniently to reduce the volume thereof during being packaged.

Abstract: A foldable host unit case for a computer with joint mechanisms includes four holding posts and the upper ends of the holding posts connect with a neighboring holding post with first foldable connecting rods and second foldable connecting rods respectively. The lower ends of the holding posts are joined to four ends of a cross connecting rod set such that the holding posts are capable of being extended to constitute a firm structure. Hence, the host unit case is capable of being extended conveniently and quickly and being folded conveniently to reduce the volume thereof during being packaged.

Abstract: A disk drive test apparatus has a plurality of bays each for receiving a respective disk drive to be tested. A plurality of card slots are provided each for receiving a test card via which a disk drive can be tested. Each of the test cards is either an environment test card or an interface test card. The card slots and the test cards are arranged such that each card slot (6) can selectively receive an environment test card or an interface test card. Other arrangements for disk drive test apparatus or disk drive mounting apparatus are disclosed.

Abstract: A subsea docking unit 2 including an electronic module for being removably connected to a subsea docking station 1 comprises a canister B containing electronics to be connected to the docking station, and a selectively, engageable locking device for locking the docking unit to the docking station. The locking device comprises one or more arm structures adapted for being pivotally mounted into a corresponding arm holding detail on said docking unit, and an actuator means for moving said arm structure in relation to one or more corresponding arm receiving and retaining details on said docking station, whereby a releasable locking engagement and disengagement of the docking unit and docking station is obtained. The docking station correspondingly comprises arm receiving and retaining detail adapted for receiving and retaining a docking unit. The docking unit and docking station are parts of a multiphase flow meter.

Abstract: A framework structure for a computer main frame, comprises an outer frame and an inner frame in which the inner frame is combined with an inner portion of the outer frame. A rear end of a first plate is pivotally connected to a bottom of the inner frame, and a front end of the first plate is combined with a downside of a bottom of the inner frame and positioned on a downside of a first hole of the inner frame. A hard drive can be locked on an upside of the first plate. Bottom ends of a plurality of shafts are respectively combined with the inner frame so as to use upper ends of the shafts to combine with a motherboard to allow the hard drive to be positioned below the motherboard.

Abstract: A heat dissipation device includes a heat sink having a heat conducting core and a plurality of fins extending from the core. The core has a downward extension portion extending away the fins for contacting a heat generating device. A locking device includes a locking plate defining a central opening accommodating the extension portion of the core of the heat sink therein and has a plurality of locking arms extending from the locking plate. Pluralities of cutouts circumferentially surrounding and communicating with the opening are defined in the locking plate. The extension portion of the core of the heat sink is punched to press the locking plate of the locking device toward the heat sink and have portions thereof engaged in the cutouts of the locking plate of the locking device, whereby the locking device is stably fixed to the heat sink.

Abstract: A heat sink comprising an open frame including air inlets on a top side and a rotatable fan having a plurality of blades is provided. The heat sink is installed in the frame. The frame has pluralities of supporting elements and ribs positioned between two adjacent supporting elements. The supporting elements and ribs correspond to each other to form multiple side air inlets. The operation of the fan is capable of drawing a large volume of the air into the open frame via the top side and side air inlets. The flange of the blades is parallel to the inner curved side of the ribs when the blades pass by the ribs so that a large volume of air is guided into the frame to enhance the heat dissipation effect. This may also maintain an optimum static pressure and substantially reduce the noise level during the operation of the fan.

Abstract: A cooling system has one or more fans disposed within a housing adapted to attach to a consumer electronics device. The cooling system can also include a switch, a male connector and a female connector adapted to interface with the consumer electronics device and a power supply of the consumer electronics device. The cooling system may have a pass-through design, in which it receives power from the power supply of the consumer electronics device, taps into the power for its own operation, and passes the power onto the consumer electronics device, and/or it receives power from the consumer electronics device, taps into the power, and passes the power on to another device. The cooling system can also include one or more battery chargers attached to the housing for charging batteries related to the consumer electronics device.

Abstract: A cooling system has one or more fans disposed within a housing adapted to attach to a consumer electronics device. The cooling system can also include a switch, a male connector and a female connector adapted to interface with the consumer electronics device and a power supply of the consumer electronics device. The cooling system may have a pass-through design, in which it receives power from the power supply of the consumer electronics device, taps into the power for its own operation, and passes the power onto the consumer electronics device, and/or it receives power from the consumer electronics device, taps into the power, and passes the power on to another device. The cooling system can also include one or more battery chargers attached to the housing for charging batteries related to the consumer electronics device.

Abstract: Water paths for feeding a coolant water through a power converter mounted on an automobile are arranged in parallel, openings are formed on the water paths respectively, heat radiating fins project from the openings, and the openings are closed by a base plate of the power module. Further, the base plate of the power module includes a metal in addition to copper to increase a hardness of the base plate, so that a deterioration of the flatness during fixing the fins with brazing is restrained.

Abstract: This invention relates to arrangements for attaching a heat sink to an integrated circuit package. The heat sink comprises magnetic material, magnetized in one polarity, and the circuit package comprises magnetic material either unmagnetized or magnetized in the opposite polarity. When the heat sink and circuit package are placed in contact with one another, they are attracted magnetically. This forms a bond for attaching the heat sink to the integrated circuit package. Advantageously, this arrangement for attracting a heat sink avoids distorting or otherwise damaging the circuit package and speeds assembly time.

Abstract: A lamp base assembly with electronic ballast for energy-saving lamp includes a housing (22), a lamp cap (21) and an electronic ballast (24) with transistors (23) provided within the housing. A transistor heat-diffusing element surrounding each transistor is provided within the lamp base, for enhancing the heat transfer from the transistors to the housing or the lamp cap, so that the heat generated from the transistors could be transferred out of the lamp base assembly. Thus, the heat-diffusing ability of the transistors is improved, and the working temperature of the transistors could be kept within a safe scope, so that the lifetime of the energy-saving lamp is guaranteed.

Abstract: The present invention discloses a heat dissipater for a chamber comprising a substantially transparent substrate, a first substantially transparent conductive pattern formed over the substrate. At least one Peltier device is formed on the first substantially transparent conductive pattern. A second substantially transparent conductive pattern is then formed on the Peltier device, wherein electricity is applied to the Peltier device, current drives a heat transfer from inside of the chamber to outside.

Abstract: A heat sink and light pipe assembly is provided for an electronic module configured to be mounted on a circuit board. The assembly includes a bracket configured to be held proximate the electronic module. The bracket includes a light pipe mounting post and the bracket defines an opening therein. A heat sink includes a base having a portion configured to extend through the opening in the bracket to engage the electronic module. A light pipe is held in the light pipe mounting post. The light pipe is configured to convey a status of the electronic module.

Abstract: A wedgelock device is provided that comprises a shaft, and a plurality of thermally conductive wedge segments mounted on the shaft. The wedgelock device has at least one wedge segment that is configured to move at an acute angle with respect to another wedge segment to secure a printed wiring board in the slot of a heat sink chassis. The wedgelock device provides improved thermal performance by creating additional thermal paths from the printed wiring board to the heat sink chassis.

Abstract: An electronic device includes a printed circuit board having a wall deposited directly on a board serving as a base for a printed circuit. As the board is constructed, the wall is deposited on the board for controlling airflow. The wall controls airflow across the board and around components mounted to the board. The wall may be utilized for controlling airflow in combination with a second printed circuit board positioned adjacent to the first printed circuit board. The wall may be utilized for controlling various types of airflow, including airflow from sources including fans and convection, and from geometries including horizontal and vertical mounting geometries. The silicon wall may be utilized for preventing heat airflow generated by heat radiated from one component from impinging upon another component.

Abstract: A host unit case of a computer capable of being set up easily with detachable plate-shaped components includes an upper cover, a lower cover, a front wall, a rear wall, a main board support wall, a first support frame, a second support frame, a connecting plate, a third support frame, a left side plate, a right side plate and a panel. The host unit case is easy to be disassembled as pieces of plates for the smallest volume can be reached at the time of being packaged such that space occupied by the stacked components can be reduced tremendously for saving storage space and lower delivery cost.

Abstract: A circuit board assembly includes a mother board and a daughter board. The daughter board is defined by a plurality of frangible connections to the mother board and is disposed on a common plane with the mother board. After all the electronic devices are installed to the mother board and the daughter board on a common plane the frangible connections are broken to allow the daughter board to be moved to a desired position relative to the mother board. The electrical conductors that connect the daughter board to the mother board are semi-rigid to provide movement while maintaining a desired position of the daughter board relative to the mother board.

Abstract: Motion sensor apparatus includes opposing motion detector assemblies that include rolling ball electrical connectors oriented to operate when the device is inverted.

Abstract: An electrical card (100) includes an insulative frame (1) having a pair of detachable side bars (112) spaced from each other and a transverse bar (116) assembled onto the side bars to interconnect the side bars; a detachable upper cover (12) attached to a rear end of the frame; an upper shell (2) and a lower shell (3) mounted to an upper side and a lower side of the side bars respectively; a detachable lower cover (4) attached to the lower shell and disposed beneath the upper cover; a circuit board (5) supported by the frame and located between the frame and the upper shell; and an electrical connector (6) attached to a front end of the frame and electrically connected to the circuit board.

Abstract: A system and method for installing and retaining an input/output connector without tools is presented. A user removes a module from a computer system in order to add or remove a transceiver. The module includes a housing and a front bezel, whereby a bezel latch attaches the front bezel to the housing. The user depresses the bezel latch to remove the front bezel from the housing. As a result, a retention beam is exposed on the housing that secures transceivers to a circuit board. The user unlatches the retention beam, inserts a transceiver onto a mounting area, and latches the retention beam. The retention beam applies pressure to the transceiver, which results in a coupling of the transceiver to a circuit board included in the housing. In turn, the user attaches the front bezel to the housing via the bezel latch and reinserts the module into the computer system.

Abstract: A wired circuit board has a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer and including at least one pair of wires arranged in mutually spaced-apart and opposed relation having different potentials, a semiconductive layer formed on the insulating base layer to cover the conductive pattern and electrically connected to the metal supporting board on one side outside a region where the pair of wires are opposed, and an insulating cover layer formed on the semiconductive layer.